Abstract: The invention relates to a liquid resin composition for electronic components which is used in sealing of electronic components, comprising a liquid epoxy resin, a curing agent containing a liquid aromatic amine, and an inorganic filler, and further comprising at least one member selected from a hardening accelerator, silicone polymer particles, and a nonionic surfactant. There is thereby provided a liquid resin composition for electronic components, which is excellent in fluidity in narrow gaps, is free of void generation, is excellent in adhesiveness and low-stress characteristic and is excellent in fillet formation, as well as an electronic component device having high reliability (moisture resistance, thermal shock resistance), which is sealed therewith.

Abstract: The present invention provides a liquid resin composition for electronic part sealing that is good in fluidity in a narrow gap, being free from void generation, and that excels in fillet formation; and an electronic part apparatus sealed thereby of high reliability (moisture resistance and thermal shock resistance). The liquid resin composition for electronic part sealing is characterized by comprising (A) an epoxy resin including a liquid epoxy resin, (B) a hardening agent including a liquid aromatic amine, (C) a hydrazide compound having an average particle diameter of less than 2 ?m, and (D) an inorganic filler having an average particle diameter of less than 2 ?m.

Abstract: The present invention provides a liquid resin composition for electronic part sealing that is good in fluidity in a narrow gap, being free from void generation, and that excels in fillet formation; and an electronic part apparatus sealed thereby of high reliability (moisture resistance and thermal shock resistance). The liquid resin composition for electronic part sealing is characterized by comprising (A) an epoxy resin including a liquid epoxy resin, (B) a hardening agent including a liquid aromatic amine, (C) a hydrazide compound having an average particle diameter of less than 2 ?m, and (D) an inorganic filler having an average particle diameter of less than 2 ?m.

Abstract: The invention relates to a liquid resin composition for electronic components which is used in sealing of electronic components, comprising a liquid epoxy resin, a curing agent containing a liquid aromatic amine, and an inorganic filler, and further comprising at least one member selected from a hardening accelerator, silicone polymer particles, and a nonionic surfactant. There is thereby provided a liquid resin composition for electronic components, which is excellent in fluidity in narrow gaps, is free of void generation, is excellent in adhesiveness and low-stress characteristic and is excellent in fillet formation, as well as an electronic component device having high reliability (moisture resistance, thermal shock resistance), which is sealed therewith.

Abstract: An encapsulating epoxy resin composition comprising an epoxy resin which is liquid at normal temperature, a curing agent containing an aromatic amine which is liquid at normal temperature, an inorganic filler, and rubber particles; an encapsulant comprising this composition; and an electronic device having an encapsulating member comprising a cured product of this encapsulant.

Abstract: In a magnetic recording medium comprising a magnetic layer of 0.05-0.15 &mgr;m thick containing at least a magnetic powder and a binder on a non-magnetic substrate, a diamond-like carbon film of 5-30 nm thick is formed on the magnetic layer by plasma CVD, and a lubricating layer is formed thereon. The medium has improved friction properties and durability.

Abstract: A magnetic recording medium comprising a non-magnetic base having on at least one side a non-magnetic layer (undercoat) containing electron beam-curable resins which in turn is over-laid with a magnetic layer (topcoat) containing an iron (Fe) based magnetic powder, said magnetic layer having a glass transition temperature (Tg) of at least 65.degree. C. and said non-magnetic layer being an electron beam cured coating that is formed by coating the non-magnetic base with a non-magnetic coating mix containing electron beam curable resins, the yet to be cured coating having a glass transition temperature (Tg) of 30-53.degree. C. and said electron beam curable resins comprising an electron beam curable vinyl chloride based resin having a sulfur-containing polar group and an electron beam curable urethane resin having a phosphorus-containing polar group.

Abstract: An epoxy resin composition for sealing a photo-semiconductor element, comprising(A) an epoxy resin,(B) a curing agent and(C) a polyether-modified silicone oil which is represented by the following general formula (1) ##STR1## wherein m, n and a are each independently a number of 1 or more, b is 0 or a positive number, and R is an alkyl group of 1 to 6 carbon atoms or H,and has a weight average molecular weight of 1,000 to 100,000, a silicone unit content {[(m+n+2)/(m+n+2+a+b+1)].times.100} of 10 to 60% and a polyether unit content {[(a+b+1)/(m+n+2+a+b+1)].times.100} of 40 to 90%and a photo-semiconductor device produced by sealing a photo-semiconductor element with the epoxy resin composition.

Abstract: A magnetic recording medium having excellent electromagnetic characteristics in the medium and high frequency regions has a magnetic layer formed on a non-magnetic support or a non-magnetic under layer, said magnetic layer comprising a magnetic metal powder containing iron (Fe) as a main component, 18 to 40% by weight of Co based on iron, Al and Y or a rare earth element, and having a specific surface area (x) by the BET method not exceeding 60 m.sup.2 /g, in which said magnetic metal powder has a saturation magnetization (.sigma.s) (y) and a specific surface area (x) by the BET method within the range bounded by the following four equations:y=0.05x.sup.2 -6x+330 (1)y=0.05x.sup.

Abstract: A magnetic recording medium includes a flexible substrate, an undercoating layer formed on the substrate, and a magnetic layer formed on the undercoating layer. The undercoating layer contains a binder and nonmagnetic particles having an average particle size in the range of 0.01 to 0.20 .mu.m. The content of the nonmagnetic particles in the undercoating layer is in the range of 40 to 85% by weight. The magnetic layer contains ferromagnetic powder, a binder and an abrasive having an average particle size in the range of 0.10 to 0.40 .mu.m. The magnetic layer has a thickness in the range of 0.10 to 0.30 .mu.m and contains the abrasive in the range of 1 to 5 parts by weight relative to 100 parts by weight of the ferromagnetic powder. With this arrangement, the magnetic recording medium is capable of high density recording and excellent in electromagnetic transducer property and durability.

Abstract: An epoxy resin composition for sealing a photosemiconductor element includes(A) an epoxy resin component which comprises an epoxy resin having at least three epoxy groups per molecule,(B) a phenolic resin component which is represented by the following general formula (I) and has a phenolic hydroxyl group equivalent weight (g/eq) of 200 to 800, and(C) a cure accelerator component, ##STR1## wherein n is an integer of from 0 to 14, the phenolic resin component being a mixture of at least two phenolic resins represented by the general formula (I) with at least two different values of n, the resin with n=0 being not more than 20% by weight of the phenolic resin component;and a photosemiconductor device is sealed with the epoxy resin composition.