Abstract: An abnormality diagnosis system that diagnoses an abnormality related to each control shaft in equipment in which the plurality of control shafts, each including a motor and an output unit driven by the motor, are incorporated, includes: a plurality of vibration sensors that are provided for the plurality of control shafts, respectively, and that detect vibration occurring in connection with driving of the motor corresponding to each control shaft; a calculation unit that calculates, for each of the plurality of control shafts, vibration levels in a plurality of predetermined frequency ranges, based on vibration information detected by each of the plurality of vibration sensors; and a diagnosis unit that diagnoses an abnormality related to each control shaft, based on a distribution state, across the plurality of predetermined frequency ranges and across the plurality of control shafts, of the vibration levels calculated by the calculation unit.

Abstract: The present invention reduces tact time for a pick-and-place operation by an actuator. In a housing of the actuator, an air passage being a passage of air when sucking air from a hollow part of a shaft is provided. Furthermore, a sucking valve that sucks air from the hollow part of the shaft through the air passage and a suction detecting sensor to detect that a workpiece is suctioned onto a tip of the shaft are provided in the air passage. Then, in the housing, the air passage is disposed at a position on a side opposite to a linear motion motor that moves the shaft in an axial direction of the shaft, via the shaft.

Abstract: An abnormality diagnosis system that diagnoses an abnormality related to each control shaft in equipment in which the plurality of control shafts, each including a motor and an output unit driven by the motor, are incorporated, includes: a plurality of vibration sensors that are provided for the plurality of control shafts, respectively, and that detect vibration occurring in connection with driving of the motor corresponding to each control shaft; a calculation unit that calculates, for each of the plurality of control shafts, vibration levels in a plurality of predetermined frequency ranges, based on vibration information detected by each of the plurality of vibration sensors; and a diagnosis unit that diagnoses an abnormality related to each control shaft, based on a distribution state, across the plurality of predetermined frequency ranges and across the plurality of control shafts, of the vibration levels calculated by the calculation unit.

Abstract: Provided is a method for setting the conditions for heating a semiconductor chip during bonding of the semiconductor chip using an NCF, wherein a heating start temperature and a rate of temperature increase are set on the basis of a viscosity characteristic map that indicates changes in viscosity with respect to temperature of the NCF at various rates of temperature increase and a heating start temperature characteristic map that indicates changes in viscosity with respect to temperature of the NCF when the heating start temperature is changed at the same rate of temperature increase.

Abstract: The present invention reduces tact time for a pick-and-place operation by an actuator. In a housing of the actuator, an air passage being a passage of air when sucking air from a hollow part of a shaft is provided. Furthermore, a sucking valve that sucks air from the hollow part of the shaft through the air passage and a suction detecting sensor to detect that a workpiece is suctioned onto a tip of the shaft are provided in the air passage. Then, in the housing, the air passage is disposed at a position on a side opposite to a linear motion motor that moves the shaft in an axial direction of the shaft, via the shaft.

Abstract: [Problem] To bond an electronic component on a substrate via an adhesive material satisfactorily. [Solution] A bonding device 10 for thermally bonding an electronic component 100 to a substrate 110 or to another electronic component via an adhesive material 112, the bonding device being provided with: a bonding tool 40 comprising a bonding distal-end portion 42 which includes a bonding surface 44 and tapered side surfaces 46 formed in a tapering shape becoming narrower toward the bonding surface 44, the bonding surface 44 having a first suction hole 50 for suction-attaching the electronic component 100 via an individual piece of a porous sheet 130, the tapered side surfaces 46 having second suction holes 52, 54 for suction-attaching the porous sheet 130; and a bonding control unit 30 which controls the first suction hole 50 and the second suction holes 52, 54 independently from each other.

Abstract: [Problem] To bond an electronic component on a substrate via an adhesive material satisfactorily. [Solution] A bonding device 10 for thermally bonding an electronic component 100 to a substrate 110 or to another electronic component via an adhesive material 112, the bonding device being provided with: a bonding tool 40 comprising a bonding distal-end portion 42 which includes a bonding surface 44 and tapered side surfaces 46 formed in a tapering shape becoming narrower toward the bonding surface 44, the bonding surface 44 having a first suction hole 50 for suction-attaching the electronic component 100 via an individual piece of a porous sheet 130, the tapered side surfaces 46 having second suction holes 52, 54 for suction-attaching the porous sheet 130; and a bonding control unit 30 which controls the first suction hole 50 and the second suction holes 52, 54 independently from each other.

Abstract: Provided is a method for setting the conditions for heating a semiconductor chip during bonding of the semiconductor chip using an NCF, wherein a heating start temperature and a rate of temperature increase are set on the basis of a viscosity characteristic map that indicates changes in viscosity with respect to temperature of the NCF at various rates of temperature increase and a heating start temperature characteristic map that indicates changes in viscosity with respect to temperature of the NCF when the heating start temperature is changed at the same rate of temperature increase.

Abstract: A flip-chip bonding apparatus (100) is provided with: a bonding tool (10) that includes a base (11), and an island (13) that vacuum-sucks, to a surface (14) thereof, a semiconductor die (70) having protruding electrodes (72, 73) that are disposed on both the surfaces; and a heater (20) that heats the semiconductor die (70) vacuum-sucked to the island (13). The flip-chip bonding apparatus heats the semiconductor die (70), bonds the protruding electrodes (73) of the semiconductor die (70) to protruding electrodes (82) of a semiconductor die (80), and seals, using a non-conductive film (NCF) (75), a gap between the semiconductor die (70) and the semiconductor die (80). Continuous vacuum suction holes (15) are provided in the base (11), said continuously vacuum suction holes being at positions adjacent to the outer peripheral surface of the island (13).

Abstract: A flip-chip bonding apparatus (100) is provided with: a bonding tool (10) that includes a base (11), and an island (13) that vacuum-sucks, to a surface (14) thereof, a semiconductor die (70) having protruding electrodes (72, 73) that are disposed on both the surfaces; and a heater (20) that heats the semiconductor die (70) vacuum-sucked to the island (13). The flip-chip bonding apparatus heats the semiconductor die (70), bonds the protruding electrodes (73) of the semiconductor die (70) to protruding electrodes (82) of a semiconductor die (80), and seals, using a non-conductive film (NCF) (75), a gap between the semiconductor die (70) and the semiconductor die (80). Continuous vacuum suction holes (15) are provided in the base (11), said continuously vacuum suction holes being at positions adjacent to the outer peripheral surface of the island (13).

Abstract: A mounting apparatus bonds an electrode of an electronic component and an electrode of a substrate with thermally fusible bond metal to mount the component on a substrate. The apparatus includes a heater base that moves on a path to and from the substrate, a bonding tool, a pedestal to hold the electronic component by vacuum. The bonding tool is heated with a ceramic heater in the heater base to thermally bond the electronic component retained on the pedestal. The bonding tool includes a cooling flow passage providing communication between the upper surface and a side surface of the pedestal. This offers the advantage of shortening the time for cooling during mounting of the electronic component.

Abstract: A motion guide device that has a novel damping structure different from the conventional damping structure is provided. The present invention comprises a raceway member (1) having a rolling-element rolling part (1a); a moving member (2) having a loaded rolling-element rolling part (2a) facing the rolling-element rolling part (1a) and being allowed to make a linear or curved movement relatively to the raceway member (1); and a plurality of rolling elements (3) intervening between the rolling-element rolling part (1a) of the raceway member (1) and the loaded rolling-element rolling part (2a) of the moving part (2). A gap (16) between the raceway member (1) and the moving member (2) is filled with a layer of oil contacting the raceway member (1) and the moving member (2). Viscosity resistance of the oil is utilized to apply a braking force to the moving member (2) or the raceway member (1) in proportion to a speed.

Abstract: a ball spline enabling easy machining of a spline shaft by drawing and manufacturable at low cost. The ball spline includes a spline shaft in which multiple lines of ball rolling faces are formed along the longitudinal direction; and a spline nut having a hollow hole for inserting the spline shaft therein, having load rolling faces opposed to the ball rolling faces of the spline shaft. Multiple lines of torque transmission grooves along the longitudinal direction are formed at equal intervals around the spline shaft, and the ball rolling faces are formed on the lateral both sides of these torque transmission grooves. Further, a distance between a pair of ball rows rolling on both sides of the land parts of the spline shaft is set larger than a distance between a pair of ball rows rolling on both sides of the torque transmission grooves.

Abstract: A motion guide device is provided which comprises a chain of rollers in which retainers are interposed, in which the chain of rollers is given a degree of freedom of rotation. The motion guide device comprises a track member (5) on which a roller rolling part (5a) is formed which allows rollers (7) to roll on along the roller rolling part; a moving member (6) on which a loaded roller rolling part (6a) facing the roller rolling part (5a) is formed; a plurality of rollers (7) arranged on a roller circulation path containing a loaded roller rolling path (9) formed between the roller rolling part (5a) of the track member (5) and the roller rolling part (6a) of the moving member (6); and a plurality of retainers (8) respectively interposed between rollers of the plurality of rollers (7).

Abstract: The present invention provides a screw device which takes a heavy load in one direction along the axis of the screw shaft and only a light load in the opposite direction, the screw device capable of providing ease of control of preloading. The screw device of the present invention has a screw shaft 1 with an outer surface having a ball rolling groove 1a for rolling balls 7 and a roller rolling groove 1b for rolling rollers 6 both spirally formed thereon; a ball nut 4 with an inner surface having a ball rolling groove 4a spirally formed thereon facing the ball rolling groove 1a of the screw shaft 1; a roller nut 5 with an inner surface having a roller rolling groove 5a spirally formed thereon facing the roller rolling groove 1b of the screw shaft 1; a plurality of balls 7 arranged between the screw shaft 1 and the ball nut 4; and a plurality of rollers 6 arranged between the screw shaft 1 and the roller nut 5. The ball nut 4 and the roller nut 5 are connected along an axis of the screw shaft 1.

Abstract: The present invention provides a roller screw which bears loads in both directions along the axis of the screw shaft and which is also capable of preventing interference between each roller end surface and roller rolling grooves. Between roller rolling surfaces 1a, 1b of the screw shaft 1 and roller rolling surfaces 2a, 2b, respectively, of the nut 2, there are formed two or more roller rolling paths 3a, 3b, respectively. In one roller rolling path 3a, plural rollers 4a are parallel-arranged, and also in another roller rolling path 3b, plural rollers 4b are parallel-arranged. The rollers 4a arranged in the one roller rolling path 3a bear a load in one direction (1) along the axis of the screw shaft 1, while the rollers 4b arranged in the other roller rolling path 3b bear a load in the opposite direction (2) along the axis of the screw shaft 1.

Abstract: A motion guide device is provided which comprises a chain of rollers in which retainers are interposed, in which the chain of rollers is given a degree of freedom of rotation. The motion guide device comprises a track member (5) on which a roller rolling part (5a) is formed which allows rollers (7) to roll on along the roller rolling part; a moving member (6) on which a loaded roller rolling part (6a) facing the roller rolling part (5a) is formed; a plurality of rollers (7) arranged on a roller circulation path containing a loaded roller rolling path (9) formed between the roller rolling part (5a) of the track member (5) and the roller rolling part (6a) of the moving member (6); and a plurality of retainers (8) respectively interposed between rollers of the plurality of rollers (7).

Abstract: The present invention provides a screw device which takes a heavy load in one direction along the axis of the screw shaft and only a light load in the opposite direction, the screw device capable of providing ease of control of preloading. The screw device of the present invention has a screw shaft 1 with an outer surface having a ball rolling groove 1a for rolling balls 7 and a roller rolling groove 1b for rolling rollers 6 both spirally formed thereon; a ball nut 4 with an inner surface having a ball rolling groove 4a spirally formed thereon facing the ball rolling groove 1a of the screw shaft 1; a roller nut 5 with an inner surface having a roller rolling groove 5a spirally formed thereon facing the roller rolling groove 1b of the screw shaft 1; a plurality of balls 7 arranged between the screw shaft 1 and the ball nut 4; and a plurality of rollers 6 arranged between the screw shaft 1 and the roller nut 5. The ball nut 4 and the roller nut 5 are connected along an axis of the screw shaft 1.

Abstract: A motion guide device that has a novel damping structure different from the conventional damping structure is provided. The present invention comprises a raceway member (1) having a rolling-element rolling part (1a); a moving member (2) having a loaded rolling-element rolling part (2a) facing the rolling-element rolling part (1a) and being allowed to make a linear or curved movement relatively to the raceway member (1); and a plurality of rolling elements (3) intervening between the rolling-element rolling part (1a) of the raceway member (1) and the loaded rolling-element rolling part (2a) of the moving part (2). A gap (16) between the raceway member (1) and the moving member (2) is filled with a layer of oil contacting the raceway member (1) and the moving member (2). Viscosity resistance of the oil is utilized to apply a braking force to the moving member (2) or the raceway member (1) in proportion to a speed.

Abstract: A method for evaluating the height of a wire bonded between a semiconductor chip and a lead frame including the steps of: investigating the correlation between wire height and wire width beforehand by shifting the focusing level of an optical system, setting a detection level which is the focusing level of the optical system based upon an upper limit level and a lower limit level which are to be the standard levels for the height of the wire to be detected. The acceptability of the height of the wire is judged by ascertaining whether or not the imaged width of the wire is within the wire width range which is between the upper and lower limit levels of the correlation between the wire height and the wire width.