Abstract: A mechanism for controlling the flow of air from an air-conditioning unit includes a row of guide vanes which are pivotally held by an outlet nozzle. The guide vanes are located at the lower end of an air course which has been formed within a body of the air-conditioning unit. The guide vanes control the flow of air in both left and right directions. This new design is characterized in that the angle of inclination of each guide vane progressively changes toward the end of the row. The air flow is controlled accurately in both the left and right directions so that the air flow reaches the desired location.

Abstract: A machining head of a laser machining apparatus for adjusting flow speed distribution includes a sub assist gas supply inlet; an annular partition for partitioning the inside of the sub assist gas nozzle toward axis direction; an annular flat board which contacts rotatably to the side surface of the down stream of the annular partition wall, and interrupts a part of gas supply inlet, and a part of which is notched; two partition plates which are mounted on both end portions of the annular flat board, partition the inside of the sub assist gas nozzle down stream of the annular partition wall, and rotate with the annular flat board; a driving device for driving the annular flat board; and a control apparatus for operating the driving device.

Abstract: A semiconductor cleaning apparatus includes a cassette loader/unloader for moving a cassette; a product loader/unloader for loading a wafer into and unloading a wafer from a cassette; a cleaner for cleaning a wafer; a water cleaner for cleaning with water a wafer that has been cleaned in the cleaner; a dryer for drying the wafer that has been cleaned with water in the water cleaner; and a conveyance having a wafer grasping hand for directly holding a wafer unloaded from a cassette and sequentially conveying the wafer held by the wafer hand to the cleaner, the water cleaner, and the dryer.

Abstract: A mechanism for controlling the flow of air from an air-conditioning unit includes a row of guide vanes which are pivotally held by an outlet nozzle. The guide vanes are located at the lower end of an air course which has been formed within a body of the air-conditioning unit. The guide vanes control the flow of air in both left and right directions. This new design is characterized in that the angle of inclination of each guide vane progressively changes toward the end of the row. The air flow is controlled accurately in both the left and right directions so that the air flow reaches the desired location.

Abstract: A wind direction adjusting device includes a wind speed uniforming unit provided upstream of a wind path having a nonuniform wind speed distribution from the side of high wind speed to the side of low wind speed, and a blow-off opening provided downstream of the wind path, which includes a wind direction deflecting plate for deflecting the blow-off direction of the blown-off wind.

Abstract: A semiconductor cleaning apparatus includes a cassette loader/unloader for moving a cassette; a product loader/unloader for loading a wafer into and unloading a wafer from a cassette; a cleaner for cleaning a wafer; a water cleaner for cleaning with water a wafer that has been cleaned in the cleaner; a dryer for drying the wafer that has been cleaned with water in the water cleaner; and a conveyance having a wafer grasping hand for directly holding a wafer unloaded from a cassette and sequentially conveying the wafer held by the wafer hand to the cleaner, the water cleaner, and the dryer.

Abstract: A semiconductor cleaning apparatus includes a cassette loader/unloader for moving a cassette; a product loader/unloader for loading a wafer into and unloading a wafer from a cassette; a cleaner for cleaning a wafer; a water cleaner for cleaning with water a wafer that has been cleaned in the cleaner; a dryer for drying the wafer that has been cleaned with water in the water cleaner; and a conveyance having a wafer grasping hand for directly holding a wafer unloaded from a cassette and sequentially conveying the wafer held by the wafer hand to the cleaner, the water cleaner, and the dryer.

Abstract: A semiconductor cleaning apparatus having: a loader/unloader portion for injecting/ejecting a product cassette which accommodates a wafer; a product injecting/ejecting portion for injecting/ejecting the wafer from the product cassette; a cleaning portion for cleaning the wafer; a water cleaning portion for, with water, cleaning the wafer which has been cleaned in the cleaning portion; a drying portion for drying the wafer which has been cleaned with water in the water cleaning portion; and a conveyance portion having a wafer hand for directly holding the wafer ejected from the product cassette in the product injecting/ejecting portion and sequentially conveying the wafer held by the wafer hand to the cleaning portion, the water cleaning portion and the drying portion.

Abstract: A cleaning apparatus and a cleaning method effectively clean the entire surface of a substrate to be cleaned by uniformly irradiating ultrasonic waves to the substrate. Ultrasonic waves generated by an ultrasonic oscillator provided on the side wall of an outer tank are transmitted through an ultrasonic wave transmission medium provided between the outer tank and an inner tank, for example, water, and are irradiated on a substrate to be cleaned, for example, a semiconductor wafer, in the inner tank through a cleaning chemical in the inner tank. By irradiating the ultrasonic waves from the side of the cleaning apparatus, a support base blocks the least amount of ultrasonic waves from reaching the substrate. This is effective to uniformly clean the substrate.