Patents by Inventor Satoru Yokouchi

Satoru Yokouchi has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 7253702
    Abstract: A high-frequency switch module, including a laminate constituted of dielectric layers having electrode patterns, the high-frequency switch module also including a high-frequency switch circuit for switching a transmitting circuit and a receiving circuit of transmitting/receiving systems, and a filter circuit connected to a receiving side of the high-frequency switch circuit.
    Type: Grant
    Filed: November 1, 2001
    Date of Patent: August 7, 2007
    Assignee: Hitachi Metals, Ltd.
    Inventors: Shigeru Kemmochi, Mitsuhiro Watanabe, Hiroyuki Tai, Keisuke Fukamachi, Satoru Yokouchi
  • Patent number: 7057472
    Abstract: A multi-band antenna switch circuit including a diplexer connected to an antenna terminal for demultiplexing signals of different passing bands, a first and a second switch circuit for switching a high frequency signal and a low frequency signal demultiplexed by the diplexer to a plurality of transmission/reception terminals, a first and a second low pass filter connected to a transmission path between the diplexer and the transmission terminal or between the first and the second switch circuit and the transmission terminal, and a notch filter provided between the diplexer and the first switch circuit or between the diplexer and the second switch circuit.
    Type: Grant
    Filed: August 12, 2002
    Date of Patent: June 6, 2006
    Assignee: Hitachi Metals, Ltd.
    Inventors: Keisuke Fukamachi, Shigeru Kemmochi, Mitsuhiro Watanabe, Tsuyoshi Taketa, Hiroyuki Tai, Satoru Yokouchi
  • Patent number: 7026887
    Abstract: A high-frequency module is connected to a transmitting circuit, a receiving circuit, and an antenna to control the connections between the transmitting circuit and the antenna and between the receiving circuit and the antenna. The module includes means for controlling transmitted signals, which includes a first phase-shift circuit and a high-frequency amplifier provided between the antenna and the transmitting circuit. The high-frequency amplifier and the first phase-shift circuit are integrated into a module composed of a plurality of dielectric layers.
    Type: Grant
    Filed: October 25, 2004
    Date of Patent: April 11, 2006
    Assignee: Hitachi Metals, LTD
    Inventors: Mitsuhiro Watanabe, Shigeru Kemmochi, Tsuyoshi Taketa, Hiroyuki Tai, Satoru Yokouchi
  • Publication number: 20050077980
    Abstract: A high-frequency module is connected to a transmitting circuit (TX), a receiving circuit (RX) and an antenna (ANT) to control the connections between the transmitting circuit (TX) and the antenna (ANT) and between the receiving circuit (RX) and the antenna (ANT). The module comprises means (2) for controlling transmitted signals, which includes a first phase-shift circuit (5) and a high-frequency amplifier (4) provided between the antenna (ANT) and the transmitting circuit (TX). The high-frequency amplifier (4) and the first phase-shift circuit (5) are integrated into a module composed of a plurality of dielectric layers.
    Type: Application
    Filed: October 25, 2004
    Publication date: April 14, 2005
    Inventors: Mitsuhiro Watanabe, Shigeru Kemmochi, Tsuyoshi Taketa, Hiroyuki Tai, Satoru Yokouchi
  • Patent number: 6847269
    Abstract: A high-frequency module is connected to a transmitting circuit (TX), a receiving circuit (RX) and an antenna (ANT) to control the connections between the transmitting circuit (TX) and the antenna (ANT) and between the receiving circuit (RX) and the antenna (ANT). The module comprises means (2) for controlling transmitted signals, which includes a first phase-shift circuit (5) and a high-frequency amplifier (4) provided between the antenna (ANT) and the transmitting circuit (TX). The high-frequency amplifier (4) and the first phase-shift circuit (5) are integrated into a module composed of a plurality of dielectric layers.
    Type: Grant
    Filed: March 15, 2001
    Date of Patent: January 25, 2005
    Assignee: Hitachi Metals, Ltd.
    Inventors: Mitsuhiro Watanabe, Shigeru Kemmochi, Tsuyoshi Taketa, Hiroyuki Tai, Satoru Yokouchi
  • Publication number: 20040266378
    Abstract: A multi-band antenna switch circuit including a diplexer connected to an antenna terminal for demultiplexing signals of different passing bands, a first and a second switch circuit for switching a high frequency signal and a low frequency signal demultiplexed by the diplexer to a plurality of transmission/reception terminals, a first and a second low pass filter connected to a transmission path between the diplexer and the transmission terminal or between the first and the second switch circuit and the transmission terminal, and a notch filter provided between the diplexer and the first switch circuit or between the diplexer and the second switch circuit.
    Type: Application
    Filed: August 27, 2004
    Publication date: December 30, 2004
    Inventors: Keisuke Fukamachi, Shigeru Kemmochi, Mitsuhiro Watanabe, Tsuyoshi Taketa, Hiroyuki Tai, Satoru Yokouchi
  • Publication number: 20040032706
    Abstract: A high-frequency switch module which comprises a high-frequency switch circuit connected among an antenna, a transmission circuit, and a reception circuit and comprising switching elements and a surface acoustic wave filter connected between the high-frequency switch circuit and the reception circuit, uses a laminate constituted of dielectric layers having electrode patterns as the multilayered board, and has a phase correction circuit disposed between the switch circuit and the surface acoustic wave filter, wherein the high-frequency switch circuit comprises a switching element, a transmission line, and a capacitor as main elements, with at least a part of the transmission line and the capacitor constituted of an electrode pattern in the laminate, and with the surface acoustic wave filter mounted on the laminate.
    Type: Application
    Filed: September 16, 2003
    Publication date: February 19, 2004
    Inventors: Shigeru Kemmochi, Mitsuhiro Watanabe, Hiroyuki Tai, Keisuke Fukamachi, Satoru Yokouchi
  • Publication number: 20020180556
    Abstract: A high-frequency module is connected to a transmitting circuit (TX), a receiving circuit (RX) and an antenna (ANT) to control the connections between the transmitting circuit (TX) and the antenna (ANT) and between the receiving circuit (RX) and the antenna (ANT) The module comprises means (2) for controlling transmitted signals, which includes a first phase-shift circuit (5) and a high-frequency amplifier (4) provided between the antenna (ANT) and the transmitting circuit (TX). The high frequency amplifier (4) and the first phase-shift circuit (5) are integrated into a module composed of a plurality of dielectric layers.
    Type: Application
    Filed: November 15, 2001
    Publication date: December 5, 2002
    Inventors: Mitsuhiro Watanabe, Shigeru Kemmochi, Tsuyoshi Taketa, Hiroyuki Tai, Satoru Yokouchi