Patents by Inventor Satoru Hirayama

Satoru Hirayama has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11929234
    Abstract: A plasma processing apparatus capable of improving the in-plane uniformity of plasma and a lower stage used for the plasma processing apparatus are anticipated. In an exemplary embodiment, the lower stage is for a lower stage that generates plasma with an upper electrode. The lower stage includes: a lower dielectric body formed of ceramic, a lower electrode embedded in the lower dielectric body, and a heating element embedded in the lower dielectric body. The separation distance between the top surface of the lower dielectric body at the outer edge position thereof and the lower electrode is smaller than the separation distance between the top surface of the lower dielectric body in the central region thereof and the lower electrode. The lower electrode has an inclination region inclined with respect to the top surface between the outer edge position and the central region.
    Type: Grant
    Filed: November 26, 2019
    Date of Patent: March 12, 2024
    Assignees: TOKYO ELECTRON LIMITED, TOHOKU UNIVERSITY
    Inventors: Taro Ikeda, Sumi Tanaka, Satoru Kawakami, Masaki Hirayama
  • Patent number: 11923170
    Abstract: The plasma processing apparatus according to an exemplary embodiment includes a processing container, a stage, an upper electrode, a dielectric plate, and a waveguide. The stage is provided in the processing container. The dielectric plate is provided above the stage with a space in the processing container interposed therebetween. The upper electrode is provided above the dielectric plate. The waveguide has an end and guides high frequency waves in a VHF band or a UHF band. The end is arranged to face the space to radiate high frequency waves to the space. The dielectric plate includes a conductive film. The conductive film is provided on an upper surface of the dielectric plate. The upper surface faces the upper electrode. The conductive film is electrically connected to the upper electrode.
    Type: Grant
    Filed: November 26, 2019
    Date of Patent: March 5, 2024
    Assignee: TOKYO ELECTRON LIMITED
    Inventors: Satoru Kawakami, Hiroyuki Yamamoto, Taro Ikeda, Masaki Hirayama
  • Patent number: 5906755
    Abstract: The spot welding electrodes are driven by the servomotor (30) so as to be moved to and pressured against a work surface. The welding pressure controller (27) detects welding pressure corresponding to current flowing through the servomotor (30) via a driver (26) and controls the welding pressure so as to be changed according to the set welding pressure condition. The welding current flowing through the spot welding electrodes is controlled by the welding current controller (28). The welding current controller (28) and the welding pressure controller (27) are both controlled synchronously by the robot CPU (20) via the system bus (21). The robot CPU (20) controls the welding pressure and the welding current on the basis of the welding condition data (22) stored in a memory, so as to be changed in synchronism with each other at a plurality of welding stages, respectively.
    Type: Grant
    Filed: June 10, 1997
    Date of Patent: May 25, 1999
    Assignees: Kawasaki Jukogyo Kabushiki Kaisha, Toyota Jidosha Kabushiki Kaisha
    Inventors: Hitoshi Arasuna, Satoru Hirayama, Kazutsugu Suita, Yoshitaka Sakamoto, Seiji Suzuki
  • Patent number: 5869799
    Abstract: Positions where the pair of electrode chips are in contact with each other are regarded as reference positions. Desired starting positions where the tips of the pair of electrodes are slightly apart from the surfaces of a workpiece are determined on the basis of the reference positions X taking into consideration the thickness d of the workpiece. The electrode chips are moved to the desired starting position. The electrode chips are moved at a predetermined low speed until contact positions where the electrode chips come into contact with the workpiece (20). The electrode chips are then moved at a predetermined speed from the contact positions to overshot positions where the workpiece is compressed between the electrode chips.
    Type: Grant
    Filed: May 29, 1997
    Date of Patent: February 9, 1999
    Assignees: Kawasaki Jukogyo Kabushiki Kaisha, Toyota Jidosha Kabushiki
    Inventors: Hitoshi Arasuna, Satoru Hirayama, Kazutsugu Suita, Seiji Suzuki, Yoshitaka Sakamoto
  • Patent number: 5113392
    Abstract: In a network having a plurality of node apparatus connected to a transmission line, each node apparatus segmenting a transmission message into information blocks of a predetermined length and transmitting them to the transmission line in the form of a fixed length packet (cell) having a source address, each node apparatus sequentially stores packets having different source addresses in vacant memory blocks of a buffer memory. There is written in each memory block the packet data as well as a next address pointer indicating a memory block in which the next received packet having the same source address is stored. When a packet containing the last information block of a message is received, stored in a read address queue is the address indicating the memory block which stores the first information block of the same packet.
    Type: Grant
    Filed: June 18, 1990
    Date of Patent: May 12, 1992
    Assignees: Hitachi, Ltd., Hitachi Microcomputer Engineering Ltd.
    Inventors: Yoshihiro Takiyasu, Mitsuhiro Yamaga, Kazunori Nakamura, Eiichi Amada, Hidehiko Jusa, Naoya Kobayashi, Osamu Takada, Satoru Hirayama, Tatsuhito Iiyama