Patents by Inventor Satoshi Akazawa

Satoshi Akazawa has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11945052
    Abstract: The present invention provides a brazing material application method that can stably discharge a brazing material containing a fluoride-based flux over a long period of time. The brazing material application method of the present invention includes: a supply step of supplying a liquid brazing material containing a fluoride-based flux to a liquid chamber of a discharge apparatus that is configured to have the liquid chamber having a discharge channel, a plunger disposed in the liquid chamber movably forward and backward, and a drive device for moving the plunger forward and backward and to satisfy a predetermined relationship; and an application step of discharging the brazing material in the liquid chamber from the discharge channel by moving the plunger toward the discharge channel of the liquid chamber by the drive device, and applying the brazing material to a metal member.
    Type: Grant
    Filed: December 25, 2020
    Date of Patent: April 2, 2024
    Assignee: HARIMA CHEMICALS, INC.
    Inventors: Aoi Tazuru, Satoshi Moriya, Daigo Kiga, Tomoaki Akazawa
  • Patent number: 5076840
    Abstract: An electroless copper plating solution comprising a cupric salt, a copper complexing agent, a reducing agent, a pH adjustor, L-arginine and at least one of .alpha.,.alpha.'-dipyridyl and a cyano complex compound can give plated films high in ductility and adhesive strength and excellent in mechanical properties.
    Type: Grant
    Filed: January 4, 1990
    Date of Patent: December 31, 1991
    Assignees: Hitachi Chemical Co. Ltd., Hitachi Borden Chemical Products, Inc.
    Inventors: Takao Takita, Takeshi Shimazaki, Satoshi Akazawa, Kazuichi Kuramoti, Hiroyuki Toyoda