Patents by Inventor Satoru Ooishi

Satoru Ooishi has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 7944956
    Abstract: A heat sink has a first flat plate, a partition plate, and a second flat plate. The first flat plate has an upper surface in which a first recess is formed. The second flat plate has a lower surface in which a second recess is formed, and an upper surface on which a semiconductor laser element is mounted. These recesses form a part of a refrigerant channel. The partition plate has a lower surface covering the first recess, an upper surface covering the second recess, and at least one through hole having the first recess communicated with the second recess. The first flat plate and the second flat plate both have a first coefficient of thermal expansion. The partition plate has a second coefficient of thermal expansion lower than the first coefficient of thermal expansion.
    Type: Grant
    Filed: April 27, 2006
    Date of Patent: May 17, 2011
    Assignee: Hamamatsu Photonics K.K.
    Inventors: Hirofumi Miyajima, Hirofumi Kan, Nobuo Watanabe, Satoru Ooishi, Nobutaka Suzuki
  • Publication number: 20100202479
    Abstract: A heat sink has a first flat plate, a partition plate, and a second flat plate. The first flat plate has an upper surface in which a first recess is formed. The second flat plate has a lower surface in which a second recess is formed, and an upper surface on which a semiconductor laser element is mounted. These recesses form a part of a refrigerant channel. The partition plate has a lower surface covering the first recess, an upper surface covering the second recess, and at least one through hole having the first recess communicated with the second recess. The first flat plate and the second flat plate both have a first coefficient of thermal expansion. The partition plate has a second coefficient of thermal expansion lower than the first coefficient of thermal expansion.
    Type: Application
    Filed: April 27, 2006
    Publication date: August 12, 2010
    Applicant: HAMAMATSU PHOTONICS K.K.
    Inventors: Hirofumi Miyajima, Hirofumi Kan, Nobuo Watanabe, Satoru Ooishi, Nobutaka Suzuki