Patents by Inventor Satoru Koshiba

Satoru Koshiba has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Resin-encapsulated semiconductor memory device useful for single in-line packages
    Patent number: 5287000
    Abstract: According to one aspect of the present invention, a semiconductor chip, which can be mounted in a zigzag in-line type package (ZIP) partially using a tabless lead frame, includes bonding pads arranged on the chip so that the chip can be applied also to other different types of packages. These different types of packages include a small out-line J-bent type package (SOJ) which uses a lead frame with tab, and a dual in-line type package (DIP) which uses a tabless lead frame. Further, a plurality of bonding pad pairs are provided amongst the bonding pads on the chip, each pad of such bonding pad pairs having the same function as the other pad associated therewith thereby duplicating a common function in different bonding pads on the semiconductor chip so as to make the semiconductor chip compatible with a variety of or different types of packages.
    Type: Grant
    Filed: March 26, 1991
    Date of Patent: February 15, 1994
    Assignees: Hitachi, Ltd., Hitachi VLSI Engineering Corp.
    Inventors: Yasushi Takahashi, Kazuyuki Miyazawa, Hidetoshi Iwai, Masaya Muranaka, Yoshitaka Kinoshita, Satoru Koshiba