Patents by Inventor Satoru Kose
Satoru Kose has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 9320153Abstract: A printed wiring board includes an interlayer resin insulation layer having a penetrating hole, a conductive circuit formed on a first surface of the interlayer resin insulation layer, a filled via conductor formed in the penetrating hole of the interlayer resin insulation layer and connected to the conductive circuit, a first surface-treatment coating structure formed on a first surface of the filled via conductor and having an electroless plating structure, and a second surface-treatment coating structure formed on a second surface of the filled via conductor on an opposite side with respect to the first surface-treatment coating structure and having an electroless plating structure. The filled via conductor includes a first conductive layer formed on side wall of the penetrating hole and a plated material filling the penetrating hole, and the first surface-treatment coating structure has a thickness which is different from a thickness of the second surface-treatment coating structure.Type: GrantFiled: November 20, 2014Date of Patent: April 19, 2016Assignee: IBIDEN CO., LTD.Inventors: Masahiro Kaneko, Satoru Kose, Hirokazu Higashi
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Publication number: 20150075851Abstract: A printed wiring board includes an interlayer resin insulation layer having a penetrating hole, a conductive circuit formed on a first surface of the interlayer resin insulation layer, a filled via conductor formed in the penetrating hole of the interlayer resin insulation layer and connected to the conductive circuit, a first surface-treatment coating structure formed on a first surface of the filled via conductor and having an electroless plating structure, and a second surface-treatment coating structure formed on a second surface of the filled via conductor on an opposite side with respect to the first surface-treatment coating structure and having an electroless plating structure. The filled via conductor includes a first conductive layer formed on side wall of the penetrating hole and a plated material filling the penetrating hole, and the first surface-treatment coating structure has a thickness which is different from a thickness of the second surface-treatment coating structure.Type: ApplicationFiled: November 20, 2014Publication date: March 19, 2015Applicant: IBIDEN CO., LTD.Inventors: Masahiro KANEKO, Satoru KOSE, Hirokazu HIGASHI
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Patent number: 8935850Abstract: A method for manufacturing a printed wiring board includes forming a removable layer on a support substrate, forming an interlayer resin insulation layer on the removable layer, forming a penetrating hole in the interlayer resin insulation layer, forming a first conductive layer on the interlayer resin insulation layer and on a side wall of the penetrating hole, forming a conductive circuit on the interlayer resin insulation layer, forming a via conductor in the penetrating hole, removing the support substrate from the interlayer resin insulation layer by using the removable layer, forming a protruding portion of the via conductor protruding from a surface of the interlayer resin insulation layer, and forming a surface-treatment coating on a surface of the protruding portion of the via conductor.Type: GrantFiled: February 25, 2013Date of Patent: January 20, 2015Assignee: Ibiden Co., Ltd.Inventors: Masahiro Kaneko, Satoru Kose, Hirokazu Higashi
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Patent number: 8847078Abstract: A printed wiring board includes an outermost interlayer resin insulation layer, n outermost conductive layer formed on the outermost interlayer resin insulation layer and including multiple alignment marks, a connection wiring structure connecting the alignment marks, and a solder-resist layer formed on the outermost interlayer resin insulation layer and the outermost conductive layer. The solder-resist layer has openings exposing the alignment marks, respectively, and each of the alignment marks has an electroless plated film formed on each of the alignment marks.Type: GrantFiled: September 27, 2013Date of Patent: September 30, 2014Assignee: Ibiden Co., Ltd.Inventors: Ryo Matsuno, Koichi Kondo, Satoru Kose
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Publication number: 20140083747Abstract: A printed wiring board includes an outermost interlayer resin insulation layer, n outermost conductive layer formed on the outermost interlayer resin insulation layer and including multiple alignment marks, a connection wiring structure connecting the alignment marks, and a solder-resist layer formed on the outermost interlayer resin insulation layer and the outermost conductive layer. The solder-resist layer has openings exposing the alignment marks, respectively, and each of the alignment marks has an electroless plated film formed on each of the alignment marks.Type: ApplicationFiled: September 27, 2013Publication date: March 27, 2014Applicant: IBIDEN CO., Ltd.Inventors: Ryo MATSUNO, Koichi Kondo, Satoru Kose
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Patent number: 8410376Abstract: A printed wiring board includes an interlayer resin insulation layer having a penetrating hole for a via conductor, a conductive circuit formed on one surface of the interlayer resin insulation layer, a via conductor formed in the penetrating hole and having a protruding portion protruding from the other surface of the interlayer resin insulation layer, and a surface-treatment coating formed on the surface of the protruding portion of the via conductor. The via conductor is connected to the conductive circuit and has a first conductive layer formed on the side wall of the penetrating hole and a plated layer filling the penetrating hole.Type: GrantFiled: July 21, 2010Date of Patent: April 2, 2013Assignee: Ibiden Co., Ltd.Inventors: Masahiro Kaneko, Satoru Kose, Hirokazu Higashi
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Patent number: 8378230Abstract: A printed wiring board includes an interlayer resin insulation layer having the first surface, the second surface on the opposite side of the first surface, and a penetrating hole for a via conductor, a conductive circuit formed on the first surface of the interlayer resin insulation layer, a via conductor formed in the penetrating hole and connected to the conductive circuit on the first surface of the interlayer resin insulation layer, and a surface-treatment coating formed on the surface of the via conductor exposed from the second surface of the interlayer resin insulation layer through the penetrating hole. The via conductor is made of a first conductive layer formed on the side wall of the penetrating hole and a plated-metal filling the penetrating hole. The surface of the via conductor is recessed from the second surface of the interlayer resin insulation layer.Type: GrantFiled: April 30, 2010Date of Patent: February 19, 2013Assignee: Ibiden Co., Ltd.Inventors: Masahiro Kaneko, Daiki Komatsu, Satoru Kose, Hirokazu Higashi
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Publication number: 20110067913Abstract: A printed wiring board includes an interlayer resin insulation layer having the first surface, the second surface on the opposite side of the first surface, and a penetrating hole for a via conductor, a conductive circuit formed on the first surface of the interlayer resin insulation layer, a via conductor formed in the penetrating hole and connected to the conductive circuit on the first surface of the interlayer resin insulation layer, and a surface-treatment coating formed on the surface of the via conductor exposed from the second surface of the interlayer resin insulation layer through the penetrating hole. The via conductor is made of a first conductive layer formed on the side wall of the penetrating hole and a plated-metal filling the penetrating hole. The surface of the via conductor is recessed from the second surface of the interlayer resin insulation layer.Type: ApplicationFiled: April 30, 2010Publication date: March 24, 2011Applicant: IBIDEN CO., LTD.Inventors: Masahiro KANEKO, Daiki Komatsu, Satoru Kose, Hirokazu Higashi
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Publication number: 20110048773Abstract: A printed wiring board includes an interlayer resin insulation layer having a penetrating hole for a via conductor, a conductive circuit formed on one surface of the interlayer resin insulation layer, a via conductor formed in the penetrating hole and having a protruding portion protruding from the other surface of the interlayer resin insulation layer, and a surface-treatment coating formed on the surface of the protruding portion of the via conductor. The via conductor is connected to the conductive circuit and has a first conductive layer formed on the side wall of the penetrating hole and a plated layer filling the penetrating hole.Type: ApplicationFiled: July 21, 2010Publication date: March 3, 2011Applicant: IBIDEN CO., LTD.Inventors: Masahiro Kaneko, Satoru Kose, Hirokazu Higashi