Abstract: A mounting device is provided that is configured to mount a chip component on a substrate. The mounting device includes a mounting head having an attachment tool that is configured to hold the chip component, and a head-side stage that is configured to adjust position and orientation of the attachment tool, a recognition unit configured to acquire an image from a direction perpendicular to a surface of the attachment tool, and a control unit operatively connected to the mounting head and the recognition unit. The control unit is configured to change a rotation angle of the head-side stage a plurality of times to acquire, by the recognition unit, images of a center identification mark provided at a portion movable together with the attachment tool, and configured to calculate a rotational center coordinate of the head-side stage from a plurality of pieces of position information of the center identification mark.

Abstract: Provided is a liquid crystal component manufacturing method wherein a gap between a panel surface of a liquid crystal module and a transparent cover is filled with a transparent resin, then, the liquid crystal module and the transparent cover are bonded by curing the resin. In the method, at the peripheral section of at least one surface of the panel surface and the facing surface of the transparent cover, the resin is applied, then, a dam is formed by semi-curing the resin. At the same time, the resin is applied to the center, the panel surface and the transparent cover are permitted to face, and the resin applied at the center is pushed to spread by reducing the gap between the facing panel surface and the transparent cover. The resin pushed to spread is dammed up by the dam, and the whole resin that exists in the gap is cured. An apparatus for manufacturing the liquid crystal component is also provided.

Abstract: A mounting method includes the steps of, after positioning objects being bonded relative to each other, moving a movable wall positioned there around until coming into contact with one object holding means to form a local chamber having a local enclosed space, enclosing both objects in the chamber, reducing the pressure in the chamber, moving the object holding means in a direction for reducing the volume of the chamber and moving the movable wall following the movement of the object holding means, and bonding both objects to each other by pressing. Since the bonding part and the vicinity of the bonding part can be locally and efficiently enclosed from the surroundings, and the local chamber can vary the shape of the enclosed space with the bonding operation while maintaining the enclosed state even at the time of bonding.

Abstract: A mounting method and a mounting device, the mounting method comprising the steps of, after positioning objects being bonded relative to each other, moving a movable wall positioned therearound until coming into contact with one object holding means to form a local chamber having a local enclosed space, enclosing both objects in the chamber, reducing the pressure in the chamber, moving the object holding means in a direction for reducing the volume of the chamber and moving the movable wall following the movement of the object holding means, and bonding both objects to each other by pressing, whereby, since the part to be bonded and its vicinity can be locally and efficiently enclosed separably from surroundings, and the local chamber capable of properly varying the shape of the enclosed space can be formed interlockingly with the bonding operation while maintaining the enclosed state even at the time of bonding, a specified mounting can be easily performed by a small device.