Abstract: An optical connector plug includes a holder having a ferrule at one end thereof, a stop ring for supporting the ferrule in a predetermined direction, a plug frame for rotatably supporting and incorporating the stop ring in an axial direction, and a coil spring interposed between the holder and the stop ring, for energizing the ferrule to the front in the plug frame, wherein the holder and the stop ring have engaging portions with which they are mutually engaged, and an optical axis of the ferrule is adjusted in a single step by rotating the stop ring and fixing the plug frame or by rotating the plug frame and fixing the stop ring, and an adjusted position is fixed by pressure generated by pressing the spring to the holder and by using an adhering agent which is filled between the plug frame and the stop ring.

Abstract: An optical connector plug includes a holder having a ferrule at one end thereof, a stop ring for supporting the ferrule in a predetermined direction, a plug frame for rotatably supporting and incorporating the stop ring in an axial direction, and a coil spring interposed between the holder and the stop ring, for energizing the ferrule to the front in the plug frame, wherein the holder and the stop ring have engaging portions with which they are mutually engaged, and an optical axis of the ferrule is adjusted in a single step by rotating the stop ring and fixing the plug frame or by rotating the plug frame and fixing the stop ring, and an adjusted position is fixed by pressure generated by pressing the spring to the holder and by using an adhering agent which is filled between the plug frame and the stop ring.

Abstract: A process of producing an exposure mask by which the accuracy of a pattern of a mask film to be formed on a surface of a transparent substrate is improved and also the accuracy in registration between layers is improved. The process comprises the step of correcting, upon exposure for the formation of a mask pattern, the position of a mask pattern by a different correction amount in accordance with a ratio at which the area of the mask film which remains after etching occupies in the entire area of a transparent substrate on which the mask film is formed.