Abstract: In a method of fabricating a resin-sealed semiconductor device, a semiconductor device is disposed inside a cavity of a mold and resin is injected through a gate of the mold into the cavity to seal the semiconductor device with the resin in a state where portions of lead portions are exposed. The gate is disposed only in a surface of the cavity facing the surface of the semiconductor chip. The resin is injected through the gate towards the surface of the semiconductor chip.

Abstract: This invention relates to a transaction processing system including a host computer (1), a transaction device (2), a first customer card (3) and a second customer card (4). The first card (3) and the second card (4) directly transfer information representing monetary values between them on the basis of signals verifying a transaction processing received from the host computer (1) through the transaction device (2). When the information representing the monetary values are exchanged between the first card (3) and the second card (4), the host computer (1) updates the balance of the account stored in the host computer (1).