Abstract: Provided are a semiconductor element bonding apparatus and a semiconductor element bonding method that do not cause a bonding material to protrude and also ensure adhesion, even when there are variations in a thickness of a semiconductor element or a workpiece and even when there are projections and depressions on surfaces. A semiconductor element bonding apparatus includes disposing means for disposing a workpiece and a semiconductor element at positions facing each other, moving means for moving the workpiece or the semiconductor element in a vertical direction, displacement measuring means for measuring displacement of the workpiece or the semiconductor element in the vertical direction, load measuring means for measuring a contact load between the workpiece and the semiconductor element with the bonding material interposed therebetween, and elastic modulus calculating means for calculating an elastic modulus from results of the measurement by the displacement measuring means and the load measuring means.

Abstract: A method for producing propylene oxide involves an oxidation step, a distillation step, an epoxidation step, and a separation step. The distillation step involves distilling the reaction mixture containing cumene hydroperoxide to separate it into a concentrate containing cumene hydroperoxide and a distillate. The reaction mixture is continuously distilled so that the ratio of the flow rate of the distillate to the flow rate of the reaction mixture to be distilled is 0.037 to 0.13. The epoxidation step involves obtaining a reaction mixture containing propylene oxide and cumyl alcohol by contacting the concentrate with propylene in the presence of a catalyst in one or more reactors to cause a reaction between propylene and cumene hydroperoxide in the concentrate, in which the outlet temperature of the final reactor is adjusted to 115° C. or more and less than 140° C.

Abstract: Provided are a semiconductor element bonding apparatus and a semiconductor element bonding method that do not cause a bonding material to protrude and also ensure adhesion, even when there are variations in a thickness of a semiconductor element or a workpiece and even when there are projections and depressions on surfaces. A semiconductor element bonding apparatus includes disposing means for disposing a workpiece and a semiconductor element at positions facing each other, moving means for moving the workpiece or the semiconductor element in a vertical direction, displacement measuring means for measuring displacement of the workpiece or the semiconductor element in the vertical direction, load measuring means for measuring a contact load between the workpiece and the semiconductor element with the bonding material interposed therebetween, and elastic modulus calculating means for calculating an elastic modulus from results of the measurement by the displacement measuring means and the load measuring means.

Abstract: A method for producing propylene oxide involves an oxidation step, a distillation step, an epoxidation step, and a separation step. The distillation step involves distilling the reaction mixture containing cumene hydroperoxide to separate it into a concentrate containing cumene hydroperoxide and a distillate. The reaction mixture is continuously distilled so that the ratio of the flow rate of the distillate to the flow rate of the reaction mixture to be distilled is 0.037 to 0.13. The epoxidation step involves obtaining a reaction mixture containing propylene oxide and cumyl alcohol by contacting the concentrate with propylene in the presence of a catalyst in one or more reactors to cause a reaction between propylene and cumene hydroperoxide in the concentrate, in which the outlet temperature of the final reactor is adjusted to 115° C. or more and less than 140° C.

Abstract: A method of manufacturing a semiconductor device may include interposing a bonding material between an electrode of a semiconductor element and a conductor, the bonding material being a material that is to be melted by heat; melting the bonding material by applying a current to the semiconductor element to cause the semiconductor element to generate heat; and cooling and solidifying the bonding material that is melted by stopping the current.

Abstract: A film carrier is provided with a film viewing window formed therein and a loop forming device between the film viewing window and a film exposing window. Prior to printing, a film is inspected through the film viewing window to input position and exposure correction data for each frame of the film. The film is adjusted automatically in position in the film exposing window according to the position correction data. At the film exposure window the inspected film is subjected by a scanner only to measuring (to find an exposure) and exposing. To print a half size of 135 film in place of a full size of 135 film, the film carrier is turned 90.degree., directing the half size of the frame in the same direction as the full size frame and placing the film viewing window on the side of an operator.

Abstract: A heating resistor drive circuit includes a first switching transistor, connected in series to the resistor, for connecting and cutting off a current flow supplied from a power source to the heating resistor, and a second switching transistor connected in series to the base of the first transistor. The second transistor is turned on in response to an actuation signal. The drive circuit further includes a suppressing circuit for raising gradually a base current for the first transistor up to a predetermined level while the second transistor is conductive, so as to suppress a current spike flowing through the heating resistor.

Abstract: A shutter driving apparatus for use in a photographic printer to drive a shutter for opening and closing the path of light which is incident on a photographic paper comprises a pulse motor for causing the shutter to pivot so as to open and close the light path, first and second stoppers which are arranged to come into contact with the pivoting shutter to thereby dispose it in a position for opening the light path and a position for closing the light path, respectively, a controller for suspending the operation of the pulse motor when the shutter which is being pivoted in the direction for closing the light path by means of the pulse motor reaches a position which is immediately in front of the light path closing position, and a spring for biasing the shutter toward the light path closing position with torque which is smaller than the starting torque and holding torque of the pulse motor and greater than the detent torque thereof.