Patents by Inventor Satoshi HIDA

Satoshi HIDA has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 10510918
    Abstract: An endoscope includes: an imaging device chip having a chip connection portion; a tubular housing tube used to a scope tip portion of an endoscope; a substrate to which the imaging device chip is fixed, the substrate having a substrate connection portion, the substrate being capable of bending at near the substrate connection portion when the substrate is inserted into the housing tube; a lead wire connecting the substrate connection portion and the chip connection portion; flexible and non-conductive resin covering an entirety of the lead wire; and an imaging module including the substrate provided with the imaging device chip thereon, the imaging module inserted into the housing tube.
    Type: Grant
    Filed: May 12, 2014
    Date of Patent: December 17, 2019
    Assignee: FUJIKURA LTD.
    Inventors: Wei-Zhi Hu, Kenichi Nakatate, Takeshi Segi, Kenichi Ishibashi, Fumihiko Nishimura, Satoshi Hida, Hitoe Iikura, Hideo Shiratani
  • Patent number: 9904047
    Abstract: An imaging mechanism includes: an imaging device; a light receiving section that is provided on one surface of the imaging device; a cover member that covers the one surface of the imaging device and the light receiving section; and a lens unit that has a plurality of lenses including a plano-convex lens having a flat portion and a lens barrel, and that is optically coupled to the light receiving section, the lens barrel fixing the plurality of lenses, wherein the plano-convex lens having the flat portion is provided at a closest position to the imaging device in the plurality of lenses such that the flat portion faces the imaging device, and the flat portion protrudes from an end of the lens barrel toward the imaging device and is fixed to the cover member.
    Type: Grant
    Filed: August 13, 2013
    Date of Patent: February 27, 2018
    Assignee: FUJIKURA LTD.
    Inventors: Satoshi Hida, Takeshi Segi, Kenichi Nakatate
  • Publication number: 20140249368
    Abstract: An endoscope includes: an imaging device chip having a chip connection portion; a tubular housing tube used to a scope tip portion of an endoscope; a substrate to which the imaging device chip is fixed, the substrate having a substrate connection portion, the substrate being capable of bending at near the substrate connection portion when the substrate is inserted into the housing tube; a lead wire connecting the substrate connection portion and the chip connection portion; flexible and non-conductive resin covering an entirety of the lead wire; and an imaging module including the substrate provided with the imaging device chip thereon, the imaging module inserted into the housing tube.
    Type: Application
    Filed: May 12, 2014
    Publication date: September 4, 2014
    Applicant: FUJIKURA LTD.
    Inventors: Wei-Zhi HU, Kenichi NAKATATE, Takeshi SEGI, Kenichi ISHIBASHI, Fumihiko NISHIMURA, Satoshi HIDA, Hitoe IIKURA, Hideo SHIRATANI
  • Publication number: 20130329026
    Abstract: An imaging mechanism includes: an imaging device; a light receiving section that is provided on one surface of the imaging device; a cover member that covers the one surface of the imaging device and the light receiving section; and a lens unit that has a plurality of lenses including a plano-convex lens having a flat portion and a lens barrel, and that is optically coupled to the light receiving section, the lens barrel fixing the plurality of lenses, wherein the plano-convex lens having the flat portion is provided at a closest position to the imaging device in the plurality of lenses such that the flat portion faces the imaging device, and the flat portion protrudes from an end of the lens barrel toward the imaging device and is fixed to the cover member.
    Type: Application
    Filed: August 13, 2013
    Publication date: December 12, 2013
    Applicant: Fujikura Ltd.
    Inventors: Satoshi HIDA, Takeshi SEGI, Kenichi NAKATATE