Patents by Inventor Satoshi Doumae

Satoshi Doumae has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Semiconductor device
    Patent number: 6696755
    Abstract: A semiconductor device comprises: an insulating flexible film capable of changing its profile; first and second conductive layers provided on both surfaces of the flexible film and constituting wiring patterns; an LSI mounted on the first conductive layer; a conductor provided in a hole formed in the flexible film and making connection between the wiring pattern formed in the first conductive layer and the wiring pattern formed in the second wiring pattern; a stiffener; and a heat spreader. A part of the wiring pattern constituted by each of the first conductive layer and the second wiring pattern is a conductive wiring, whose characteristic impedance is previously calculated, for a high-speed signal and a connection portion for making connection to a mother board is provided on an end of the conductive wiring for a high-speed signal.
    Type: Grant
    Filed: March 14, 2003
    Date of Patent: February 24, 2004
    Assignee: NEC Corporation
    Inventors: Nobuharu Kami, Kazuhiko Kurata, Satoshi Doumae, Takara Sugimoto
  • Semiconductor device
    Publication number: 20030173663
    Abstract: A semiconductor device comprises: an insulating flexible film capable of changing its profile; first and second conductive layers provided on both surfaces of the flexible film and constituting wiring patterns; an LSI mounted on the first conductive layer; a conductor provided in a hole formed in the flexible film and making connection between the wiring pattern formed in the first conductive layer and the wiring pattern formed in the second wiring pattern; a stiffener; and a heat spreader. A part of the wiring pattern constituted by each of the first conductive layer and the second wiring pattern is a conductive wiring, whose characteristic impedance is previously calculated, for a high-speed signal and a connection portion for making connection to a mother board is provided on an end of the conductive wiring for a high-speed signal.
    Type: Application
    Filed: March 14, 2003
    Publication date: September 18, 2003
    Applicant: NEC CORPORATION
    Inventors: Nobuharu Kami, Kazuhiko Kurata, Satoshi Doumae, Takara Sugimoto