Patents by Inventor Satoru OTSUBO

Satoru OTSUBO has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11877401
    Abstract: A work machine including a holding head provided with multiple component holding tools; a moving device configured to move the holding head in a horizontal plane direction and a vertical direction; an imaging device provided with side lighting configured to emit light from a side direction onto leads of the components held by the component holding tools; and a control device, the control device is provided with a first lowering instruction section configured to lower the holding head such that the leads of at least two components held by at least two of the multiple component holding tools enter a lighting range of the side lighting, a first imaging instruction section configured to image the leads of the at least two components based on reflected light of the side lighting that is reflected by the leads of the components.
    Type: Grant
    Filed: May 31, 2017
    Date of Patent: January 16, 2024
    Assignee: FUJI CORPORATION
    Inventors: Takashi Awada, Satoru Otsubo
  • Patent number: 11345048
    Abstract: A mounting head includes a first air passage and a second air passage through which air is capable of flowing; a first valve configured to switch air flowing through the first air passage between positive pressure and negative pressure; a second valve configured to switch air flowing through the second air passage between positive pressure and negative pressure; a common air passage configured to communicate with the tool, through which air to be supplied to the tool is capable of flowing; and a third valve configured to selectively cause the first air passage or the second air passage to communicate with the common air passage.
    Type: Grant
    Filed: April 10, 2017
    Date of Patent: May 31, 2022
    Assignee: FUJI CORPORATION
    Inventors: Takashi Awada, Satoru Otsubo
  • Patent number: 10905040
    Abstract: A component feeder including a feeding mechanism configured to intermittently feed taped components in a feeding direction at a specified feeding pitch to a supply position; first lead cutting mechanism configured to, for separating the component positioned at the supply position from the carrier tape, in a case in which the component has three leads, cut two of the leads Leo that are on an outer side of the three leads at a given position such that a length by which the two leads protrudes from the component main body is a first length; and second lead cutting mechanism configured to, before the cutting of the two leads by the first lead cutting mechanism, cut a single lead that is at a center of the three leads positioned forward of the supply position in the feeding direction to a second length that is shorter than the first length.
    Type: Grant
    Filed: December 21, 2016
    Date of Patent: January 26, 2021
    Assignee: FUJI CORPORATION
    Inventor: Satoru Otsubo
  • Publication number: 20200214185
    Abstract: A work machine including a holding head provided with multiple component holding tools; a moving device configured to move the holding head in a horizontal plane direction and a vertical direction; an imaging device provided with side lighting configured to emit light from a side direction onto leads of the components held by the component holding tools; and a control device, the control device is provided with a first lowering instruction section configured to lower the holding head such that the leads of at least two components held by at least two of the multiple component holding tools enter a lighting range of the side lighting, a first imaging instruction section configured to image the leads of the at least two components based on reflected light of the side lighting that is reflected by the leads of the components.
    Type: Application
    Filed: May 31, 2017
    Publication date: July 2, 2020
    Applicant: FUJI CORPORATION
    Inventors: Takashi AWADA, Satoru OTSUBO
  • Patent number: 10687450
    Abstract: A component chuck device moves a pusher member downward when negative pressure is supplied, and holds a posture of a component by causing the pusher member to abut with an upper face of the component that is gripped in a gripping mechanism. Then, the component chuck device releases gripping of the component when supply of negative pressure is stopped, and a lead of the component is inserted into a hole of a substrate while holding the posture of the component by moving the pusher member downward while remaining abutted with the upper face of the component.
    Type: Grant
    Filed: September 29, 2015
    Date of Patent: June 16, 2020
    Assignee: FUJI CORPORATION
    Inventors: Junichi Yamamuro, Satoru Otsubo
  • Publication number: 20200114526
    Abstract: A mounting head includes a first air passage and a second air passage through which air is capable of flowing; a first valve configured to switch air flowing through the first air passage between positive pressure and negative pressure; a second valve configured to switch air flowing through the second air passage between positive pressure and negative pressure; a common air passage configured to communicate with the tool, through which air to be supplied to the tool is capable of flowing; and a third valve configured to selectively cause the first air passage or the second air passage to communicate with the common air passage.
    Type: Application
    Filed: April 10, 2017
    Publication date: April 16, 2020
    Applicant: FUJI CORPORATION
    Inventors: Takashi AWADA, Satoru OTSUBO
  • Publication number: 20200068753
    Abstract: A component feeder including a feeding mechanism configured to intermittently feed taped components in a feeding direction at a specified feeding pitch to a supply position; first lead cutting mechanism configured to, for separating the component positioned at the supply position from the carrier tape, in a case in which the component has three leads, cut two of the leads Leo that are on an outer side of the three leads at a given position such that a length by which the two leads protrudes from the component main body is a first length; and second lead cutting mechanism configured to, before the cutting of the two leads by the first lead cutting mechanism, cut a single lead that is at a center of the three leads positioned forward of the supply position in the feeding direction to a second length that is shorter than the first length.
    Type: Application
    Filed: December 21, 2016
    Publication date: February 27, 2020
    Applicant: FUJI CORPORATION
    Inventor: Satoru OTSUBO
  • Patent number: 10569351
    Abstract: A control device of soldering device identifies the type of lead component to be soldered when soldering multiple types of lead components sequentially with jet device and reads out a value of a soldering parameter corresponding to the lead component type from an HDD. Then, the control device controls jet device so that the lead component is soldered based on the value of the soldering parameter. As a result, the lead of the lead component is soldered with the value of the soldering parameter corresponding to the type of the lead component.
    Type: Grant
    Filed: August 1, 2016
    Date of Patent: February 25, 2020
    Assignee: FUJI CORPORATION
    Inventors: Satoru Otsubo, Noriaki Iwaki
  • Patent number: 10470350
    Abstract: A work machine including a flow device for flowing molten solder from under a circuit board, and a backup pin for supporting the circuit board from below while a lead of a leaded component is being inserted into a through-hole, which are moved separately under the circuit board. Thus, when the circuit board needs to be supported, the backup pin can be moved to any position, and when solder needs to be applied, the backup pin can be moved to a position that does not obstruct operation of the flow device. Accordingly, as well as guaranteeing operation of the flow device, it is possible to support the circuit board with the backup pin as required, thus improving practicality of the work machine.
    Type: Grant
    Filed: April 27, 2015
    Date of Patent: November 5, 2019
    Assignee: FUJI CORPORATION
    Inventors: Satoru Otsubo, Kazuya Degura
  • Patent number: 10413986
    Abstract: A soldering device includes a detection sensor which can detect a liquid level height of molten solder inside a solder bath. It is determined whether or not a detection height which is the detected liquid level height is greater than or equal to a first set height which is arbitrarily set. In a case where the detection height is greater than or equal to the first set height, it is estimated that the amount of molten solder capable of performing a soldering work for a predetermined number or more of boards is stored in the solder bath. The amount of molten solder stored in the solder bath is estimated by multiplying a difference between a detection height which is the detected liquid level height of the molten solder and a second set height which is preset, by an area inside the solder bath in a horizontal direction.
    Type: Grant
    Filed: June 23, 2015
    Date of Patent: September 17, 2019
    Assignee: FUJI CORPORATION
    Inventors: Kazuya Degura, Satoru Otsubo
  • Publication number: 20190176256
    Abstract: A control device of soldering device identifies the type of lead component to be soldered when soldering multiple types of lead components sequentially with jet device and reads out a value of a soldering parameter corresponding to the lead component type from an HDD. Then, the control device controls jet device so that the lead component is soldered based on the value of the soldering parameter. As a result, the lead of the lead component is soldered with the value of the soldering parameter corresponding to the type of the lead component.
    Type: Application
    Filed: August 1, 2016
    Publication date: June 13, 2019
    Applicant: FUJI CORPORATION
    Inventors: Satoru OTSUBO, Noriaki IWAKI
  • Patent number: 10285318
    Abstract: A component inserting machine includes a gripping device which grips leads of an insert component which is supplied to a component supplying section using a pair of clamp members, X and Y robots which move the gripping device, a lead imaging device which images the leads which are gripped by the clamp members, and a control section which detects lead positions from an image containing the leads which are imaged by the lead imaging device and inserts the leads which are gripped by one of the clamp members into the insertion holes by moving the gripping device using the X and Y robots based on the lead positions.
    Type: Grant
    Filed: August 7, 2013
    Date of Patent: May 7, 2019
    Assignee: FUJI CORPORATION
    Inventors: Haruaki Maeda, Satoru Otsubo, Tsuyoshi Hamane
  • Publication number: 20180263148
    Abstract: A component chuck device moves a pusher member downward when negative pressure is supplied, and holds a posture of a component by causing the pusher member to abut with an upper face of the component that is gripped in a gripping mechanism. Then, the component chuck device releases gripping of the component when supply of negative pressure is stopped, and a lead of the component is inserted into a hole of a substrate while holding the posture of the component by moving the pusher member downward while remaining abutted with the upper face of the component.
    Type: Application
    Filed: September 29, 2015
    Publication date: September 13, 2018
    Applicant: FUJI MACHINE MFG. CO., LTD.
    Inventors: Junichi YAMAMURO, Satoru OTSUBO
  • Publication number: 20180185946
    Abstract: A soldering device includes a detection sensor which can detect a liquid level height of molten solder inside a solder bath. It is determined whether or not a detection height which is the detected liquid level height is greater than or equal to a first set height which is arbitrarily set. In a case where the detection height is greater than or equal to the first set height, it is estimated that the amount of molten solder capable of performing a soldering work for a predetermined number or more of boards is stored in the solder bath. The amount of molten solder stored in the solder bath is estimated by multiplying a difference between a detection height which is the detected liquid level height of the molten solder and a second set height which is preset, by an area inside the solder bath in a horizontal direction.
    Type: Application
    Filed: June 23, 2015
    Publication date: July 5, 2018
    Applicant: FUJI MACHINE MFG. CO., LTD.
    Inventors: Kazuya DEGURA, Satoru Otsubo
  • Patent number: 9999168
    Abstract: A board conveyance device provided with multiple engaging sections that engage with a circuit board. When the conveyance direction is a first direction and the board is large, a claw out of two claws is set to a stopping state. A shuttle is moved up to the movement end on the downstream side in the first direction and two arms rotate. A lever rotates accompanying rotation of a rotating body to a disengaged position by a lever rotating section of a stopping device and an arm unit is able to be disconnected from a moving body. An arm holding section engages with an engaging section to prevent movement in the x direction. The moving body is moved in a second direction with the arm unit held by the stopping device. The claw is set to be in the stopping state and is not used in conveyance of the board.
    Type: Grant
    Filed: March 20, 2014
    Date of Patent: June 12, 2018
    Assignee: FUJI MACHINE MFG. CO., LTD.
    Inventors: Satoru Otsubo, Junichi Yamamuro
  • Publication number: 20180116080
    Abstract: A work machine including a flow device for flowing molten solder from under a circuit board, and a backup pin for supporting the circuit board from below while a lead of a leaded component is being inserted into a through-hole, which are moved separately under the circuit board. Thus, when the circuit board needs to be supported, the backup pin can be moved to any position, and when solder needs to be applied, the backup pin can be moved to a position that does not obstruct operation of the flow device. Accordingly, as well as guaranteeing operation of the flow device, it is possible to support the circuit board with the backup pin as required, thus improving practicality of the work machine.
    Type: Application
    Filed: April 27, 2015
    Publication date: April 26, 2018
    Applicant: FUJI MACHINE MFG. CO., LTD.
    Inventors: Satoru OTSUBO, Kazuya DEGURA
  • Publication number: 20170099750
    Abstract: A board conveyance device provided with multiple engaging sections that engage with a circuit board. When the conveyance direction is a first direction and the board is large, a claw out of two claws is set to a stopping state. A shuttle is moved up to the movement end on the downstream side in the first direction and two arms rotate. A lever rotates accompanying rotation of a rotating body to a disengaged position by a lever rotating section of a stopping device and an arm unit is able to be disconnected from a moving body. An arm holding section engages with an engaging section to prevent movement in the x direction. The moving body is moved in a second direction with the arm unit held by the stopping device. The claw is set to be in the stopping state and is not used in conveyance of the board.
    Type: Application
    Filed: March 20, 2014
    Publication date: April 6, 2017
    Applicant: FUJI MACHINE MFG. CO., LTD.
    Inventors: Satoru OTSUBO, Junichi YAMAMURO
  • Publication number: 20160198601
    Abstract: A component inserting machine includes a gripping device which grips leads of an insert component which is supplied to a component supplying section using a pair of clamp members, X and Y robots which move the gripping device, a lead imaging device which images the leads which are gripped by the clamp members, and a control section which detects lead positions from an image containing the leads which are imaged by the lead imaging device and inserts the leads which are gripped by one of the clamp members into the insertion holes by moving the gripping device using the X and Y robots based on the lead positions.
    Type: Application
    Filed: August 7, 2013
    Publication date: July 7, 2016
    Applicant: FUJI MACHINE MFG. CO., LTD.
    Inventors: Haruaki MAEDA, Satoru OTSUBO, Tsuyoshi HAMANE