Abstract: A piezoelectric resonator device according to one or more embodiments may be provided, in which a crystal resonator plate includes a cutout part between a vibrating part and an external frame part, and a metal film formed on a first main surface of a first sealing member is electrically connected to an external electrode terminal formed on a second main surface, which does not face an internal space, of a second sealing member via a first internal wiring formed on an inner wall surface of the external frame part.

Abstract: A third through hole is formed in a crystal resonator plate of a crystal resonator to penetrate between a first main surface and a second main surface. A through electrode of the third through hole is conducted to a first excitation electrode. A seventh through hole is formed in a first sealing member of the crystal resonator to penetrate between a first main surface and a second main surface. The through electrode of the third through hole is conducted to the through electrode of the seventh through hole. The third through hole is not superimposed to the seventh through hole in plan view.

Abstract: In a crystal oscillator accordance to an embodiment, a crystal resonator plate is bonded to, via laminated bonding patterns, a first sealing member covering a first excitation electrode of the crystal resonator plate; and a second sealing member covering a second excitation electrode of the crystal resonator plate. An internal space is formed, which hermetically seals a vibrating part including the first and second excitation electrodes of the crystal resonator plate. The laminated bonding patterns include a laminated sealing pattern annularly formed to surround the vibrating part in plan view so as to hermetically seal the internal space, and a laminated conductive pattern establishing conduction between wiring and electrodes. The laminated conductive pattern is disposed within a closed space surrounded by the laminated sealing pattern. To the laminated sealing pattern, GND potential is applied when the crystal oscillator operates.

Abstract: In a piezoelectric resonator device according to an embodiment, an internal space is formed by bonding a first sealing member to a crystal resonator plate and bonding a second sealing member to the crystal resonator plate. The internal space hermetically seals a vibrating part including a first excitation electrode and a second excitation electrode of the crystal resonator plate. Seal paths that hermetically seal the vibrating part of the crystal resonator plate are formed to have an annular shape in plan view. A plurality of external electrode terminals is formed on a second main surface of the second sealing member to be electrically connected to an external circuit board. The external electrode terminals are respectively disposed on and along an external frame part surrounding the internal space in plan view.

Abstract: In a piezoelectric resonator device according to one or more embodiments, an internal space for hermetically sealing a vibrating part including a first excitation electrode and a second excitation electrode of a crystal resonator plate is formed by bonding a first sealing member and a second sealing member respectively to the crystal resonator plate. A through hole is formed in the second sealing member. A through electrode is formed along an inner wall surface of the through hole to establish conduction between an electrode formed on a first main surface and an external electrode terminal formed on a second main surface. A corrosion resistance structure to solder is formed on the through electrode that establishes conduction between the electrode and the external electrode terminal with a conductive metal other than Au.

Abstract: In a piezoelectric resonator device according to an embodiment, an internal space is formed by bonding a first sealing member to a crystal resonator plate and bonding a second sealing member to the crystal resonator plate. The internal space hermetically seals a vibrating part including a first excitation electrode and a second excitation electrode of the crystal resonator plate. Seal paths that hermetically seal the vibrating part of the crystal resonator plate are formed to have an annular shape in plan view. A plurality of external electrode terminals is formed on a second main surface of the second sealing member to be electrically connected to an external circuit board. The external electrode terminals are respectively disposed on and along an external frame part surrounding the internal space in plan view.

Abstract: In a crystal oscillator, a crystal resonator plate is bonded to, via laminated bonding patterns, a first sealing member covering a first excitation electrode of the crystal resonator plate; and a second sealing member covering a second excitation electrode of the crystal resonator plate. An internal space is formed, which hermetically seals a vibrating part including the first and second excitation electrodes of the crystal resonator plate. The laminated bonding patterns include a laminated sealing pattern annularly formed to surround the vibrating part in plan view so as to hermetically seal the internal space, and a laminated conductive pattern establishing conduction between wiring and electrodes. The laminated conductive pattern is disposed within a closed space surrounded by the laminated sealing pattern. To the laminated sealing pattern, GND potential is applied when the crystal oscillator operates.

Abstract: A crystal resonator (101) includes: a piezoelectric resonator plate (2) on which a first excitation electrode and a second excitation electrode are formed; a first sealing member (3) that covers the first excitation electrode of the piezoelectric resonator plate (2); and a second sealing member (4) that covers the second excitation electrode of the piezoelectric resonator plate (2). The first sealing member (3) is bonded to the piezoelectric resonator plate (2) while the second sealing member (4) is bonded to the piezoelectric resonator plate (2) so that an internal space (13), which hermetically seals a vibrating part including the first excitation electrode and the second excitation electrode of the piezoelectric resonator plate (2), is formed. Plating films (51, 52) are formed respectively on both the first sealing member (3) and the second sealing member (4), on respective surfaces opposite to surfaces to be bonded to the piezoelectric resonator plate (2).

Abstract: A piezoelectric resonator device having a sandwich structure is provided, which is stably bonded to an external element. In the piezoelectric resonator device 1, at least a vibrating part 21 of a piezoelectric substrate 2 is sealed by a first sealing member 3 and a second sealing member 4. The piezoelectric substrate 2 includes: the vibrating part 21; and an external frame part 23 that is thicker than the vibrating part 21 and that surrounds the outer periphery of the vibrating part 21. External electrodes 31 to be connected to an external element 5 are provided on at least one of the first sealing member 3 and the second sealing member 4. The external element 5 is connected to the external electrodes 31 at least on the external frame part 23 of the piezoelectric substrate 2.

Abstract: A crystal resonator (101) includes: a piezoelectric resonator plate (2) on which a first excitation electrode and a second excitation electrode are formed; a first sealing member (3) that covers the first excitation electrode of the piezoelectric resonator plate (2); and a second sealing member (4) that covers the second excitation electrode of the piezoelectric resonator plate (2). The first sealing member (3) is bonded to the piezoelectric resonator plate (2) while the second sealing member (4) is bonded to the piezoelectric resonator plate (2) so that an internal space (13), which hermetically seals a vibrating part including the first excitation electrode and the second excitation electrode of the piezoelectric resonator plate (2), is formed. Plating films (51, 52) are formed respectively on both the first sealing member (3) and the second sealing member (4), on respective surfaces opposite to surfaces to be bonded to the piezoelectric resonator plate (2).

Abstract: This piezoelectric wafer has: a piezoelectric vibration piece; a frame portion that supports the piezoelectric vibration piece; and a coupling portion that couples the piezoelectric vibration piece to the frame portion. A pair of first and second metal bumps is formed in juxtaposition on the piezoelectric vibration piece. The coupling portion has slits extending in its width direction except in a bridge, i.e., a part of the coupling portion in its width direction. An end in the width direction of the bridge is distantly spaced from the first and second metal bumps both in a direction perpendicular to the width direction of the coupling portion with no overlap with these metal bumps.

Abstract: This piezoelectric wafer has: a piezoelectric vibration piece; a frame portion that supports the piezoelectric vibration piece; and a coupling portion that couples the piezoelectric vibration piece to the frame portion. The piezoelectric vibration piece is broken off at the coupling portion and separated from the piezoelectric wafer. On front and back surfaces of the coupling portion, grooved slits extending along a width direction of the coupling portion are formed except for parts of the coupling portion in the width direction. An electrode on at least one of front and back surfaces of the piezoelectric vibration piece is extracted to a frame-portion side of the piezoelectric wafer by way of the part of the coupling portion in the width direction.

Abstract: A piezoelectric resonator device having a sandwich structure is provided, which is stably bonded to an external element. In the piezoelectric resonator device 1, at least a vibrating part 21 of a piezoelectric substrate 2 is sealed by a first sealing member 3 and a second sealing member 4. The piezoelectric substrate 2 includes: the vibrating part 21; and an external frame part 23 that is thicker than the vibrating part 21 and that surrounds the outer periphery of the vibrating part 21. External electrodes 31 to be connected to an external element 5 are provided on at least one of the first sealing member 3 and the second sealing member 4. The external element 5 is connected to the external electrodes 31 at least on the external frame part 23 of the piezoelectric substrate 2.

Abstract: A piezoelectric resonator device having a sandwich structure is provided, which is capable of improving reliability while ensuring hermeticity of the internal space in which a vibrating part of the piezoelectric resonator plate is sealed. A crystal resonator 101 includes: a crystal resonator plate 2; a first sealing member 3 covering a first excitation electrode 221 of the crystal resonator plate 2; and a second sealing member 4 covering a second excitation electrode 222 of the crystal resonator plate 2. A third through hole 269 is formed in the crystal resonator plate 2 to penetrate between a first main surface 211 and a second main surface 212. A through electrode 71 of the third through hole 269 is conducted to the first excitation electrode 221. A seventh through hole 350 is formed in the first sealing member 3 to penetrate between a first main surface 311 and a second main surface 312.

Abstract: A tuning-fork type crystal resonator plate includes a base portion and a pair of leg portions protruding from the base portion in one direction. A groove and a bank portion are formed on at least one of main surfaces of each of the leg portions. The bank portion is formed accompanied by the formation of the groove, and a width of the bank portion differs along a width direction. The bank portion is constituted by a thick portion having a large width and a thin portion having a small width.

Abstract: A tuning fork type piezoelectric vibration piece 2 includes a base portion 25 in which a piezoelectric vibration substrate has a connection area with an external element, and a pair of leg portions 21, 22 projecting from a first end face of the base portion. The pair of leg portions has vibrating portions 212, 222 equipped with drive electrodes, wide weight portions 211, 221 formed at tip ends of the vibrating portions, and connecting portions 213, 223 between the vibrating portions and the weight portions. The connecting portions have widening sections whose width increases exponentially from the vibrating portions to the weight portions. The length of the widening sections is greater than their width. The weight portions have constant-width parts whose width is fixed from their connecting positions with the connecting portions. The weight portions are free of drive electrodes.

Abstract: A tuning-fork type crystal resonator plate includes a base portion and a pair of leg portions protruding from the base portion in one direction. A groove and a bank portion are formed on at least one of main surfaces of each of the leg portions. The bank portion is formed accompanied by the formation of the groove, and a width of the bank portion differs along a width direction. The bank portion is constituted by a thick portion having a large width and a thin portion having a small width.

Abstract: This piezoelectric wafer has: a piezoelectric vibration piece; a frame portion that supports the piezoelectric vibration piece; and a coupling portion that couples the piezoelectric vibration piece to the frame portion. A pair of first and second metal bumps is formed in juxtaposition on the piezoelectric vibration piece. The coupling portion has slits extending in its width direction except in a bridge, i.e., a part of the coupling portion in its width direction. An end in the width direction of the bridge is distantly spaced from the first and second metal bumps both in a direction perpendicular to the width direction of the coupling portion with no overlap with these metal bumps.

Abstract: This piezoelectric wafer has: a piezoelectric vibration piece; a frame portion that supports the piezoelectric vibration piece; and a coupling portion that couples the piezoelectric vibration piece to the frame portion. The piezoelectric vibration piece is broken off at the coupling portion and separated from the piezoelectric wafer. On front and back surfaces of the coupling portion, grooved slits extending along a width direction of the coupling portion are formed except for parts of the coupling portion in the width direction. An electrode on at least one of front and back surfaces of the piezoelectric vibration piece is extracted to a frame-portion side of the piezoelectric wafer by way of the part of the coupling portion in the width direction.

Abstract: For a tuning-fork type crystal resonator plate, a crystal plate having a crystal orientation is used. The tuning-fork type crystal resonator plate includes: a base portion; and a pair of first and second leg portions protruding from the base portion in one direction. In the first leg portion and the second leg portion, grooves are formed so that each of the grooves is biased relative to a center of the corresponding first or second leg portion in a width direction. A lowermost point of the groove is positioned in a middle of the groove in the width direction (width direction of the first leg portion and the second leg portion) in a state viewed from an end surface of the first and second leg portions in the width direction.