Abstract: An EPDM composition, which comprises a blend rubber comprising 100 parts by weight of blend rubber consisting of 20-80% by weight of EPDM containing 5-ethylidene-2-norbornene [ENB] as one type of diene component and 80-20% by weight of EPDM containing dicyclopentadiene [DCPD] as another type of diene component, and 0.5-10 parts by weight of an organic peroxide. Seal parts obtained by vulcanization molding of the EPDM composition show well balanced characteristics, even if dipped in hot water at high temperatures such as 200° C. for 500 hours or 300° C. for 24 hours, particularly with improved compression set characteristics.

Abstract: An electronic part mounting apparatus includes a chamber for cleaning a substrate and an electronic part by plasma, amounting mechanism for mounting the electronic part on the electronic part, and a conveying robot for conveying the substrate and the electronic part from the chamber to the mounting mechanism. After plasma cleaned, the substrate and the electronic part are swiftly conveyed to the mounting mechanism by the conveying robot. After the electronic part is mounted on the substrate by the mounting mechanism, the resultant combination of them is pulse heated. Therefore, the electronic part is appropriately mounted on the substrate in a state that those are exposed to the air. A part mounting mechanism is simplified.

Abstract: An electronic part mounting apparatus includes a chamber for cleaning a substrate and an electronic part by plasma, a mounting mechanism for mounting the electronic part on the electronic part, and a conveying robot for conveying the substrate and the electronic part from the chamber to the mounting mechanism. After plasma cleaned, the substrate and the electronic part are swiftly conveyed to the mounting mechanism by the conveying robot. After the electronic part is mounted on the substrate by the mounting mechanism, the resultant combination of them is pulse heated. Therefore, the electronic part is appropriately mounted on the substrate in a state that those are exposed to the air. A part mounting mechanism is simplified.

Abstract: In a bump bonding technique for forming a bump on an IC, including forming a ball at the tip of a gold wire protruding from a capillary, and providing a metal-to-metal joint by applying ultrasonic vibration from a ultrasonic head through the capillary while pressing the ball against a pad portion on the IC, the metal-to-metal joint is provided by applying the ultrasonic vibration at a frequency in a range of 130 to 320 kHz, more preferably in a range of 170 to 270 kHz, and most preferably at a frequency of 230±10 kHz at room temperatures and atmospheric pressure. Consequently, a bump is formed on an IC having a low heat resistance temperature in a satisfactory joint condition, and a bump is formed with good positional accuracy without giving the influence of heat to the surroundings.

Abstract: A fluorine-containing elastomer having a copolymer composition, which comprises 50-85% by mole of (a) vinylidene fluoride, 0-25% by mole of (b) tetrafluoroethylene, 7-20% by mole of (c) perfluoro(methyl vinyl ether), 3-15% by mole of (d) CF2═CFO[CF2CF(CF)O]nCF3 and 0.1-2% by mole of (e) RfX, where Rf is an unsaturated fluorohydrocarbon group having 2-8 carbon atoms and X is a bromine or iodine atom, can give curing products with distinguished low-temperature characteristics and solvent resistance without deteriorating the distinguished moldability and compression set characteristics proper to the fluorine-containing elastomer, and a fluorine-containing elastomer composition, which comprises 100 parts by weight of the present fluorine-containing elastomer, 0.1-10 parts by weight of an organic peroxide, 0.

Abstract: An electronic part mounting apparatus includes a chamber for cleaning a substrate and an electronic part by plasma, a mounting mechanism for mounting the electronic part on the electronic part, and a conveying robot for conveying the substrate and the electronic part from the chamber to the mounting mechanism. After plasma cleaned, the substrate and the electronic part are swiftly conveyed to the mounting mechanism by the conveying robot. After the electronic part is mounted on the substrate by the mounting mechanism, the resultant combination of them is pulse heated. Therefore, the electronic part is appropriately mounted on the substrate in a state that those are exposed to the air. A part mounting mechanism is simplified.

Abstract: A bare chip mounting method includes: a dicing step for dividing a semiconductor wafer into individual IC chips while the semiconductor wafer is being attached to a carrier; a washing step for washing the diced semiconductor wafer; a bump-bonding for carrying the washed semiconductor wafer to an assembly process while the semiconductor wafer is being attached to the carrier so as to form a bump on an electrode pad of the wafer; and a mounting step for mounting each of the IC chips, on which the bump is formed, onto a circuit formation body.

Abstract: To provide a film substrate treatment apparatus that appropriately mounts film substrates on an electrostatic adsorption stage. In the film substrate treatment apparatus, adsorption pads are disposed on the first adsorption units that mount film substrates on an electrostatic stage, and a pressing member that presses the edge portion areas of the film substrates against the stage is provided. The film substrates can thereby be reliably attached to the stage, and the film substrates can be appropriately treated in a decompressed atmosphere.

Abstract: A method for screening an apoptosis inhibitor characterized by screening a candidate via an effect on PGT. A cell protecting agent containing as the active ingredient a substance which can be incorporated into cells via prostaglandin transporter (PGT); and a screening method therefor comprising measuring the uptake into cells via PGT. An apoptosis inducer containing as the active ingredient a substance having a PGT inhibitory effect; and a screening method therefor comprising measuring the ability to induce apoptosis of cells with the expression of PGT. Because of having a cell apoptosis inhibitory effect, the cell protecting agent is useful as a nerve cell apoptosis inhibitor, a nerve cell protecting agent, etc. and applicable to the prevention or treatment of nervous diseases, etc. The apoptosis inducer is useful in preventing and/or treating diseases in association with cell proliferation such as tumor, etc.

Abstract: To provide a film substrate treatment apparatus that appropriately mounts film substrates on an electrostatic adsorption stage. In the film substrate treatment apparatus, adsorption pads are disposed on the first adsorption units that mount film substrates on an electrostatic stage, and a pressing member that presses the edge portion areas of the film substrates against the stage is provided. The film substrates can thereby be reliably attached to the stage, and the film substrates can be appropriately treated in a decompressed atmosphere.

Abstract: In a bump bonding technique for forming a bump on an IC, including forming a ball at the tip of a gold wire protruding from a capillary, and providing a metal-to-metal joint by applying ultrasonic vibration from a ultrasonic head through the capillary while pressing the ball against a pad portion on the IC, the metal-to-metal joint is provided by applying the ultrasonic vibration at a frequency in a range of 130 to 320 kHz, more preferably in a range of 170 to 270 kHz, and most preferably at a frequency of 230±10 kHz at room temperatures and atmospheric pressure. Consequently, a bump is formed on an IC having a low heat resistance temperature in a satisfactory joint condition, and a bump is formed with good positional accuracy without giving the influence of heat to the surroundings.

Abstract: A bare chip mounting method includes: a dicing step for dividing a semiconductor wafer into individual IC chips while the semiconductor wafer is being attached to a carrier; a washing step for washing the diced semiconductor wafer; a bump-bonding for carrying the washed semiconductor wafer to an assembly process while the semiconductor wafer is being attached to the carrier so as to form a bump on an electrode pad of the wafer; and a mounting step for mounting each of the IC chips, on which the bump is formed, onto a circuit formation body.

Abstract: It is the matter to be solved by the present invention to provide mRNA coding for the PGT of a human brain type and to provide a polynucleotide coding for the PGT of a human brain type prepared using the said mRNA as a template. There are provided mRNA coding for the PGT of a human brain type and having a molecular weight of 38-40 kilodaltons and a polynucleotide being prepared by the use of the said mRNA as a template and having a specific base sequence represented by SEQ ID NO: 2 of the Sequence Listing.

Abstract: A method for screening an apoptosis inhibitor characterized by screening a candidate via an effect on PGT. A cell protecting agent containing as the active ingredient a substance which can be incorporated into cells via prostaglandin transporter (PGT); and a screening method therefor comprising measuring the uptake into cells via PGT. An apoptosis inducer containing as the active ingredient a substance having a PGT inhibitory effect; and a screening method therefor comprising measuring the ability to induce apoptosis of cells with the expression of PGT. Because of having a cell apoptosis inhibitory effect, the cell protecting agent is useful as a nerve cell apoptosis inhibitor, a nerve cell protecting agent, etc. and applicable to the prevention or treatment of nervous diseases, etc. The apoptosis inducer is useful in preventing and/or treating diseases in association with cell proliferation such as tumor, etc.