Patents by Inventor Satoru Oota

Satoru Oota has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11965130
    Abstract: A borehole cement slurry additive that is capable of suppressing the generation of free water from cement slurries in any environment, whether cold regions, mild regions, or hot regions; and a method for storing the same. The borehole cement slurry additive contains: an aqueous dispersion of silica having an average particle size of 3-200 nm as determined via dynamic light scattering; and a compound having an alcoholic hydroxyl group as a dispersion stabilizer, the compound being included in an amount of 1-30 mol per 1,000 g dispersion medium in the aqueous silica dispersion.
    Type: Grant
    Filed: April 7, 2020
    Date of Patent: April 23, 2024
    Assignee: NISSAN CHEMICAL CORPORATION
    Inventors: Satoru Murakami, Masaki Kimata, Isao Oota
  • Patent number: 6841628
    Abstract: The present invention relates to a resin composition which gives a resin product with a low hygroscopic property, an adhesive for connecting a circuit member and a circuit board, and provides a resin composition, an adhesive for connecting a circuit member and a circuit board comprising (A) a polyhydroxy polyether resin represented by the formula (I): wherein R1 to R8 each represent H, C1-4 alkyl group, C2-5 alkenyl group, C1-4 hydroxyalkyl group or halogen atom; Ra represents H or C1-2 alkyl group; Rb represents C2-13 alkyl group; and n is a recurring number, or the following formula (II): wherein R9 to R12 each represent H, C1-6 alkyl group, C1-6 hydroxyalkyl group or halogen atom; Rc to Rf each represent H, C1-6 alkyl group, cyclohexyl group, aryl group, aralkyl group or halogen atom; and m is a recurring number, and (B) a three dimensionally cross-linkable resin.
    Type: Grant
    Filed: February 9, 2001
    Date of Patent: January 11, 2005
    Assignee: Hitachi Chemical Co., Ltd.
    Inventors: Satoru Oota, Masami Yusa, Akira Nagai
  • Publication number: 20030027942
    Abstract: The present invention relates to a resin composition which gives a resin product with a low hygroscopic property, an adhesive for connecting a circuit member and a circuit board, and provides a resin composition, an adhesive for connecting a circuit member and a circuit board comprising (A) a polyhydroxy polyether resin represented by the 1
    Type: Application
    Filed: August 9, 2002
    Publication date: February 6, 2003
    Inventors: Satoru Oota, Masami Yusa, Akira Nagai