Abstract: An electrocardiogram measurement unit comprises: a pair of positive and negative electrode bodies and constituting capacitive coupling electrodes and arranged in a non-contact state with a human body; a signal amplification unit that amplifies an electric signal from both the electrode bodies and outputs the amplified electric signal as an electrocardiographic signal; and an inverting output unit that inverts an in-phase signal of the electric signal from both the electrode bodies and outputs an inverted signal. The electrocardiographic signal measurement device comprises simultaneously both channels and when the electrocardiogram measurement unit to which the inverted signal from the inverting output unit is input to the positive electrode body is defined as a first channel, and the electrocardiogram measurement unit to which the inverted signal from the inverting output unit is input to the negative electrode body is defined as a second channel.

Abstract: A device includes a first conductive-member which connects to a first electrode on a first face of a chip. A second conductive-member is spaced from the chip and the first conductive-member. A third conductive-member is spaced from the first and second conductive-members. A first connector connects between the second electrode and the second conductive-member. A second connector is opposed to a third electrode on the second face and connects the third electrode and the third conductive-member. A first connecting-member connects the first connector and the second face. A second connecting-member connects the first connector and the second conductive-member. The first connector includes first protruded portions protruded in a first direction from the first conductive-member to the second conductive-member. The second connecting-member is provided to correspond to each of places between the first protruded portions and the second conductive-member.

Abstract: An additive manufactured object is a stack including a first metal layer made of a first metallic material and a second metal layer that includes second dot beads made of a second metallic material. The additive manufactured object includes an intermediate layer between the first and second metal layers. The intermediate layer includes a first structural part as a structure made of the first metallic material and a second structural part as a structure made of the second metallic material. The first and second structural parts engage each other in a unit structure, and an arrangement of the unit structures arranged in the intermediate layer has translational symmetry in a plane perpendicular to a stacked direction of the first and second metal layers. The intermediate layer includes, at a junction interface between the first and the second structural parts, an intermetallic compound layer including an intermetallic compound.

Abstract: According to one embodiment, a semiconductor device includes a semiconductor chip, first and second conductive members, a first connection member, and a resin portion. The first conductive member includes first and second portions. The second portion is electrically connected to the semiconductor chip. A direction from the semiconductor chip toward the second portion is aligned with a first direction. A direction from the second portion toward the first portion is aligned with a second direction crossing the first direction. The second conductive member includes a third portion. The first connection member is provided between the first and third portion. The first connection member is conductive. The resin portion includes a first partial region. The first partial region is provided around the first and third portions, and the first connection member. The first portion has a first surface opposing the first connection member and including a recess and a protrusion.

Abstract: An NC device that is a numerical control device controls an additive manufacturing apparatus. The additive manufacturing apparatus performs modeling by application of a melted material. The NC device includes a monitoring unit that monitors occurrence of a drop caused by a material after being melted remaining on the material before being melted, and a command generating unit that generates commands for causing the additive manufacturing apparatus to remove the drop that has occurred.

Abstract: An additive manufacturing apparatus that forms an object by repeating additive machining of melting a machining material and adding, onto a workpiece, the machining material solidified includes: a height measurement unit that measures a height of the object formed at a machining position; and a control unit that controls a machining condition for adding the machining material to the machining position on the basis of a measurement result provided by the height measurement unit.

Abstract: An NC device that is a numerical control device controls an additive manufacturing apparatus. The additive manufacturing apparatus performs modeling by application of a melted material. The NC device includes a monitoring unit that monitors occurrence of a drop caused by a material after being melted remaining on the material before being melted, and a command generating unit that generates commands for causing the additive manufacturing apparatus to remove the drop that has occurred.

Abstract: An additive manufacturing method uses an additive manufacturing device performing additive machining by controlling a machining head including a nozzle to supply columnar build material to a machining region on a target surface and a beam nozzle to irradiate the machining region with beam melting the build material, the nozzle and the beam nozzle being provided non-coaxially. When additive machining is performed in a state where the machining head is located with central axes of the beam and the build material being positioned on a single vertical plane, the machining path is divided into divided machining paths such that the machining head is moved in one direction along a direction of the build-material central axis when motion of the machining head is projected onto a plane perpendicular to an irradiation direction of the beam, and the machining head is moved along each divided machining path to perform additive machining.

Abstract: An additive manufacturing apparatus includes a laser oscillator that is a beam source that outputs a beam, and a rotary motor that is a driving unit that changes the relative positions of a material fed from a wire spool that is a supply source of a wire that is the material and an object to be machined. The driving unit is capable of performing first driving for feeding the material from the supply source toward the object to be machined and second driving for pulling back the fed material to the supply source, and switches from the first driving to the second driving on the basis of a machining program.

Abstract: An additive manufacturing method includes: forming first and second linear beads parallel to each other under a same predetermined formation condition such that a gap having a predetermined width is formed between the first and second linear beads; forming a third linear bead in the gap under the same formation condition; forming, after forming the third linear bead, the linear bead that is formed as an even-numbered line under the formation condition such that the linear bead is parallel to the first linear bead and a gap having a predetermined width is formed between the linear bead formed as an even-numbered line and a linear bead formed two lines before; and forming, after forming the third linear bead, the linear bead that is formed as an odd-numbered line in the gap between the linear bead formed immediately before and the linear bead formed three lines before under the formation condition.

Abstract: An additive manufacturing method includes: forming first and second linear beads parallel to each other under a same predetermined formation condition such that a gap having a predetermined width is formed between the first and second linear beads; forming a third linear bead in the gap under the same formation condition; forming, after forming the third linear bead, the linear bead that is formed as an even-numbered line under the formation condition such that the linear bead is parallel to the first linear bead and a gap having a predetermined width is formed between the linear bead formed as an even-numbered line and a linear bead formed two lines before; and forming, after forming the third linear bead, the linear bead that is formed as an odd-numbered line in the gap between the linear bead formed immediately before and the linear bead formed three lines before under the formation condition.

Abstract: An additive manufacturing method uses an additive manufacturing device performing additive machining by controlling a machining head including a nozzle to supply columnar build material to a machining region on a target surface and a beam nozzle to irradiate the machining region with beam melting the build material, the nozzle and the beam nozzle being provided non-coaxially. When additive machining is performed in a state where the machining head is located with central axes of the beam and the build material being positioned on a single vertical plane, the machining path is divided into divided machining paths such that the machining head is moved in one direction along a direction of the build- material central axis when motion of the machining head is projected onto a plane perpendicular to an irradiation direction of the beam, and the machining head is moved along each divided machining path to perform additive machining.

Abstract: An additive manufacturing apparatus includes a laser oscillator that is a beam source that outputs a beam, and a rotary motor that is a driving unit that changes the relative positions of a material fed from a wire spool that is a supply source of a wire that is the material and an object to be machined. The driving unit is capable of performing first driving for feeding the material from the supply source toward the object to be machined and second driving for pulling back the fed material to the supply source, and switches from the first driving to the second driving on the basis of a machining program.

Abstract: According to one embodiment, a semiconductor device includes a semiconductor chip, first and second conductive members, a first connection member, and a resin portion. The first conductive member includes first and second portions. The second portion is electrically connected to the semiconductor chip. A direction from the semiconductor chip toward the second portion is aligned with a first direction. A direction from the second portion toward the first portion is aligned with a second direction crossing the first direction. The second conductive member includes a third portion. The first connection member is provided between the first and third portion. The first connection member is conductive. The resin portion includes a first partial region. The first partial region is provided around the first and third portions, and the first connection member. The first portion has a first surface opposing the first connection member and including a recess and a protrusion.

Abstract: According to one embodiment, a semiconductor device includes a semiconductor chip, first and second conductive members, a first connection member, and a resin portion. The first conductive member includes first and second portions. The second portion is electrically connected to the semiconductor chip. A direction from the semiconductor chip toward the second portion is aligned with a first direction. A direction from the second portion toward the first portion is aligned with a second direction crossing the first direction. The second conductive member includes a third portion. The first connection member is provided between the first and third portion. The first connection member is conductive. The resin portion includes a first partial region. The first partial region is provided around the first and third portions, and the first connection member. The first portion has a first surface opposing the first connection member and including a recess and a protrusion.

Abstract: According to one embodiment, a semiconductor device includes a semiconductor chip, first and second conductive members, a first connection member, and a resin portion. The first conductive member includes first and second portions. The second portion is electrically connected to the semiconductor chip. A direction from the semiconductor chip toward the second portion is aligned with a first direction. A direction from the second portion toward the first portion is aligned with a second direction crossing the first direction. The second conductive member includes a third portion. The first connection member is provided between the first and third portion. The first connection member is conductive. The resin portion includes a first partial region. The first partial region is provided around the first and third portions, and the first connection member. The first portion has a first surface opposing the first connection member and including a recess and a protrusion.

Abstract: In an optical fiber device having a configuration in which an optical fiber is joined to a side surface of another optical fiber, a joint portion is suppressed from reaching a high temperature. The optical fiber device includes a first fluoride fiber, a second fluoride fiber, and a heat dissipation member. The first fluoride fiber guides light. The second fluoride fiber has a first end on or from which light is incident or output and a second end at which an end surface of the second fluoride fiber is obliquely joined to a side surface of the first fluoride fiber.

Abstract: In an optical fiber device having a configuration in which an optical fiber is joined to a side surface of another optical fiber, a joint portion is suppressed from reaching a high temperature. The optical fiber device includes a first fluoride fiber, a second fluoride fiber, and a heat dissipation member. The first fluoride fiber guides light. The second fluoride fiber has a first end on or from which light is incident or output and a second end at which an end surface of the second fluoride fiber is obliquely joined to a side surface of the first fluoride fiber.

Abstract: According to one embodiment, there is provided a semiconductor device including a first wiring, a semiconductor chip, a first bonding member, having a first melting temperature, located between the first wiring and the semiconductor chip, and a second wiring including a first connection unit and a second connection unit spaced from the first connection unit. A second bonding member having a second melting temperature higher than the first melting temperature is located between the semiconductor chip and the first connection unit. A third wiring is also provided, and a third bonding member having a third melting temperature lower than the second melting temperature is located between the second connection unit and the third wiring.

Abstract: In the present invention, an operation knob is provided with a knob outer section that forms an outer shell, and a knob inner section into which one edge of a lever section is inserted. The knob inner section has a claw section that allows insertion when the lever section is inserted, and once the lever section has been inserted, hooks the lever section towards the inner side of the knob inner section. A groove section is formed in the lever section and extends in a direction perpendicular to the axis direction of the lever section. The knob outer section is made up of two parts, which are an outer casing and a knob cover. The knob cover is provided with protruding sections, which protrude towards the outer casing and fit into the groove section when the lever section is attached to the knob inner section.