Abstract: Disclosed is a propylene-based resin composition comprising more than 15 parts by mass and 40 parts by mass or less of an ethylene/?-olefin copolymer (E1) and 4 to 20 parts by mass of an ethylene/?-olefin/diene copolymer (E2), and comprising also a propylene-based polymer (P1) having an amount of a n-decane-soluble part at 23° C. of 5 to 25% by mass, wherein the ethylene content of the n-decane-soluble part is more than 40% by mass and 60% by mass or less, a propylene homopolymer (P2) and an inorganic filler (F) [providing that the total amount of the components (P1), (P2), (E1), (E2) and (F) is taken as 100 parts by weight]. The propylene-based resin composition is capable of producing a molded article which is excellent in mechanical properties, unnoticeable flow marks, low gloss.

Abstract: Disclosed is a propylene-based resin composition comprising more than 15 parts by mass and 40 parts by mass or less of an ethylene/?-olefin copolymer (E1) and 4 to 20 parts by mass of an ethylene/?-olefin/diene copolymer (E2), and comprising also a propylene-based polymer (P1) having an amount of a n-decane-soluble part at 23° C. of 5 to 25% by mass, wherein the ethylene content of the n-decane-soluble part is more than 40% by mass and 60% by mass or less, a propylene homopolymer (P2) and an inorganic filler (F) [providing that the total amount of the components (P1), (P2), (E1), (E2) and (F) is taken as 100 parts by weight]. The propylene-based resin composition is capable of producing a molded article which is excellent in mechanical properties, unnoticeable flow marks, low gloss.

Abstract: Provided is a polyarylene sulfide resin composition which is good in strength, dimensional stability, and moldability in terms of a molded body thereof and is also capable of reducing wearing of a mold or molding machine at the time of molding of a molded body. The polyarylene sulfide resin composition contains 100 parts by mass of a polyarylene sulfide resin and 150 to 400 parts by mass of a glass bead, a sodium content of the polyarylene sulfide resin being 1,200 ppm or less, and the glass bead being surface-treated with a vinylsilane or an epoxysilane and having an average particle diameter of 30 ?m or less and a ratio between a cumulative 10% particle diameter and a cumulative 90% particle diameter {(cumulative 90% particle diameter)/(cumulative 10% particle diameter)} of 2.5 or more.

Abstract: An object of the present invention is to provide a propylene-based resin composition capable of providing a molded article having an excellent balance between rigidity and impact resistance. The object can be achieved by a propylene-based resin composition including an olefin-based resin characterized by including a grafted ethylene-based copolymer having an ethylene polymer as a side chain.

Abstract: An object of the present invention is to provide a propylene-based resin composition capable of providing a molded article having an excellent balance between rigidity and impact resistance. The object can be achieved by a propylene-based resin composition including an olefin-based resin characterized by including a grafted ethylene-based copolymer having an ethylene polymer as a side chain.

Abstract: Provided is a polyarylene sulfide resin composition which is good in strength, dimensional stability, and moldability in terms of a molded body thereof and is also capable of reducing wearing of a mold or molding machine at the time of molding of a molded body. The polyarylene sulfide resin composition contains 100 parts by mass of a polyarylene sulfide resin and 150 to 400 parts by mass of a glass bead, a sodium content of the polyarylene sulfide resin being 1,200 ppm or less, and the glass bead being surface-treated with a vinylsilane or an epoxysilane and having an average particle diameter of 30 ?m or less and a ratio between a cumulative 10% particle diameter and a cumulative 90% particle diameter {(cumulative 90% particle diameter)/(cumulative 10% particle diameter)} of 2.5 or more.

Abstract: A resin composition for encapsulating an electronic tag which includes a thermoplastic resin and a flat glass fiber and does not include a thermoplastic elastomer, wherein the thermoplastic resin is at least one selected from polycarbonate, syndiotactic polystyrene and polyphenylene sulfide.

Abstract: A resin composition for encapsulating an electronic tag which includes a thermoplastic resin and a flat glass fiber and does not include a thermoplastic elastomer, wherein the thermoplastic resin is at least one selected from polycarbonate, syndiotactic polystyrene and polyphenylene sulfide.

Abstract: A resin molding for use as optical base molded by means of micro-cellular foam molding, wherein the relative density of the resin molding is within a range of from 0.99 to 0.6. The ratio (f1/f2) of the linear expansion coefficient (f1) of the resin molding in MD direction at any given portion to the linear expansion coefficient (f2) of a non-foamed resin molding in MD direction at the same portion is preferably at least 1.05. The resin molding for use as optical base having the above-mentioned relative density and linear expansion coefficient has reduced dimensional change and deviation of optical axis during use of the same.

Abstract: Provided is a polyarylene sulfide resin composition for sealing electronic parts, which comprises (A) from 20 to 35% by weight of a polyarylene sulfide resin, (B) from 60 to 75% by weight of silica, and (C) from 1 to 10% by weight of an elastomer, and contains (D) from 0.05 to 1.2 parts by weight of an epoxysilane and/or (E) from 0.1 to 3 parts by weight of an epoxy resin, both relative to 100 parts by weight of the total amount of the components (A), (B) and (C). The composition has good PCT and TCT acceptable quality and good fluidity, naturally having good properties intrinsic to ordinary PAS resin, and which, when used for sealing electronic parts, causes neither deformation of bonding wires and other elements nor package breakdown, and is therefore favorable to materials for sealing electronic parts.

Abstract: A polyarylene sulfide resin composition comprising (A) a polyarylene sulfide resin, (B) an aliphatic or saturated cyclic polycarbodiimide resin or a precursor thereof, and preferably (C) reactive silicone compound grains, and (D) a polyethylene naphthalate resin or (E) a filler, which improves excellent properties exhibited by polyarylene sulfide resins, and which is also endowed with an excellent adhesion characteristics to adhesives such as epoxy resins. In addition, a molded article obtained by molding a polyarylene sulfide resin composition endowed with such excellent properties is useful as a container for accommodating an electric component material. Such a molded article may also be used as an electronic component having conductive portions which are totally or partially accommodated in the container, wherein the conductive portions are seled by a sealant encapsulated in the container.