Abstract: Provided is a compound that can be used for a resin for a resist having excellent sensitivity, resolution, and etching resistance, or the like, by a compound represented by the following formula (1): (wherein R1 represents a hydrogen atom or a methyl group, R2 represents an aliphatic hydrocarbon group having 1 to 6 carbon atoms, m represents an integer of 0 to 5, and n represents an integer of 0 to 4).

Abstract: Provided is a compound that can be used for a resin for a resist having excellent sensitivity, resolution, and etching resistance, or the like, by a compound represented by the following formula (1): (wherein R1 represents a hydrogen atom or a methyl group, R2 represents an aliphatic hydrocarbon group having 1 to 6 carbon atoms, m represents an integer of 0 to 5, and n represents an integer of 0 to 4).

Abstract: An optical filter device includes a wavelength variable interference filter that includes a pair of reflective films which face each other, and a fixed substrate in which one of the pair of reflective films is provided; a base to which the fixed substrate is fixed; and a fixing member which fixes one place on the fixed substrate to the base, a surface which is on other place of the one place of the substrate and the base are disposed with a gap therebetween.

Abstract: An optical filter device includes a wavelength variable interference filter that includes a pair of reflective films which face each other, and a fixed substrate in which one of the pair of reflective films is provided; a base to which the fixed substrate is fixed; and a fixing member which fixes one place on the fixed substrate to the base, a surface which is on other place of the one place of the substrate and the base are disposed with a gap therebetween.

Abstract: An optical filter device includes a wavelength variable interference filter that includes a pair of reflective films which face each other, and a fixed substrate in which one of the pair of reflective films is provided; a base to which the fixed substrate is fixed; and a fixing member which fixes one place on the fixed substrate to the base, a surface which is on other place of the oneplace of the substrate and the base are disposed with a gap therebetween.

Abstract: An optical filter device includes a wavelength variable interference filter that includes a pair of reflective films which face each other, and a fixed substrate in which one of the pair of reflective films is provided; a base to which the fixed substrate is fixed; and a fixing member which fixes one place on the fixed substrate to the base, a surface which is on other place of the one place of the substrate and the base are disposed with a gap therebetween.

Abstract: An optical filter device includes a wavelength variable interference filter that includes a pair of reflective films which face each other, and a fixed substrate in which one of the pair of reflective films is provided; a base to which the fixed substrate is fixed; and a fixing member which fixes one place on the fixed substrate to the base, a surface which is on other place of the oneplace of the substrate and the base are disposed with a gap therebetween.

Abstract: An optical filter device includes a wavelength variable interference filter that includes a pair of reflective films which face each other, and a fixed substrate in which one of the pair of reflective films is provided; a base to which the fixed substrate is fixed; and a fixing member which fixes one place on the fixed substrate to the base, a surface which is on other place of the oneplace of the substrate and the base are disposed with a gap therebetween.

Abstract: Provided is an industrially excellent surface-treated copper foil which satisfies requirements for adhesiveness to an insulating resin such as polyimide, heat-resistant adhesiveness, chemical resistance and soft etching properties. Also provided is a method for producing a surface-treated copper foil which achieves a high adhesion strength between an insulating resin and the copper foil, shows high chemical resistance in circuit formation and sustains good soft etching properties after forming vias by laser-processing. A base copper foil is subjected to a roughening treatment to give a surface roughness (Rz) of 1.1 ?m or below. On the roughened surface, an Ni—Zn alloy layer is formed. The aforesaid roughening treatment is conducted in such a manner that the roughened surface comprises sharp-pointed convexes, which have a width of 0.3-0.8 ?m, a height of 0.6-1.8 ?m and an aspect ratio of 1.2-3.5, and the surface roughness (Rz) of said base copper foil is increased by 0.05-0.3 ?m.

Abstract: In order to provide a flexible laminate circuit board using a surface treated copper foil satisfying all of a bonding strength of a copper foil with respect to polyimide, acid resistance, and etching property, in a flexible laminate circuit board formed by a copper foil on the surface of a polyimide resin layer, the copper foil is a surface treated copper foil formed by depositing an Ni—Zn alloy onto at least one surface of a untreated copper foil, and the Zn deposition amount in the deposited Ni—Zn alloy is 6% or more and 15% or less of the (Ni deposition amount+Zn deposition amount), and the Zn deposition amount is 0.08 mg/dm2 or more to provide a flexible copper clad laminate.

Abstract: To provide a surface treated copper foil satisfying all of the bonding strength to polyimide film, chemical resistance, and etching property, and to provide a CCL using the surface treated copper foil, a surface treated copper foil is formed being comprising an untreated copper foil on at least one surface of which Ni—Zn alloy is deposited, wherein Zn content (wt %)=Zn deposition amount/(Ni deposition amount+Zn deposition amount)×100 is 6% or more and 15% or less, and Zn deposition amount is 0.08 mg/dm2 or more, or, a CCL is formed being comprising a surface treated copper foil and a polyimide film laminated on the surface treated copper foil, wherein the surface treated copper foil comprises an untreated copper foil on at least one surface of which Ni—Zn alloy is deposited, Zn content (wt %)=Zn deposition amount/(Ni deposition amount+Zn deposition amount)×100 is 6% or more and 15% or less, and Zn deposition amount is 0.08 mg/dm2 or more.

Abstract: Disclosed is a surface-roughened copper foil that can show excellent adhesion to an anisotropic conductive resin (ACF) and a copper-clad laminate using same. Specifically disclosed is a surface-roughened copper foil which is surface-roughened by surface roughening on at least one surface of a base copper foil (untreated copper foil), wherein the roughening treated surface is finished so that a surface roughness (Ra) of 0.28 ?m or more of the adhesion surface of a polyimide film to be adhered to the roughening treated surface.

Abstract: Provided is an industrially excellent surface-treated copper foil which satisfies requirements for adhesiveness to an insulating resin such as polyimide, heat-resistant adhesiveness, chemical resistance and soft etching properties. Also provided is a method for producing a surface-treated copper foil which achieves a high adhesion strength between an insulating resin and the copper foil, shows high chemical resistance in circuit formation and sustains good soft etching properties after forming vias by laser-processing. A base copper foil is subjected to a roughening treatment to give a surface roughness (Rz) of 1.1 ?m or below. On the roughened surface, an Ni—Zn alloy layer is formed. The aforesaid roughening treatment is conducted in such a manner that the roughened surface comprises sharp-pointed convexes, which have a width of 0.3-0.8 ?m, a height of 0.6-1.8 ?m and an aspect ratio of 1.2-3.5, and the surface roughness (Rz) of said base copper foil is increased by 0.05-0.3 ?m.

Abstract: Provided is a roughened copper foil which has excellent properties in forming a fine patterned-circuit and good transmission properties in a high-frequency range and show high adhesiveness to a resin base and good chemical resistance. A surface-roughened copper foil, which is obtained by roughening at least one face of a base copper foil (untreated copper foil) so as to increase the surface roughness (Rz) thereof, relative to the surface roughness (Rz) of said base copper foil, by 0.05-0.3 ?m and has a roughened surface with a surface roughness (Rz) after roughening of 1.1 ?m or less, wherein said roughened surface comprises roughed grains in a sharp-pointed convex shape which have a width of 0.3-0.8 ?m, a height of 0.4-1.8 ?m and an aspect ratio [height/width] of 1.2-3.5.

Abstract: In order to provide a flexible laminate circuit board using a surface treated copper foil satisfying all of a bonding strength of a copper foil with respect to polyimide, acid resistance, and etching property, in a flexible laminate circuit board formed by a copper foil on the surface of a polyimide resin layer, the copper foil is a surface treated copper foil formed by depositing an Ni—Zn alloy onto at least one surface of a untreated copper foil, and the Zn deposition amount in the deposited Ni—Zn alloy is 6% or more and 15% or less of the (Ni deposition amount+Zn deposition amount), and the Zn deposition amount is 0.08 mg/dm2 or more to provide a flexible cupper clad laminate.

Abstract: To provide a surface treated copper foil satisfying all of the bonding strength to polyimide film, chemical resistance, and etching property, and to provide a CCL using the surface treated copper foil, a surface treated copper foil is formed being comprising an untreated copper foil on at least one surface of which Ni—Zn alloy is deposited, wherein Zn content (wt %)=Zn deposition amount/(Ni deposition amount+Zn deposition amount)×100 is 6% or more and 15% or less, and Zn deposition amount is 0.08 mg/dm2 or more, or, a CCL is formed being comprising a surface treated copper foil and a polyimide film laminated on the surface treated copper foil, wherein the surface treated copper foil comprises an untreated copper foil on at least one surface of which Ni—Zn alloy is deposited, Zn content (wt %)=Zn deposition amount/(Ni deposition amount+Zn deposition amount)×100 is 6% or more and 15% or less, and Zn deposition amount is 0.08 mg/dm2 or more.

Abstract: An ultrathin copper foil with a carrier not causing blistering at a release layer interface, having a low carrier peeling force, friendly to the environment, and enabling easy peeling of a carrier foil and an ultrathin copper foil even under a high temperature environment and a printed circuit board enabling a stable production quality of a base of a printed circuit board for fine pattern applications using the ultrathin copper foil with the carrier, that is, a ultrathin copper foil with a carrier comprising a carrier foil, a diffusion prevention layer, a release layer, and an ultrathin copper foil, wherein the release layer is formed by a metal A for retaining a release property and a metal B for facilitating plating of the ultrathin copper foil, a content “a” of the metal A and a content “b” of the metal B forming the release layer satisfying an equation: 10?a/(a+b)*100?70 and a printed circuit board prepared by using such a ultrathin copper foil with a carrier.

Abstract: An ultrathin copper foil with a carrier not causing blistering at a release layer interface, having a low carrier peeling force, friendly to the environment, and enabling easy peeling of a carrier foil and an ultrathin copper foil even under a high temperature environment and a printed circuit board enabling a stable production quality of a base of a printed circuit board for fine pattern applications using the ultrathin copper foil with the carrier, that is, an ultrathin copper foil with a carrier comprising a carrier foil, a release layer, and an ultrathin copper foil, wherein the release layer is formed by a metal A for retaining a release property and a metal B for facilitating plating of the ultrathin copper foil, a content a of the metal A and a content b of the metal B forming the release layer satisfying an equation: 10?a/(a+b)*100?70 and a printed circuit board prepared by using such an ultrathin copper foil with a carrier.

Abstract: An ultrathin copper foil with a carrier not causing blistering at a release layer interface, having a low carrier peeling force, friendly to the environment, and enabling easy peeling of a carrier foil and an ultrathin copper foil even under a high temperature environment and a printed circuit board enabling a stable production quality of a base of a printed circuit board for fine pattern applications using the ultrathin copper foil with the carrier, that is, a ultrathin copper foil with a carrier comprising a carrier foil, a diffusion prevention layer, a release layer, and an ultrathin copper foil, wherein the release layer is formed by a metal A for retaining a release property and a metal B for facilitating plating of the ultrathin copper foil, a content “a” of the metal A and a content “b” of the metal B forming the release layer satisfying an equation: 10?a/(a+b)*100?70 and a printed circuit board prepared by using such a ultrathin copper foil with a carrier.

Abstract: An ultrathin copper foil with a carrier not causing blistering at a release layer interface, having a low carrier peeling force, friendly to the environment, and enabling easy peeling of a carrier foil and an ultrathin copper foil even under a high temperature environment and a printed circuit board enabling a stable production quality of a base of a printed circuit board for fine pattern applications using the ultrathin copper foil with the carrier, that is, a ultrathin copper foil with a carrier comprising a carrier foil, a diffusion prevention layer, a release layer, and an ultrathin copper foil, wherein the release layer is formed by a metal A for retaining a release property and a metal B for facilitating plating of the ultrathin copper foil, a content a of the metal A and a content b of the metal B forming the release layer satisfying an equation: 10?a/(a+b)*100?70 and a printed circuit board prepared by using such a ultrathin copper foil with a carrier.