Abstract: To provide a technique of preventing, in an encapsulated circuit module having a metal shield layer covering a surface of a resin layer containing filler, the shield layer from falling off. In manufacturing encapsulated circuit modules, first, a substrate 100 is covered with a first resin 400 containing filler together with an electronic component 200. Next, a surface of the first resin 400 is covered with a second resin 500 containing no filler. Subsequently, a ground electrode 110 in the substrate 100 is exposed by snicking and then a shield layer 600 that covers the entire surface of the substrate 100 is formed by electroless plating. Thereafter, snipping is performed to obtain a number of encapsulated circuit modules.

Abstract: To reduce, when a single encapsulated circuit module has electronic components that are mutually influenced by their electromagnetic waves, the mutual influence, an embodiment provides an encapsulated circuit module M having a substrate 100 on which a number of electronic components 200 are mounted. An electronic component 200A is a high frequency oscillator. A metal side wall 320 of a partition member is provided on the substrate 100. One surface of the substrate 100 is entirely covered with a first resin 400 together with the electronic components 200 and the side wall 320. The first resin 400 is covered with a metal shield layer 600 for shielding electromagnetic waves. The electronic component 200A is surrounded by the side wall 320 and the shield layer 600.

Abstract: To reduce, when a single encapsulated circuit module has electronic components that are mutually influenced by their electromagnetic waves, the mutual influence. A encapsulated circuit module M has a substrate 100 on which a number of electronic components 200 are mounted. An electronic component 200A is a high frequency oscillator. A metal side wall 320 of a partition member is provided on the substrate 100. One surface of the substrate 100 is entirely covered with a first resin 400 together with the electronic components 200 and the side wall 320. The first resin 400 is covered with a metal shield layer 600 for shielding electromagnetic waves. The electronic component 200A is surrounded by the side wall 320 and the shield layer 600.

Abstract: To provide a technique of preventing, in an encapsulated circuit module having a metal shield layer covering a surface of a resin layer containing filler, the shield layer from falling off. In manufacturing encapsulated circuit modules, first, a substrate 100 is covered with a first resin 400 containing filler together with an electronic component 200. Next, a surface of the first resin 400 is covered with a second resin 500 containing no filler. Subsequently, a ground electrode 110 in the substrate 100 is exposed by snicking and then a shield layer 600 that covers the entire surface of the substrate 100 is formed by electroless plating. Thereafter, snipping is performed to obtain a number of encapsulated circuit modules.

Abstract: To improve, in an encapsulated circuit module having a metal shield layer covering a surface of a resin layer containing filler, a shielding property of the shield layer against electromagnetic waves. The encapsulated circuit module has a substrate 100 on which electronic components are mounted, covered with a first resin 400. A surface of the first resin 400 is covered with a shield layer 600 including a first metal covering layer 610 made of copper or iron and a second metal covering layer 620 made of nickel. Each of the first metal covering layer 610 and the second metal covering layer 620 is thicker than 5 ?m.

Abstract: Disclosed herein is a lamp cooling device for cooling a lamp including a light emission source for emitting light, a front transparent plate, a reflector for reflecting light emitted by the light emission source toward the front transparent plate, the light emission source being disposed in an intralamp space surrounded by the front transparent plate and the reflector, said lamp cooling device including: a duct having joint ports defined in respective opposite ends thereof and communicating with said intralamp space, said duct having a continuously extending portion between said opposite ends which is disposed in a space outside of said intralamp space, for circulating a gas through said duct and said intralamp space in isolated relation to the space outside of said intralamp space.

Abstract: Disclosed herein is a lamp cooling device for cooling a lamp including a light emission source for emitting light, a front transparent plate, a reflector for reflecting light emitted by the light emission source toward the front transparent plate, the light emission source being disposed in an intralamp space surrounded by the front transparent plate and the reflector, said lamp cooling device including: a duct having joint ports defined in respective opposite ends thereof and communicating with said intralamp space, said duct having a continuously extending portion between said opposite ends which is disposed in a space outside of said intralamp space, for circulating a gas through said duct and said intralamp space in isolated relation to the space outside of said intralamp space.

Abstract: A system for centralized management of medical data regarding bio-body information detected from a patient by way of a telephone line to a data processing facility in a medical organization, in which a transmission section is attached to a patient and a receiving section connected on a wireless mode to the transmission section, in which at least one of the transmission and the receiving sections has a RAM for storing general standard ranges and personal permissible ranges for bio-body information, and a CPU for comparing the bio-body information data detected from a patient with the general standard ranges and with the personal permissible ranges and outputting the detected data judged to be abnormal from the transmission section to the medical organization.