Patents by Inventor Satoshi Hanajima

Satoshi Hanajima has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20230302580
    Abstract: A processing method for a workpiece includes forming a first processing groove by a first processing unit, imaging the first processing groove by a first imaging unit and imaging, by a second imaging unit provided on an opposite side of the first imaging unit with respect to the holding table, a predetermined line that is formed in a position corresponding to that of the first processing groove in a thickness direction of the workpiece, detecting whether or not a position of a first center line of the first processing groove and a position of a second center line of the predetermined line are aligned in a predetermined plane, and correcting the processing position in such a manner as to make the positions of the two center lines aligned when the detected positions of the first center line and the second center line are not being aligned.
    Type: Application
    Filed: March 20, 2023
    Publication date: September 28, 2023
    Inventors: Yoshimasa KOJIMA, Atsushi KUBO, Satoshi HANAJIMA
  • Patent number: 11745374
    Abstract: A cutting apparatus includes a holding table that has at at least a part of a holding surface a transparent section including a transparent member and that holds a workpiece, a cutting unit including a cutting blade that cuts the workpiece held by the holding table, and a cutting water nozzle that supplies cutting water during cutting of the workpiece by the cutting blade, an imaging camera that images the workpiece through the transparent section, and a removing unit that removes a liquid adhered to the transparent section. The removing unit includes a contact member positioned at a contact position for making contact with the transparent section and a retracted position, and an X-axis moving unit that relatively moves on the transparent section the contact member making contact with the transparent section.
    Type: Grant
    Filed: January 8, 2021
    Date of Patent: September 5, 2023
    Assignee: DISCO CORPORATION
    Inventors: Satoshi Hanajima, Jun Nakama
  • Patent number: 11699606
    Abstract: A cutting apparatus includes a table including a support plate transparent in a visible region, a cutting unit, a first feeding mechanism that includes a first moving section for supporting the table and a first motor, a second feeding mechanism that includes a second moving section for supporting the cutting unit and a second motor, a first camera disposed on the side of a first surface of the support plate, a second camera disposed on the side of a second surface opposite to the first surface of the support plate, and a storage section that stores positional deviation amounts in the X-axis direction and the Y-axis direction between an imaging region at a reference position of the first camera and an imaging region at a reference position of the second camera.
    Type: Grant
    Filed: March 29, 2021
    Date of Patent: July 11, 2023
    Assignee: DISCO CORPORATION
    Inventors: Yoshimasa Kojima, Jun Nakama, Satoshi Hanajima
  • Publication number: 20230016598
    Abstract: A treatment apparatus including a chuck table, a table base, a servo motor that rotates the table base, and a determination unit that determines the kind of the chuck table mounted to the table base is provided. The determination unit includes a torque recording section in which a torque outputted by the servo motor when rotating the table base is recorded on the basis of the kind of the chuck table, and a determination section that collates the torque outputted by the servo motor with the torque recording section, to thereby determine the kind of the chuck table.
    Type: Application
    Filed: September 29, 2022
    Publication date: January 19, 2023
    Inventor: Satoshi HANAJIMA
  • Patent number: 11521867
    Abstract: A cutting apparatus includes a cassette table on which a first cassette in which a frame unit, ring-shaped frame and wafer are housed, and a second cassette in which a simple wafer is housed. A first conveying unit having a first frame holding part holds the ring-shaped frame of the frame unit withdrawn from the first cassette and conveys the frame unit to a chuck table. A first wafer holding part holds the simple wafer withdrawn from the second cassette and conveys the simple wafer to the chuck table. A cutting unit cuts the wafer, and a second conveying unit conveys the frame unit from the chuck table to a cleaning unit. A second wafer holding part holds the cut simple wafer and conveys it from the chuck table to the cleaning unit.
    Type: Grant
    Filed: December 11, 2019
    Date of Patent: December 6, 2022
    Assignee: DISCO CORPORATION
    Inventors: Satoshi Hanajima, Takeshi Kitaura, Natsuko Hanamura
  • Patent number: 11321550
    Abstract: A processing apparatus includes a chuck table, a processing unit configured to process a workpiece held on the chuck table, a height measuring unit fitted to the processing unit, the height measuring unit measuring, as height data, heights at a plurality of coordinates of the holding surface measured while a moving unit is moved, a reading unit capable of reading an information medium, and a control unit. The chuck table includes an information medium on which identifying information distinguishing the chuck table is recorded. The control unit includes a height data recording section configured to record the height data and the identifying information in association with each other, and a processing control section configured to control a height of the processing unit during processing on the basis of the height data associated with the identifying information read by the reading unit.
    Type: Grant
    Filed: June 24, 2020
    Date of Patent: May 3, 2022
    Assignee: DISCO CORPORATION
    Inventor: Satoshi Hanajima
  • Publication number: 20210313208
    Abstract: A cutting apparatus includes a table including a support plate transparent in a visible region, a cutting unit, a first feeding mechanism that includes a first moving section for supporting the table and a first motor, a second feeding mechanism that includes a second moving section for supporting the cutting unit and a second motor, a first camera disposed on the side of a first surface of the support plate, a second camera disposed on the side of a second surface opposite to the first surface of the support plate, and a storage section that stores positional deviation amounts in the X-axis direction and the Y-axis direction between an imaging region at a reference position of the first camera and an imaging region at a reference position of the second camera.
    Type: Application
    Filed: March 29, 2021
    Publication date: October 7, 2021
    Inventors: Yoshimasa KOJIMA, Jun NAKAMA, Satoshi HANAJIMA
  • Publication number: 20210229306
    Abstract: A cutting apparatus includes a holding table that has at at least a part of a holding surface a transparent section including a transparent member and that holds a workpiece, a cutting unit including a cutting blade that cuts the workpiece held by the holding table, and a cutting water nozzle that supplies cutting water during cutting of the workpiece by the cutting blade, an imaging camera that images the workpiece through the transparent section, and a removing unit that removes a liquid adhered to the transparent section. The removing unit includes a contact member positioned at a contact position for making contact with the transparent section and a retracted position, and an X-axis moving unit that relatively moves on the transparent section the contact member making contact with the transparent section.
    Type: Application
    Filed: January 8, 2021
    Publication date: July 29, 2021
    Inventors: Satoshi HANAJIMA, Jun NAKAMA
  • Publication number: 20210210375
    Abstract: A processing apparatus includes a processing feed unit and a control unit. The processing feed unit moves a holding unit along guide rails between a processing zone, and an imaging zone in which a workpiece is imaged by a camera. The control unit includes a correction amount calculation section configured such that, after forming a cut groove in the workpiece, the cut groove is imaged by the camera, and correction values in a Y-axis direction or a correction angle for the chuck table are or is then calculated from Y-coordinates of two points apart from each other in a processing feed direction on the cut groove, whereby when carrying out processing feed of the chuck table in the imaging zone, the camera is corrected in position in the Y-direction based on the correction values or the chuck table is rotated by the correction angle.
    Type: Application
    Filed: January 4, 2021
    Publication date: July 8, 2021
    Inventors: Yoshimasa KOJIMA, Jun NAKAMA, Satoshi HANAJIMA
  • Patent number: 10964555
    Abstract: Disclosed herein is a water jet processing apparatus including a chuck table that holds a workpiece by a holding surface, a high-pressure water injection unit having a high-pressure water nozzle that injects high-pressure water along planned dividing lines of the workpiece to remove burrs, a processing feed unit that carries out processing feed of the chuck table in an X-direction, and an indexing feed unit that carries out indexing feed of the high-pressure water nozzle in a Y-direction. The water jet processing apparatus also includes a movement unit that moves the high-pressure water nozzle in a Z-direction, an alignment unit that images the workpiece, a cassette placement region in which a cassette that houses plural workpieces is placed, and a conveying unit that conveys the workpiece between the cassette and the chuck table.
    Type: Grant
    Filed: April 23, 2018
    Date of Patent: March 30, 2021
    Assignee: DISCO CORPORATION
    Inventor: Satoshi Hanajima
  • Publication number: 20210004553
    Abstract: A processing apparatus includes a chuck table, a processing unit configured to process a workpiece held on the chuck table, a height measuring unit fitted to the processing unit, the height measuring unit measuring, as height data, heights at a plurality of coordinates of the holding surface measured while a moving unit is moved, a reading unit capable of reading an information medium, and a control unit. The chuck table includes an information medium on which identifying information distinguishing the chuck table is recorded. The control unit includes a height data recording section configured to record the height data and the identifying information in association with each other, and a processing control section configured to control a height of the processing unit during processing on the basis of the height data associated with the identifying information read by the reading unit.
    Type: Application
    Filed: June 24, 2020
    Publication date: January 7, 2021
    Inventor: Satoshi HANAJIMA
  • Publication number: 20200185239
    Abstract: A cutting apparatus includes a cassette table on which a first cassette in which a frame unit, ring-shaped frame and wafer are housed, and a second cassette in which a simple wafer is housed. A first conveying unit having a first frame holding part holds the ring-shaped frame of the frame unit withdrawn from the first cassette and conveys the frame unit to a chuck table. A first wafer holding part holds the simple wafer withdrawn from the second cassette and conveys the simple wafer to the chuck table. A cutting unit cuts the wafer, and a second conveying unit conveys the frame unit from the chuck table to a cleaning unit. A second wafer holding part holds the cut simple wafer and conveys it from the chuck table to the cleaning unit.
    Type: Application
    Filed: December 11, 2019
    Publication date: June 11, 2020
    Inventors: Satoshi HANAJIMA, Takeshi KITAURA, Natsuko HANAMURA
  • Patent number: 10665508
    Abstract: A cutting apparatus includes a cutting unit configured to cut a workpiece held on a chuck table, and a groove detecting unit including a CCD imaging element photographing the workpiece held on the chuck table. The groove detecting unit photographs, by the CCD imaging element, a laser-processed groove and a cut groove illuminated by an oblique illumination set such that a light amount of light in a direction parallel with an extending direction of the laser-processed groove as viewed in plan is higher than a light amount of light in a direction orthogonal to the extending direction of the laser-processed groove.
    Type: Grant
    Filed: August 14, 2018
    Date of Patent: May 26, 2020
    Assignee: DISCO CORPORATION
    Inventors: Makoto Tanaka, Shinya Yasuda, Satoshi Hanajima, Harunobu Yuzawa
  • Publication number: 20190378732
    Abstract: A treatment apparatus including a chuck table, a table base, a servo motor that rotates the table base, and a determination unit that determines the kind of the chuck table mounted to the table base is provided. The determination unit includes a torque recording section in which a torque outputted by the servo motor when rotating the table base is recorded on the basis of the kind of the chuck table, and a determination section that collates the torque outputted by the servo motor with the torque recording section, to thereby determine the kind of the chuck table.
    Type: Application
    Filed: June 4, 2019
    Publication date: December 12, 2019
    Inventor: Satoshi HANAJIMA
  • Publication number: 20190067108
    Abstract: A cutting apparatus includes a cutting unit configured to cut a workpiece held on a chuck table, and a groove detecting unit including a CCD imaging element photographing the workpiece held on the chuck table. The groove detecting unit photographs, by the CCD imaging element, a laser-processed groove and a cut groove illuminated by an oblique illumination set such that a light amount of light in a direction parallel with an extending direction of the laser-processed groove as viewed in plan is higher than a light amount of light in a direction orthogonal to the extending direction of the laser-processed groove.
    Type: Application
    Filed: August 14, 2018
    Publication date: February 28, 2019
    Inventors: Makoto Tanaka, Shinya Yasuda, Satoshi Hanajima, Harunobu Yuzawa
  • Patent number: 10211081
    Abstract: A processing method for processing a workpiece includes a holding step of holding the front surface side of the workpiece on which an alignment mark is formed by a holding table having a holding surface that reflects a near-infrared ray and exposing the back surface side and an imaging step of emitting the near-infrared ray toward the back surface side of the workpiece held by the holding table and imaging the workpiece by an imaging unit that has sensitivity to the near-infrared ray and faces the back surface side of the workpiece to form a captured image. The processing method also includes an alignment mark detection step of detecting the alignment mark based on the captured image and a processing step of processing the workpiece held by the holding table by a processing unit based on the detected alignment mark.
    Type: Grant
    Filed: February 1, 2018
    Date of Patent: February 19, 2019
    Assignee: Disco Corporation
    Inventor: Satoshi Hanajima
  • Publication number: 20180308717
    Abstract: Disclosed herein is a water jet processing apparatus including a chuck table that holds a workpiece by a holding surface, a high-pressure water injection unit having a high-pressure water nozzle that injects high-pressure water along planned dividing lines of the workpiece to remove burrs, a processing feed unit that carries out processing feed of the chuck table in an X-direction, and an indexing feed unit that carries out indexing feed of the high-pressure water nozzle in a Y-direction. The water jet processing apparatus also includes a movement unit that moves the high-pressure water nozzle in a Z-direction, an alignment unit that images the workpiece, a cassette placement region in which a cassette that houses plural workpieces is placed, and a conveying unit that conveys the workpiece between the cassette and the chuck table.
    Type: Application
    Filed: April 23, 2018
    Publication date: October 25, 2018
    Inventor: Satoshi Hanajima
  • Publication number: 20180218932
    Abstract: A processing method for processing a workpiece includes a holding step of holding the front surface side of the workpiece on which an alignment mark is formed by a holding table having a holding surface that reflects a near-infrared ray and exposing the back surface side and an imaging step of emitting the near-infrared ray toward the back surface side of the workpiece held by the holding table and imaging the workpiece by an imaging unit that has sensitivity to the near-infrared ray and faces the back surface side of the workpiece to form a captured image. The processing method also includes an alignment mark detection step of detecting the alignment mark based on the captured image and a processing step of processing the workpiece held by the holding table by a processing unit based on the detected alignment mark.
    Type: Application
    Filed: February 1, 2018
    Publication date: August 2, 2018
    Inventor: Satoshi Hanajima
  • Publication number: 20160189989
    Abstract: A processing apparatus including a chuck table for holding a workpiece, a processing unit for processing the workpiece held on the chuck table, a feeding unit for relatively feeding the chuck table and the processing unit, and an imaging unit for imaging the result of processing of the workpiece by the processing unit. The imaging unit includes an illuminating portion for illuminating a work area of the workpiece after the processing and an imaging portion for imaging the work area after the processing. The illuminating portion has an illumination direction selecting function for selecting an illumination direction in illuminating the work area from any one of the east, west, north, and south positions with respect to the work area.
    Type: Application
    Filed: December 16, 2015
    Publication date: June 30, 2016
    Inventors: Satoshi Hanajima, Shinya Yasuda, Makoto Tanaka, Harunobu Yuzawa
  • Patent number: 7585201
    Abstract: In a water jet processing method, when a nozzle adapted to emit water jet is moved relatively to a substrate to form a second cut line intersecting a first cut line, the relative travel speed of the nozzle is set to a second speed lower than a first normal speed by about 1/5 to 1/20 at least in a section anteroposterior to the intersection. Delay-inclination of a front edge of the second cut line is eliminated as much as possible to thereby prevent the occurrence of an insufficient processing area.
    Type: Grant
    Filed: May 23, 2008
    Date of Patent: September 8, 2009
    Assignee: Disco Corporation
    Inventors: Shigekazu Kanai, Satoshi Hanajima