Patents by Inventor Satoru Ishikawa

Satoru Ishikawa has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20220017144
    Abstract: A control device includes a processor and a storage device storing a program for controlling an operation of the processor. The processor determines whether a vehicle is in a straight-ahead traveling state, based on a vehicle speed detected by a vehicle speed sensor, a steering wheel torque applied to a steering wheel, and a steering wheel angle as a rotation angle of an input shaft. The processor stores the steering wheel angle in the memory when determining that the vehicle is in the straight-ahead traveling state. The processor stores the steering wheel angle in the memory multiple times when determining that the vehicle is in the straight-ahead traveling state. The processor calculates a corrected steering angle amount from a weighted average of the steering wheel angles stored in the memory.
    Type: Application
    Filed: July 6, 2021
    Publication date: January 20, 2022
    Inventors: Sohei MIYAKE, Jun OGAWA, Satoru ONISHI, Masaya ISHIKAWA
  • Publication number: 20220012039
    Abstract: A software update apparatus includes a communication unit that sends a request for downloading update data to a center, a storage unit that stores the downloaded update data, a control unit that executes, based on the update data, a control for installing, or installing and activating update software on one or more target electronic control units from among a plurality of electronic control units connected to each other via an in-vehicle network, and a determination unit that determines whether the vehicle is stopped and can be maintained in a stopped state. When a determination result of the determination unit is positive, the control unit restricts operations of the target electronic control units and executes the control for installing, or installing and activating.
    Type: Application
    Filed: July 6, 2021
    Publication date: January 13, 2022
    Applicant: TOYOTA JIDOSHA KABUSHIKI KAISHA
    Inventors: Satoru FUKUYO, Tomoyasu ISHIKAWA, Yusuke SATOH
  • Publication number: 20220014604
    Abstract: A software update device is configured to be controlled in response to a request from a mobile terminal device. The software update device includes one or more processors configured to: acquire cooperation information indicating that connection of the mobile terminal device to a vehicle is made; and manage whether the mobile terminal device is permitted to execute interface processing related to software update, which is determined in accordance with at least the cooperation information.
    Type: Application
    Filed: June 23, 2021
    Publication date: January 13, 2022
    Applicant: TOYOTA JIDOSHA KABUSHIKI KAISHA
    Inventors: Yusuke SATOH, Tomoyasu ISHIKAWA, Satoru FUKUYO
  • Publication number: 20220012048
    Abstract: A software update apparatus includes a communication unit that sends a request for downloading update data to a center, a storage unit that stores the downloaded update data, and a control unit that executes, based on the update data, a control for installing, or installing and activating update software on one or more target electronic control units from among a plurality of electronic control units connected to each other via an in-vehicle network. The control unit acquires software versions of the electronic control units, determines whether there is a consistency in a combination of the acquired software versions, and executes, upon determining that there is an inconsistency in the combination of the acquired software versions, a process for attaining the consistency in the combination of the software versions.
    Type: Application
    Filed: July 6, 2021
    Publication date: January 13, 2022
    Applicant: TOYOTA JIDOSHA KABUSHIKI KAISHA
    Inventors: Satoru FUKUYO, Tomoyasu ISHIKAWA, Yusuke SATOH
  • Publication number: 20220004375
    Abstract: A software update device includes: a communication module configured to request a download of update data from a center; a storage configured to store the update data obtained by the download; and one or more processor configured to perform control such that, based on the update data, update software is installed, or installed and activated, in at least one target electronic control unit among a plurality of electronic control units connected to each other via an in-vehicle network, and control execution of an alternative function that is a function equivalent to at least a part of a function controlled by the target electronic control unit when an operation of the target electronic control unit is restricted while the control is being performed.
    Type: Application
    Filed: June 18, 2021
    Publication date: January 6, 2022
    Applicant: TOYOTA JIDOSHA KABUSHIKI KAISHA
    Inventors: Yusuke SATOH, Tomoyasu ISHIKAWA, Satoru FUKUYO
  • Publication number: 20210397443
    Abstract: A master includes: a communication module configured to request a download of update data from a center; a first storage device configured to store the update data obtained by the download; and one or more processors configured to at a time of execution of the download, check at least one of a free space size of the first storage device or a free space size of a second storage device of each of one or more update-target in-vehicle devices among a plurality of in-vehicle devices connected through an in-vehicle network, and perform control such that, based on the update data, update software is installed, or installed and activated, in the one or more update-target in-vehicle devices, wherein the communication module is configured to request the download of the update data from the center based on the free space size.
    Type: Application
    Filed: June 9, 2021
    Publication date: December 23, 2021
    Applicant: TOYOTA JIDOSHA KABUSHIKI KAISHA
    Inventors: Tomoyasu ISHIKAWA, Yusuke SATOH, Satoru FUKUYO
  • Patent number: 11183479
    Abstract: In a method for manufacturing a semiconductor device, a plurality of first provisional fixing portions are supplied on a front surface of a substrate such that the plurality of first provisional fixing portions are spaced from each other and thus dispersed. A first solder layer processed into a plate to be a first soldering portion is disposed in contact with the plurality of first provisional fixing portions. A semiconductor chip is disposed on the first solder layer. In addition a conductive member in the form of a flat plate is disposed thereon via a second provisional fixing portion and a second solder layer. A reflow process is performed to solder the substrate, the semiconductor chip and the conductive member together.
    Type: Grant
    Filed: March 29, 2018
    Date of Patent: November 23, 2021
    Assignee: MITSUBISHI ELECTRIC CORPORATION
    Inventors: Shohei Ogawa, Junji Fujino, Isao Oshima, Satoru Ishikawa, Takumi Shigemoto
  • Patent number: 11145616
    Abstract: The semiconductor device includes a semiconductor element substrate having an insulation property, and a wire for positioning the semiconductor element with respect to the semiconductor element substrate. The semiconductor element substrate includes a disposition region for disposing the semiconductor element. The wire is provided at least at a part of the periphery of the disposition region.
    Type: Grant
    Filed: June 22, 2017
    Date of Patent: October 12, 2021
    Assignee: Mitsubishi Electric Corporation
    Inventors: Takumi Shigemoto, Satoru Ishikawa, Yuji Imoto
  • Publication number: 20210193611
    Abstract: A semiconductor device includes an insulating substrate formed by integrating a ceramic base plate and a cooling fin; a multiple of plate interconnection members; and a plurality of semiconductor elements. The one faces of the semiconductor elements are bonded to the ceramic base plate of the insulating substrate with a chip-bottom solder, and the other faces thereof are bonded to the plate-interconnection members with a chip-top solder so that plate interconnection members correspond respectively to the semiconductor elements. The chip-bottom solder and the chip-top solder both contain mainly Sn and 0.3-3 wt. % Ag and 0.5-1 wt. % Cu. This allows the semiconductor device to be reduced in size without impairing heat dissipation.
    Type: Application
    Filed: November 29, 2018
    Publication date: June 24, 2021
    Applicant: Mitsubishi Electric Corporation
    Inventors: Shohei OGAWA, Junji FUJINO, Satoru ISHIKAWA, Takumi SHIGEMOTO, Yusuke ISHIYAMA
  • Patent number: 10882368
    Abstract: This amphibious vehicle is provided with a body (11), a traveling device (12) that causes the body (11) to travel on land, a sailing device (13) that causes the body (11) to sail on water, a front flap (31) of which the distal end is inclined upward and the proximal end is rotatably supported by a horizontal shaft (34) on the front end of the body (11), a hydraulic damper (32) serving as a damping member that damps displacement of the front flap (31) relative to the body (11), and a compression coil spring (33) serving as a restoring member that restores the position of the front flap (31) relative to the body (11).
    Type: Grant
    Filed: February 16, 2018
    Date of Patent: January 5, 2021
    Assignee: MITSUBISHI HEAVY INDUSTRIES, LTD.
    Inventors: Yoshito Ando, Satoru Ishikawa, Tadashi Sugimura, Takashi Matsunaga, Shinichi Sato, Tetsuya Miyamoto
  • Publication number: 20200321306
    Abstract: The semiconductor device includes a semiconductor element substrate having an insulation property, and a wire for positioning the semiconductor element with respect to the semiconductor element substrate. The semiconductor element substrate includes a disposition region for disposing the semiconductor element. The wire is provided at least at a part of the periphery of the disposition region.
    Type: Application
    Filed: June 22, 2017
    Publication date: October 8, 2020
    Applicant: Mitsubishi Electric Corporation
    Inventors: Takumi SHIGEMOTO, Satoru ISHIKAWA, Yuji IMOTO
  • Publication number: 20200135682
    Abstract: A semiconductor element bonding substrate according to the present invention includes an insulating plate, and a metal pattern bonded to a main surface of the insulating plate. A main surface of the metal pattern on an opposite side of the insulating plate includes a bonding region to which a semiconductor element is bonded by a solder. The metal pattern includes at least one concave part located in the main surface. The at least one concave part is located closer to an edge of the bonding region in relation to a center part of the bonding region in the bonding region.
    Type: Application
    Filed: June 2, 2017
    Publication date: April 30, 2020
    Applicant: Mitsubishi Electric Corporation
    Inventor: Satoru ISHIKAWA
  • Publication number: 20200067393
    Abstract: The actuator includes a stationary portion that has a permanent magnet; a movable portion, having a coil, that can move in respect to the stationary portion; an elastic member that is provided on a side of the movable portion in the movement direction; and a lead wire that is provided next to the elastic member, to supply electric power to the coil while bending.
    Type: Application
    Filed: August 26, 2019
    Publication date: February 27, 2020
    Applicant: NIDEC COPAL CORPORATION
    Inventors: Satoru ISHIKAWA, Yoshihide TONOGAI
  • Publication number: 20200067394
    Abstract: An actuator, having a case portion that includes a permanent magnet; a movable portion that is able to move in respect to the case portion; and elastic members that are provided between the case portion and the movable portion, wherein: the movable portion includes a weight portion that has a flat portion that faces the case portion and an opening portion in the flat portion, and a coil that is provided on the inside of the opening portion, wherein: a groove for connecting the opening portion and the outer surface of the weight portion is provided in the flat portion.
    Type: Application
    Filed: August 26, 2019
    Publication date: February 27, 2020
    Applicant: NIDEC COPAL CORPORATION
    Inventors: Satoru ISHIKAWA, Yoshihide TONOGAI
  • Publication number: 20200043887
    Abstract: In a method for manufacturing a semiconductor device, a plurality of first provisional fixing portions are supplied on a front surface of a substrate such that the plurality of first provisional fixing portions are spaced from each other and thus dispersed. A first solder layer processed into a plate to be a first soldering portion is disposed in contact with the plurality of first provisional fixing portions. A semiconductor chip is disposed on the first solder layer. In addition a conductive member in the form of a flat plate is disposed thereon via a second provisional fixing portion and a second solder layer. A reflow process is performed to solder the substrate, the semiconductor chip and the conductive member together.
    Type: Application
    Filed: March 29, 2018
    Publication date: February 6, 2020
    Applicant: Mitsubishi Electric Corporation
    Inventors: Shohei OGAWA, Junji FUJINO, Isao OSHIMA, Satoru ISHIKAWA, Takumi SHIGEMOTO
  • Patent number: 10513160
    Abstract: An amphibious vehicle, which enables wave making resistance upon traveling on water to be reduced and propulsive performance of its vehicle main body to be improved, is to be provided. An amphibious vehicle of the present invention includes: a vehicle main body that is movable on water and on land; a rear portion flap having a front end portion fixed to a rear portion of the vehicle main body; and end plates respectively provided at both side end portions of the rear portion flap.
    Type: Grant
    Filed: October 27, 2015
    Date of Patent: December 24, 2019
    Assignee: MITSUBISHI HEAVY INDUSTRIES, LTD.
    Inventors: Takaaki Oshima, Satoru Ishikawa, Takashi Matsunaga
  • Publication number: 20190375258
    Abstract: This amphibious vehicle is provided with a body (11), a traveling device (12) that causes the body (11) to travel on land, a sailing device (13) that causes the body (11) to sail on water, a front flap (31) of which the distal end is inclined upward and the proximal end is rotatably supported by a horizontal shaft (34) on the front end of the body (11), a hydraulic damper (32) serving as a damping member that damps displacement of the front flap (31) relative to the body (11), and a compression coil spring (33) serving as a restoring member that restores the position of the front flap (31) relative to the body (11).
    Type: Application
    Filed: February 16, 2018
    Publication date: December 12, 2019
    Applicant: MITSUBISHI HEAVY INDUSTRIES, LTD.
    Inventors: Yoshito ANDO, Satoru ISHIKAWA, Tadashi SUGIMURA, Takashi MATSUNAGA, Shinichi SATO, Tetsuya MIYAMOTO
  • Patent number: 10428927
    Abstract: A vehicle casing includes a metal frame and a resin cover that covers the metal frame. The resin cover accommodates vehicle components inside the metal frame. The metal frame includes a bearing supporting boss portion that rotatably supports, inside the resin cover, a shaft member that is one of the vehicle components and rotates about a shaft center, and a mount boss portion that is for fixing the vehicle casing to a vehicle body. The bearing supporting boss portion is disposed at a position separate from an inner surface of the resin cover. The resin cover is disposed to cover the entire metal frame except a portion provided with the mount boss portion.
    Type: Grant
    Filed: September 17, 2018
    Date of Patent: October 1, 2019
    Assignee: TOYOTA JIDOSHA KABUSHIKI KAISHA
    Inventors: Satoru Ishikawa, Akinori Goto, Shingo Aijima, Ayato Noumori, Atsushi Honda
  • Patent number: 10293649
    Abstract: An amphibious vehicle that can reduce wave drag at the time of hydroplaning and can improve propulsion performance of the vehicle body. The amphibious vehicle includes a vehicle body capable of moving on water and on land, a front flap with a rear end being fixed to a lower end of the vehicle body, a rear flap with a front end being fixed to a rear part of the vehicle body, and a pair of keels provided along a travel device provided on both sides of the vehicle body on a bottom surface of the vehicle body.
    Type: Grant
    Filed: November 17, 2015
    Date of Patent: May 21, 2019
    Assignee: MITSUBISHI HEAVY INDUSTRIES, LTD.
    Inventors: Takaaki Oshima, Satoru Ishikawa, Takashi Matsunaga
  • Publication number: 20190101205
    Abstract: A vehicle casing includes a metal frame and a resin cover that covers the metal frame. The resin cover accommodates vehicle components inside the metal frame. The metal frame includes a bearing supporting boss portion that rotatably supports, inside the resin cover, a shaft member that is one of the vehicle components and rotates about a shaft center, and a mount boss portion that is for fixing the vehicle casing to a vehicle body. The bearing supporting boss portion is disposed at a position separate from an inner surface of the resin cover. The resin cover is disposed to cover the entire metal frame except a portion provided with the mount boss portion.
    Type: Application
    Filed: September 17, 2018
    Publication date: April 4, 2019
    Applicant: TOYOTA JIDOSHA KABUSHIKI KAISHA
    Inventors: Satoru ISHIKAWA, Akinori GOTO, Shingo AIJIMA, Ayato NOUMORI, Atsushi HONDA