Patents by Inventor Satoshi Asari
Satoshi Asari has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 8940096Abstract: A vertical thermal processing apparatus including: a substrate supporter; a transfer mechanism to transfer substrates between the substrate supporter and a container; and a thermal processing furnace to process substrates that have been loaded thereinto with the substrate supporter. The substrate supporter includes: support columns located at intervals therebetween to surround the substrates, supporting parts for substrate and supporting parts for annular plate provided at the support columns in a tier-like manner, for alternately supporting peripheral parts of the substrates and of annular plates at predetermined intervals therebetween, and annular plates to be supported by the supporting parts for annular plate, when seen from a direction in which the substrates are transferred. Each of the annular plates has an intermediate part having a thickness smaller than thicknesses of the peripheral parts thereof to be supported by the support columns.Type: GrantFiled: August 28, 2009Date of Patent: January 27, 2015Assignee: Tokyo Electron LimitedInventors: Satoshi Asari, Katsuya Toba, Izumi Satoh, Yuichiro Sase
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Patent number: 8833298Abstract: A film forming apparatus includes a substrate holding unit holding substrates at intervals; a reaction chamber accommodating the substrate holding unit; a raw material gas supply pipe supplying a raw material gas of a thin film to the substrate; a support unit supporting the reaction chamber; a heating unit being disposed outside the reaction chamber and heating the substrates; a protection pipe including one end portion fixed to the support unit, being extended along an arrangement direction of the substrates between the substrate holding unit and the reaction chamber, and including a temperature measuring unit inserted therein; and a protrusion portion being provided on at least one of an outer surface of the protection pipe and an inner surface of the reaction chamber, and providing a gap between the outer surface of the protection pipe and the inner surface of the reaction chamber.Type: GrantFiled: June 29, 2012Date of Patent: September 16, 2014Assignee: Tokyo Electron LimitedInventors: Izumi Sato, Isao Shiratani, Satoshi Asari, Tsuyoshi Murakami
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Patent number: 8672602Abstract: The present invention is a processing apparatus comprising a transfer mechanism including at least one transfer plate, the transfer mechanism being configured to cause, when a substrate to be processed is placed on an upper surface of the transfer plate, the transfer plate to move while maintaining the substrate to be processed placed horizontally thereon. The transfer plate has a cantilevered support structure horizontally extending from a proximal end thereof to a distal end thereof in a fore and aft direction. An upper surface of the transfer plate is provided with a plurality of support projections configured to horizontally support the substrate to be processed at a substantially central position thereof and a rear position thereof in the fore and aft direction. The substrate to be processed is not supported on the distal portion of the transfer plate.Type: GrantFiled: August 28, 2009Date of Patent: March 18, 2014Assignee: Tokyo Electron LimitedInventors: Satoshi Asari, Kiichi Takahashi, Toshihiro Abe
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Publication number: 20130167772Abstract: A film forming apparatus includes a substrate holding unit holding substrates at intervals; a reaction chamber accommodating the substrate holding unit; a raw material gas supply pipe supplying a raw material gas of a thin film to the substrate; a support unit supporting the reaction chamber; a heating unit being disposed outside the reaction chamber and heating the substrates; a protection pipe including one end portion fixed to the support unit, being extended along an arrangement direction of the substrates between the substrate holding unit and the reaction chamber, and including a temperature measuring unit inserted therein; and a protrusion portion being provided on at least one of an outer surface of the protection pipe and an inner surface of the reaction chamber, and providing a gap between the outer surface of the protection pipe and the inner surface of the reaction chamber.Type: ApplicationFiled: June 29, 2012Publication date: July 4, 2013Applicant: TOKYO ELECTRON LIMITEDInventors: Izumi SATO, Isao SHIRATANI, Satoshi ASARI, Tsuyoshi MURAKAMI
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Patent number: 7905700Abstract: The present invention is a vertical-type heat processing apparatus comprising: a heat processing furnace; a holder capable of being loaded into the heat processing furnace and unloaded therefrom, with holding therein a plurality of objects to be processed at predetermined vertical intervals in a tier-like manner; a transfer mechanism including a base table capable of vertically moving and rotating, and a substrate supporter capable of horizontally moving on the base table; and a controller for controlling the transfer mechanism; wherein the transfer mechanism is adapted to transfer an object to be processed between a container containing a plurality of objects to be processed at predetermined intervals, and the holder; the substrate supporter includes a to-and-fro driving part for driving the substrate supporter in the horizontal direction, and a pitch-change driving part for changing a pitch at which the objects to be processed are supported; the controller is adapted to monitor at least one information of pType: GrantFiled: March 19, 2007Date of Patent: March 15, 2011Assignee: Tokyo Electron LimitedInventors: Satoshi Asari, Kiichi Takahashi, Katsuhiko Oyama
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Patent number: 7677858Abstract: Disclosed is an improved transfer mechanism that transfers, in a vertical heat treatment system, process objects W between a container (carrier), and a holder (boat) holding plural process objects at vertical intervals. The transfer mechanism includes plural substrate support devices spaced at intervals, and each of the substrate support devices has a gripping mechanism for gripping a process object on the under side. The gripping mechanism includes a fixed engagement member on a distal end of the substrate support device, and a movable engagement member movably attached to a proximal end of the substrate support device.Type: GrantFiled: March 25, 2005Date of Patent: March 16, 2010Assignee: Tokyo Electron LimitedInventors: Satoshi Asari, Katsuhiko Mihara, Hiroshi Kikuchi
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Publication number: 20100058982Abstract: A vertical thermal processing apparatus including: a substrate supporter; a transfer mechanism to transfer substrates between the substrate supporter and a container; and a thermal processing furnace to process substrates that have been loaded thereinto with the substrate supporter. The substrate supporter includes: support columns located at intervals therebetween to surround the substrates, supporting parts for substrate and supporting parts for annular plate provided at the support columns in a tier-like manner, for alternately supporting peripheral parts of the substrates and of annular plates at predetermined intervals therebetween, and annular plates to be supported by the supporting parts for annular plate, when seen from a direction in which the substrates are transferred. Each of the annular plates has an intermediate part having a thickness smaller than thicknesses of the peripheral parts thereof to be supported by the support columns.Type: ApplicationFiled: August 28, 2009Publication date: March 11, 2010Applicant: Tokyo Electron LimitedInventors: Satoshi ASARI, Katsuya Toba, Izumi Satoh, Yuichiro Sase
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Publication number: 20100061828Abstract: The present invention is a processing apparatus comprising a transfer mechanism including at least one transfer plate, the transfer mechanism being configured to cause, when a substrate to be processed is placed on an upper surface of the transfer plate, the transfer plate to move while maintaining the substrate to be processed placed horizontally thereon. The transfer plate has a cantilevered support structure horizontally extending from a proximal end thereof to a distal end thereof in a fore and aft direction. An upper surface of the transfer plate is provided with a plurality of support projections configured to horizontally support the substrate to be processed at a substantially central position thereof and a rear position thereof in the fore and aft direction. The substrate to be processed is not supported on the distal portion of the transfer plate.Type: ApplicationFiled: August 28, 2009Publication date: March 11, 2010Applicant: Tokyo Electron LimitedInventors: Satoshi ASARI, Kiichi Takahashi, Toshihiro Abe
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Patent number: 7547209Abstract: A transfer mechanism 21 of a vertical heat treatment system 1 includes a base capable of vertical movement and turning movement, and plural substrate support devices, disposed on the base so as to be movable anteroposterior, that hold wafers W. Provided on the base 25 is a first sensor 45 that emits a light beam directed toward a direction in which the substrate support device 20 moves anteroposterior, and detects the target member upon receipt of a reflected light of the light beam. Provided on two tip end portions of the substrate support device 20 is a second sensor 40 that detects the target member upon interruption of a light beam traveling between the tip end portions by the target member. When a target member 44 provided at its specific positions with projections 49 and 50 is placed at a position in a wafer boat 8, the base 25 moves vertically and turns, and the substrate support device 20 moves anteroposterior.Type: GrantFiled: March 25, 2005Date of Patent: June 16, 2009Assignee: Tokyo Electron LimitedInventors: Satoshi Asari, Katsuhiko Mihara, Hiroshi Kikuchi
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Patent number: 7416405Abstract: A vertical type of thermal processing apparatus of the present invention includes a thermal processing furnace having a furnace opening at a lower portion thereof. A boat holding objects to be processed in a tier-like manner in a vertical direction is adapted to be contained in the thermal processing furnace through the furnace opening. A lid supporting the boat is capable of closing the furnace opening. A transferring chamber is connected to the furnace opening. An elevating mechanism provided in the transferring chamber is configured to move up and down the lid in order to load and unload the boat into and out from the thermal processing furnace. A connecting port provided at a wall of the transferring chamber is capable of being connected to an opening of a conveying container for containing the objects to be processed. A first containing portion provided in the transferring chamber is capable of temporarily containing unprocessed objects to be processed for a next thermal process.Type: GrantFiled: June 20, 2005Date of Patent: August 26, 2008Assignee: Tokyo Electron LimitedInventors: Satoshi Asari, Katsuhiko Mihara
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Publication number: 20070273892Abstract: A transfer mechanism 21 of a vertical heat treatment system 1 includes a base capable of vertical movement and turning movement, and plural substrate support devices, disposed on the base so as to be movable anteroposterior, that hold wafers W. Provided on the base 25 is a first sensor 45 that emits a light beam directed toward a direction in which the substrate support device 20 moves anteroposterior, and detects the target member upon receipt of a reflected light of the light beam. Provided on two tip end portions of the substrate support device 20 is a second sensor 40 that detects the target member upon interruption of a light beam traveling between the tip end portions by the target member. When a target member 44 provided at its specific positions with projections 49 and 50 is placed at a position in a wafer boat 8, the base 25 moves vertically and turns, and the substrate support device 20 moves anteroposterior.Type: ApplicationFiled: March 25, 2005Publication date: November 29, 2007Inventors: Satoshi Asari, Katsuhiko Mihara, Hiroshi Kikuchi
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Publication number: 20070248439Abstract: The present invention is a vertical-type heat processing apparatus comprising: a heat processing furnace; a holder capable of being loaded into the heat processing furnace and unloaded therefrom, with holding therein a plurality of objects to be processed at predetermined vertical intervals in a tier-like manner; a transfer mechanism including a base table capable of vertically moving and rotating, and a substrate supporter capable of horizontally moving on the base table; and a controller for controlling the transfer mechanism; wherein the transfer mechanism is adapted to transfer an object to be processed between a container containing a plurality of objects to be processed at predetermined intervals, and the holder; the substrate supporter includes a to-and-fro driving part for driving the substrate supporter in the horizontal direction, and a pitch-change driving part for changing a pitch at which the objects to be processed are supported; the controller is adapted to monitor at least one information of pType: ApplicationFiled: March 19, 2007Publication date: October 25, 2007Inventors: Satoshi Asari, Kiichi Takahashi, Katsuhiko Oyama
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Publication number: 20070238062Abstract: The present invention is a vertical-type heat processing apparatus comprising: a heat processing furnace; a holder capable of being loaded into the heat processing furnace and unloaded therefrom, with holding therein a plurality of objects to be processed at predetermined vertical intervals in a tier-like manner; a transfer mechanism including a base table capable of vertically moving and rotating, and a substrate supporter capable of horizontally moving on the base table; and a controller for controlling the transfer mechanism; wherein the transfer mechanism is adapted to transfer an object to be processed between a container containing a plurality of objects to be processed at predetermined intervals, and the holder; the substrate supporter includes a to-and-fro driving part for driving the substrate supporter in the horizontal direction, and a pitch-change driving part for changing a pitch at which the objects to be processed are supported; the controller is adapted to monitor an encoder value outputted frType: ApplicationFiled: March 19, 2007Publication date: October 11, 2007Inventors: Satoshi Asari, Kiichi Takahashi, Katsuhiko Oyama
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Publication number: 20070231763Abstract: A vertical type of thermal processing apparatus of the present invention includes a thermal processing furnace having a furnace opening at a lower portion thereof. A boat holding objects to be processed in a tier-like manner in a vertical direction is adapted to be contained in the thermal processing furnace through the furnace opening. A lid supporting the boat is capable of closing the furnace opening. A transferring chamber is connected to the furnace opening. An elevating mechanism provided in the transferring chamber is configured to move up and down the lid in order to load and unload the boat into and out from the thermal processing furnace. A connecting port provided at a wall of the transferring chamber is capable of being connected to an opening of a conveying container for containing the objects to be processed. A first containing portion provided in the transferring chamber is capable of temporarily containing unprocessed objects to be processed for a next thermal process.Type: ApplicationFiled: June 20, 2005Publication date: October 4, 2007Inventors: Satoshi Asari, Katsuhiko Mihara
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Publication number: 20070199860Abstract: Disclosed is an improved transfer mechanism 21 that transfers, in a vertical heat treatment system, process objects W between a container (carrier) 16 for containing therein plural process objects, and a holder (boat) 9 for holding plural process objects at vertical intervals via ring-shaped support plates 15. The transfer mechanism 21 includes plural substrate support devices 21 spaced at intervals, and each of the substrate support devices 21 has a gripping mechanism 28 for gripping a process object W on the under side of the respective one of the substrate support devices 20. The gripping mechanism 28 includes a fixed engagement member 30 fixedly provided on a distal end of the substrate support device 20 to be engaged with a front edge of a process object W, and a movable engagement member 31 movably attached to a proximal end of the substrate support device 20 to be engaged with a rear edge of the process object W. Plural process objects W can be rapidly, securely transferred at the same time.Type: ApplicationFiled: March 25, 2005Publication date: August 30, 2007Inventors: Satoshi Asari, Katsuhiko Mihara, Hiroshi Kikuchi