Patents by Inventor Satoru Yanagisawa

Satoru Yanagisawa has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • PUNCHED ADHESIVE TAPE FOR SEMICCONDUCTOR, METHOD OF MANUFACTURING LEAD FRAME WITH THE ADHESIVE TAPE, LEAD FRAME WITH THE ADHESIVE TAPE, AND SEMICONDUCTOR DEVICE COMPRISING THE LEAD FRAME
    Publication number: 20090022893
    Abstract: A punched adhesive tape for semiconductor which is made by punching an adhesive tape comprising a base film and an adhesive layer provided on one or each side of the base film to mark the regions in the adhesive tape where contaminants or defects are contained; a method of producing an adhesive tape-bearing lead frame by punching the punched adhesive tape for semiconductor, with the parts containing the punched holes skipped over, and applying the adhesive tape pieces punched out from the punched adhesive tape for semiconductor to a lead frame; a semiconductor device fabricated by using the adhesive-bearing lead frame.
    Type: Application
    Filed: September 24, 2008
    Publication date: January 22, 2009
    Inventors: Yoshiyuki Tanabe, Yoshihiro Nomura, Hiroshi Kirihara, Youichi Hosokawa, Shinji Iioka, Satoru Yanagisawa
  • Punched adhesive tape for semiconductor, method of manufacturing lead frame with the adhesive tape, lead frame with the adhesive tape, and semiconductor device comprising the lead frame
    Patent number: 7449076
    Abstract: A punched adhesive tape for semiconductor which is made by punching an adhesive tape comprising a base film and an adhesive layer provided on one or each side of the base film to mark the regions in the adhesive tape where contaminants or defects are contained; a method of producing an adhesive tape-bearing lead frame by punching the punched adhesive tape for semiconductor, with the parts containing the punched holes skipped over, and applying the adhesive tape pieces punched out from the punched adhesive tape for semiconductor to a lead frame; a semiconductor device fabricated by using the adhesive-bearing lead frame.
    Type: Grant
    Filed: October 4, 2005
    Date of Patent: November 11, 2008
    Assignee: Hitachi Chemical Company, Ltd.
    Inventors: Yoshiyuki Tanabe, Yoshihiro Nomura, Hiroshi Kirihara, Youichi Hosokawa, Shinji Iioka, Satoru Yanagisawa
  • Punched adhesive tape for semiconductor, method of manufacturing lead frame with the adhesive tape, lead frame with the adhesive tape, and semiconductor device comprising the lead frame
    Patent number: 7273654
    Abstract: A punched adhesive tape for semiconductor which is made by punching an adhesive tape comprising a base film and an adhesive layer provided on one or each side of the base film to mark the regions in the adhesive tape where contaminants or defects are contained; a method of producing an adhesive tape-bearing lead frame by punching the punched adhesive tape for semiconductor, with the parts containing the punched holes skipped over, and applying the adhesive tape pieces punched out from the punched adhesive tape for semiconductor to a lead frame; a semiconductor device fabricated by using the adhesive-bearing lead frame.
    Type: Grant
    Filed: September 19, 2002
    Date of Patent: September 25, 2007
    Assignee: Hitachi Chemical Company, Ltd.
    Inventors: Yoshiyuki Tanabe, Yoshihiro Nomura, Hiroshi Kirihara, Youichi Hosokawa, Shinji Iioka, Satoru Yanagisawa
  • Punched adhesive tape for semiconductor, method of manufacturing lead frame with the adhesive tape, lead frame with the adhesive tape, and semiconductor device comprising the lead frame
    Publication number: 20060027312
    Abstract: A punched adhesive tape for semiconductor which is made by punching an adhesive tape comprising a base film and an adhesive layer provided on one or each side of the base film to mark the regions in the adhesive tape where contaminants or defects are contained; a method of producing an adhesive tape-bearing lead frame by punching the punched adhesive tape for semiconductor, with the parts containing the punched holes skipped over, and applying the adhesive tape pieces punched out from the punched adhesive tape for semiconductor to a lead frame; a semiconductor device fabricated by using the adhesive-bearing lead frame.
    Type: Application
    Filed: October 4, 2005
    Publication date: February 9, 2006
    Inventors: Yoshiyuki Tanabe, Yoshihiro Nomura, Hiroshi Kirihara, Youichi Hosokawa, Shinji Iioka, Satoru Yanagisawa
  • Punched adhesive tape for semiconductor, method of manufacturing lead frame with the adhesive tape, lead frame with the adhesive tape, and semiconductor device comprising the lead frame
    Patent number: 6523446
    Abstract: A punched adhesive tape for semiconductor which is made by punching an adhesive tape comprising a base film and an adhesive layer provided on one or each side of the base film to mark the regions in the adhesive tape where contaminants or defects are contained; a method of producing an adhesive tape-bearing lead frame by punching the punched adhesive tape for semiconductor, with the parts containing the punched holes skipped over, and applying the adhesive tape pieces punched out from the punched adhesive tape for semiconductor to a lead frame; a semiconductor device fabricated by using the adhesive-bearing lead frame.
    Type: Grant
    Filed: January 18, 2000
    Date of Patent: February 25, 2003
    Assignee: Hitachi Chemical Company, Ltd.
    Inventors: Yoshiyuki Tanabe, Yoshihiro Nomura, Hiroshi Kirihara, Youichi Hosokawa, Shinji Iioka, Satoru Yanagisawa
  • Punched adhesive tape for semiconductor, method of manufacturing lead frame with the adhesive tape, lead frame with the adhesive tape, and semiconductor device comprising the lead frame
    Publication number: 20030021990
    Abstract: A punched adhesive tape for semiconductor which is made by punching an adhesive tape comprising a base film and an adhesive layer provided on one or each side of the base film to mark the regions in the adhesive tape where contaminants or defects are contained; a method of producing an adhesive tape-bearing lead frame by punching the punched adhesive tape for semiconductor, with the parts containing the punched holes skipped over, and applying the adhesive tape pieces punched out from the punched adhesive tape for semiconductor to a lead frame; a semiconductor device fabricated by using the adhesive-bearing lead frame.
    Type: Application
    Filed: September 19, 2002
    Publication date: January 30, 2003
    Inventors: Yoshiyuki Tanabe, Yoshihiro Nomura, Hiroshi Kirihara, Youichi Hosokawa, Shinji Iioka, Satoru Yanagisawa