Abstract: A silver-coated composite material for movable contact parts, which has: an underlying layer composed of any one of nickel, cobalt, a nickel alloy, and a cobalt alloy at least provided on a part of the surface of a stainless steel substrate; an intermediate layer composed of copper or a copper alloy provided thereon; and a silver or silver alloy layer provided thereon as an outermost layer, wherein a thickness of the intermediate layer is 0.05 to 0.3 ?m, and wherein an average grain size of the silver or silver alloy provided as the outermost layer is 0.5 to 5.0 ?m.

Abstract: Provided is a multilayer printed board 10 having three single-sided conductor pattern films 16 each having a conductor pattern 13 formed on one surface of a resin film 12 having a through hole 11 and a filled through hole 15 that is the through hole 11 filled with a conductor 14 integrally with the conductor pattern 13. These single-sided conductor pattern films 16 are stacked in such a manner that their tops are oriented in the same way. The conductor patterns 13 of the single-sided conductor pattern films 16 are electrically connected via the filled through holes 15. As the conductor patterns 13 of the single-sided conductor pattern films 16 are interlayer connected via the filled through holes 15, the interlayer connection reliability can be enhanced.

Abstract: A composite material for an electrical/electronic part, which is used as a material for use in an electrical/electronic part, containing: a metal base material having at least a surface formed of Cu or a Cu alloy; and an insulating film provided on at least a part of the metal base material; wherein a metal layer having Cu diffused in Ni or a Ni alloy is interposed between the metal base material and the insulating film; and wherein the ratio of the number of Cu atoms to the number of Ni atoms (Cu/Ni) obtained by analyzing the outermost surface of the metal layer by Auger electron spectroscopy is 0.005 or more.

Abstract: A silver-coated composite material for movable contact parts, which has: an underlying layer composed of any one of nickel, cobalt, a nickel alloy, and a cobalt alloy at least provided on a part of the surface of a stainless steel substrate; an intermediate layer composed of copper or a copper alloy provided thereon; and a silver or silver alloy layer provided thereon as an outermost layer, wherein a thickness of the intermediate layer is 0.05 to 0.3 ?m, and wherein an average grain size of the silver or silver alloy provided as the outermost layer is 0.5 to 5.0 ?m.

Abstract: A composite material for an electrical/electronic part, which is used as a material for use in an electrical/electronic part formed by punching process, containing a metal base material of, for example, a copper-type metal material and a substantially one layer of an insulating film provided on at least a part of the metal base material, in which a metal layer formed of Ni or a Ni—Zn alloy is interposed between said metal base material and said insulating film, such that the peel width of said insulating film at the end of the material obtained after said punching process, is less than 10 ?m.

Abstract: A method for manufacturing a metal clad laminate having a film and a metal layer formed of a foundation layer and an upper layer includes the steps of forming the foundation layer on at least a part of a surface of the film by plating to obtain a first laminate; forming the upper layer on the first laminate by plating to obtain a second laminate; and heating the second laminate to obtain the metal clad laminate. Further, the film is a flexible thermoplastic polymer film, the foundation layer is formed of a nickel alloy, the upper layer is formed of copper, at least one of the foundation layer and the upper layer has a compression stress before the step of heating the second laminate, and the metal clad laminate shrinks in a planar direction of the film during the step of heating the second laminate.

Abstract: A through-hole type laminated circuit board is given with high reliability of electrical connection using copper foil and conductive paste containing low melting point metal without generating harmful void and crack at boundary between the copper foil and conductive paste metal. The laminated circuit board is made by laminating a multiple number of resin boards with roughening treated copper foils at least on their one surface sides with roughening projection deposition of less than 150 mg/dm2 to make surface roughness Rz of 0.3 to 10 ?m and height of the projection to be 0.3 to 10 ?m. Surface roughness of the original foil is 0.1 to 5 ?m and the amount of copper metal atoms of roughening treated layer is set at 4 times or less than the amount of diffusible conductive paste metal atoms containing low melting point metal into the roughening treated layer on the foil surface.

Abstract: A composite material for an electrical/electronic part, which is used as a material for use in an electrical/electronic part, containing: a metal base material having at least a surface formed of Cu or a Cu alloy; and an insulating film provided on at least a part of the metal base material; wherein a metal layer having Cu diffused in Ni or a Ni alloy is interposed between the metal base material and the insulating film; and wherein the ratio of the number of Cu atoms to the number of Ni atoms (Cu/Ni) obtained by analyzing the outermost surface of the metal layer by Auger electron spectroscopy is 0.005 or more.

Abstract: A composite material for an electrical/electronic part, which is used as a material for use in an electrical/electronic part formed by punching process, containing a metal base material of, for example, a copper-type metal material and a substantially one layer of an insulating film provided on at least a part of the metal base material, in which a metal layer formed of Ni or a Ni—Zn alloy is interposed between said metal base material and said insulating film, such that the peel width of said insulating film at the end of the material obtained after said punching process, is less than 10 ?m.

Abstract: Provided is a multilayer printed board 10 having three single-sided conductor pattern films 16 each having a conductor pattern 13 formed on one surface of a resin film 12 having a through hole 11 and a filled through hole 15 that is the through hole 11 filled with a conductor 14 integrally with the conductor pattern 13. These single-sided conductor pattern films 16 are stacked in such a manner that their tops are oriented in the same way. The conductor patterns 13 of the single-sided conductor pattern films 16 are electrically connected via the filled through holes 15. As the conductor patterns 13 of the single-sided conductor pattern films 16 are interlayer connected via the filled through holes 15, the interlayer connection reliability can be enhanced.

Abstract: With respect to a metal clad laminate wherein a metal layer is to be formed for at least a part of a surface of a flexible polymer film, it becomes clear that it is able to suppress any warpage of the laminate by performing a heat treatment and then a cooling treatment under a state of loading a tension within a range capable of maintaining the laminate to be a flat configuration consistently during the period from heating to cooling. Moreover, it becomes clear that it is able to suppress the warpage without occurrences of an elongation deformation and/or a fracture for the obtained metal clad laminate, by controlling a tension to be loaded at the period of the heat treatment as between 0.03% and 0.3% of a tensile strength in a direction of the tension for the substratum polymer film.

Abstract: A method for manufacturing a metal clad laminate having a film and a metal layer formed of a foundation layer and an upper layer includes the steps of forming the foundation layer on at least a part of a surface of the film by plating to obtain a first laminate; forming the upper layer on the first laminate by plating to obtain a second laminate; and heating the second laminate to obtain the metal clad laminate. Further, the film is a flexible thermoplastic polymer film, the foundation layer is formed of a nickel alloy, the upper layer is formed of copper, at least one of the foundation layer and the upper layer has a compression stress before the step of heating the second laminate, and the metal clad laminate shrinks in a planar direction of the film during the step of heating the second laminate.

Abstract: The invention provides a composite material for an electric and electronic component, formed by punching, followed by bending. The composite material includes a metallic base material, an insulating film having a substantially single-layer structure provided on at least a part of the metallic base material, and a metal layer provided between the metallic base material and the insulating film so that a peeling width of the insulating film at the end of the material after punching is less than 10 ?m. After bending, the adhesion of the insulating film on the inner side of the bent material is retained. The invention also provides the electric and electronic component using the composite material, and a method for manufacturing the composite material for the electric and electronic component.

Abstract: An inexpensive conductive base material with a thin film resistance layer having small variation of the sheet resistance value and a conductive base material with a resistance layer enabling production of a printed resistor circuit board by stably leaving behind resistance elements, that is, a conductive base material with a thin film resistance layer comprised of a conductive base material having a resistance layer formed on its surface wherein the resistance layer includes Ni containing P and an amorphous and a crystalloid form are mixed together and a conductive base material with a thin film resistance layer comprised of a conductive base material having a resistance layer formed on its surface wherein the resistance layer is a crystalline thin film resistance layer including Ni containing P.

Abstract: A through-hole type laminated circuit board is given with high reliability of electrical connection using copper foil and conductive paste containing low melting point metal without generating harmful void and crack at boundary between the copper foil and conductive paste metal. The laminated circuit board is made by laminating a multiple number of resin boards with roughening treated copper foils at least on their one surface sides with roughening projection deposition of less than 150 mg/dm2 to make surface roughness Rz of 0.3 to 10 ?m and height of the projection to be 0.3 to 10 ?m. Surface roughness of the original foil is 0.1 to 5 ?m and the amount of copper metal atoms of roughening treated layer is set at 4 times or less than the amount of diffusible conductive paste metal atoms containing low melting point metal into the roughening treated layer on the foil surface.

Abstract: To provide a laminated circuit board, in which a conductive paste including low melting point metal is used, without generating a void and crack at a boundary portion between a copper foil and the conductive paste containing low melting point metal, and having high reliability for connection. The laminated circuit board is formed by forming a roughening treated layer by projections having surface roughnesses of 0.3 to 10 ?m and the average amount of deposition of 150 mg/dm2 or less on an original foil including a copper foil or copper alloy foil having surface roughness of 0.1 to 5 ?m at least on one side to form a surface treated copper foil, providing the conductive paste containing low melting point metal on a roughening treated layer side of surface treated copper foil, and laminating the surface treated copper foil with a resin board.

Abstract: An optical module equipped with at least one optical component, a package for housing the one optical component, and a joining portion. The joining portion is formed within the package by Sn—Ag solder containing 2.0 to 5.0 wt % Ag and 2.0 to 20.0 wt % Au, or Sn—Zn solder containing 6.0 to 10.0 wt % Zn and 2.0 to 20.0 wt % Au.

Abstract: An optical module equipped with at least one optical component, a package for housing the one optical component, and a joining portion. The joining portion is formed within the package by Sn—Ag solder containing 2.0 to 5.0 wt % Ag and 2.0 to 20.0 wt % Au, or Sn—Zn solder containing 6.0 to 10.0 wt % Zn and 2.0 to 20.0 wt % Au.

Abstract: There is provided an IC socket having a plurality of contact pins 1. The plural contact pins 1 are arranged in a matrix form so that the pitch thereof at one end agrees with the electrode pitch of a semiconductor device 13 to be mounted and the pitch at the other end agrees with the pitch of the electrical connection terminals of an external connection body to be connected.