Patents by Inventor Satoru TERUUCHI

Satoru TERUUCHI has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20220013387
    Abstract: A substrate processing system includes a substrate processing apparatus and a control device. The substrate processing apparatus includes a chamber, and a placing table provided inside the chamber. The placing table places a substrate thereon, and includes a base and an electrostatic chuck provided on an upper surface of the base. The electrostatic chuck has a plurality of division regions each provided with a heater therein. The substrate processing system also includes a control device that includes a measuring unit that measures a resistance value of the heater for each of the division regions, an estimating unit that estimates a temperature of each of the division regions based on the resistance value of the heater measured by the measuring unit, and a power controller that controls a power supplied to the heater for each of the division regions based on the temperature estimated by the estimating unit.
    Type: Application
    Filed: September 24, 2021
    Publication date: January 13, 2022
    Applicant: TOKYO ELECTRON LIMITED
    Inventors: Kenichiro YAMADA, Satoru TERUUCHI, Kenichiro NAKAMURA, Takari YAMAMOTO
  • Publication number: 20200266081
    Abstract: A placing table on an embodiment includes a supporting member and a base. The supporting member includes a placing region provided with a heater, and an outer peripheral region surrounding the placing region. The base includes a first region supporting the placing region thereon, and a second region surrounding the first region. In the second region, through holes are formed. Wirings electrically connected to the heater passes through the through holes of the second region.
    Type: Application
    Filed: May 4, 2020
    Publication date: August 20, 2020
    Applicant: Tokyo Electron Limited
    Inventors: Dai KITAGAWA, Katsuyuki KOIZUMI, Tsutomu NAGAI, Daisuke HAYASHI, Satoru TERUUCHI
  • Patent number: 10699883
    Abstract: A plasma processing apparatus according to an embodiment includes a processing container, a mounting table, a plurality of heaters, and a power supply device. The mounting table is provided in the processing container. The plurality of heaters are provided in the mounting table. The power supply device supplies electric power to the plurality of heaters. The power supply device includes a plurality of transformers and a plurality of zero-cross control type solid state relays (SSRs). The plurality of transformers are configured to step down a voltage from an alternating-current power source. Each of the plurality of transformers includes a primary coil and a secondary coil. The primary coil is connected to the alternating-current power source. Each of the plurality of SSRs is provided between one corresponding heater among the plurality of heaters and the secondary coil of one corresponding transformer among the plurality of transformers.
    Type: Grant
    Filed: June 1, 2015
    Date of Patent: June 30, 2020
    Assignee: TOKYO ELECTRON LIMITED
    Inventor: Satoru Teruuchi
  • Patent number: 10679869
    Abstract: A placing table on an embodiment includes a supporting member and a base. The supporting member includes a placing region provided with a heater, and an outer peripheral region surrounding the placing region. The base includes a first region supporting the placing region thereon, and a second region surrounding the first region. In the second region, through holes are formed. Wirings electrically connected to the heater passes through the through holes of the second region.
    Type: Grant
    Filed: June 1, 2015
    Date of Patent: June 9, 2020
    Assignee: TOKYO ELECTRON LIMITED
    Inventors: Dai Kitagawa, Katsuyuki Koizumi, Tsutomu Nagai, Daisuke Hayashi, Satoru Teruuchi
  • Publication number: 20170372928
    Abstract: Disclosed is a substrate processing system including a substrate processing apparatus; and a control device that controls the substrate processing apparatus. The substrate processing apparatus includes: a chamber; a placing table provided within the chamber; and heaters embedded in the placing table corresponding to division regions, respectively. The control device includes: a holding unit that holds a table for each of the division regions; a measuring unit that measures the resistance value of each of the heaters embedded in the placing table for each of the division regions; and a controller that estimates a temperature of each of the division regions corresponding to the resistance value of each of the heaters measured by the measuring unit with reference to the table for each of the division regions, and controls an electric power to be supplied to each of the heaters so that the estimated temperature becomes a target temperature.
    Type: Application
    Filed: June 22, 2017
    Publication date: December 28, 2017
    Applicant: TOKYO ELECTRON LIMITED
    Inventors: Kenichiro YAMADA, Satoru TERUUCHI, Kenichiro NAKAMURA, Takari YAMAMOTO
  • Publication number: 20170140954
    Abstract: A placing table on an embodiment includes a supporting member and a base. The supporting member includes a placing region provided with a heater, and an outer peripheral region surrounding the placing region. The base includes a first region supporting the placing region thereon, and a second region surrounding the first region. In the second region, through holes are formed. Wirings electrically connected to the heater passes through the through holes of the second region.
    Type: Application
    Filed: June 1, 2015
    Publication date: May 18, 2017
    Applicant: TOKYO ELECTRON LIMITED
    Inventors: Dai KITAGAWA, Katsuyuki KOIZUMI, Tsutomu NAGAI, Daisuke HAYASHI, Satoru TERUUCHI
  • Publication number: 20170110297
    Abstract: A plasma processing apparatus according to an embodiment includes a processing container, a mounting table, a plurality of heaters, and a power supply device. The mounting table is provided in the processing container. The plurality of heaters are provided in the mounting table. The power supply device supplies electric power to the plurality of heaters. The power supply device includes a plurality of transformers and a plurality of zero-cross control type solid state relays (SSRs). The plurality of transformers are configured to step down a voltage from an alternating-current power source. Each of the plurality of transformers includes a primary coil and a secondary coil. The primary coil is connected to the alternating-current power source. Each of the plurality of SSRs is provided between one corresponding heater among the plurality of heaters and the secondary coil of one corresponding transformer among the plurality of transformers.
    Type: Application
    Filed: June 1, 2015
    Publication date: April 20, 2017
    Applicant: TOKYO ELECTRON LIMITED
    Inventor: Satoru TERUUCHI