Abstract: A heat source system includes a heat source machine, a cooling tower side outward path and a cooling tower side return path that are connected to the heat source machine, a load side outward path and a load side return path that are connected to the heat source machine, a heat exchange path provided in one of the load side return path and the cooling tower side outward path, a heat exchanger that performs heat exchange between the heat exchange path and the other one of the load side return path and the cooling tower side outward path, and a heat exchange adjustment valve capable of adjusting a flow rate of the heat exchange path.

Abstract: Disclosed is a conductive rubber roller, comprising a core metal shaft, an ionic conductive layer formed to surround the outer circumferential surface of the core metal shaft and consisting of a high molecular weight elastomer containing an ionic conducting agent or a foamed body of such a high molecular weight elastomer, an electron conductive layer formed to surround the outer circumferential surface of the ionic conductive layer and consisting of a high molecular weight cellular elastomer containing an electron conducting agent or a high molecular weight cellular elastomer containing an electron conducting agent, a toner contamination preventing layer formed to surround the outer circumferential surface of the electron conductive layer, and an insulating annular sealing member mounted to each of both edges of the ionic conductive layer and the electron conductive layer both extending in the longitudinal direction of the metal core wherein a relationship R1>R2>R3, where R1, R2 and R3 denote, respectiv

Abstract: A method for fabricating isolated regions for a dielectric isolated complementary integrated circuit which avoids the difficulty of mask alignment and patterning on a deeply etched uneven surface of the substrate by aligning the patterns before etching and thereby forming p-type and n-type islands at the same time. A poly-silicon layer is grown on the surface of the substrate covering the islands and the substrate is removed from its back surface, leaving the islands embedded in the poly-silicon layer which becomes a new substrate.