Abstract: Disclosed is a non-thermofusible phenol resin powder having an average particle diameter of not more than 20 ?m and a single particle ratio of not less than 0.7. This non-thermofusible phenol resin powder preferably has a chlorine content of not more than 500 ppm. This non-thermofusible phenol resin powder is useful as an organic filler for sealing materials for semiconductors and adhesives for semiconductors. The non-thermofusible phenol resin powder is also useful as a precursor of functional carbon materials such as a molecular sieve carbon and a carbon electrode material.

Abstract: Disclosed is a non-thermofusible phenol resin powder having an average particle diameter of not more than 20 ?m and a single particle ratio of not less than 0.7. This non-thermofusible phenol resin powder preferably has a chlorine content of not more than 500 ppm. This non-thermofusible phenol resin powder is useful as an organic filler for sealing materials for semiconductors and adhesives for semiconductors. The non-thermofusible phenol resin powder is also useful as a precursor of functional carbon materials such as a molecular sieve carbon and a carbon electrode material.

Abstract: Disclosed is a non-thermofusible phenol resin powder having an average particle diameter of not more than 20 ?m and a single particle ratio of not less than 0.7. This non-thermofusible phenol resin powder preferably has a chlorine content of not more than 500 ppm. This non-thermofusible phenol resin powder is useful as an organic filler for sealing materials for semiconductors and adhesives for semiconductors. The non-thermofusible phenol resin powder is also useful as a precursor of functional carbon materials such as a molecular sieve carbon and a carbon electrode material.

Abstract: Disclosed is a thermofusible and thermosetting phenol resin powder having an average particle diameter of not more than 20 ?m and a single particle ratio of not less than 0.7. This phenol resin powder preferably has an average particle diameter of not more than 10 ?m, a variation coefficient of the particle size distribution of not more than 0.65, a particle sphericity of not less than 0.5 and a free phenol content of not more than 1000 ppm. Also disclosed are a dispersion liquid of such a phenol resin powder, and a method for producing a phenol resin powder having such characteristics.

Abstract: Disclosed is a non-thermofusible phenol resin powder having an average particle diameter of not more than 20 ?m and a single particle ratio of not less than 0.7. This non-thermofusible phenol resin powder preferably has a chlorine content of not more than 500 ppm. This non-thermofusible phenol resin powder is useful as an organic filler for sealing materials for semiconductors and adhesives for semiconductors. The non-thermofusible phenol resin powder is also useful as a precursor of functional carbon materials such as a molecular sieve carbon and a carbon electrode material.

Abstract: Disclosed is a non-thermofusible phenol resin powder having an average particle diameter of not more than 20 ?m and a single particle ratio of not less than 0.7. This non-thermofusible phenol resin powder preferably has a chlorine content of not more than 500 ppm. This non-thermofusible phenol resin powder is useful as an organic filler for sealing materials for semiconductors and adhesives for semiconductors. The non-thermofusible phenol resin powder is also useful as a precursor of functional carbon materials such as a molecular sieve carbon and a carbon electrode material.

Abstract: Disclosed is a non-thermofusible phenol resin powder having an average particle diameter of not more than 20 ?m and a single particle ratio of not less than 0.7. This non-thermofusible phenol resin powder preferably has a chlorine content of not more than 500 ppm. This non-thermofusible phenol resin powder is useful as an organic filler for sealing materials for semiconductors and adhesives for semiconductors. The non-thermofusible phenol resin powder is also useful as a precursor of functional carbon materials such as a molecular sieve carbon and a carbon electrode material.

Abstract: Disclosed is a non-thermofusible phenol resin powder having an average particle diameter of not more than 20 ?m and a single particle ratio of not less than 0.7. This non-thermofusible phenol resin powder preferably has a chlorine content of not more than 500 ppm. This non-thermofusible phenol resin powder is useful as an organic filler for sealing materials for semiconductors and adhesives for semiconductors. The non-thermofusible phenol resin powder is also useful as a precursor of functional carbon materials such as a molecular sieve carbon and a carbon electrode material.

Abstract: Disclosed is a thermofusible and thermosetting phenol resin powder having an average particle diameter of not more than 20 ?m and a single particle ratio of not less than 0.7. This phenol resin powder preferably has an average particle diameter of not more than 10 ?m, a variation coefficient of the particle size distribution of not more than 0.65, a particle sphericity of not less than 0.5 and a free phenol content of not more than 1000 ppm. Also disclosed are a dispersion liquid of such a phenol resin powder, and a method for producing a phenol resin powder having such characteristics.

Abstract: Disclosed is a non-thermofusible phenol resin powder having an average particle diameter of not more than 20 ?m and a single particle ratio of not less than 0.7. This non-thermofusible phenol resin powder preferably has a chlorine content of not more than 500 ppm. This non-thermofusible phenol resin powder is useful as an organic filler for sealing materials for semiconductors and adhesives for semiconductors. The non-thermofusible phenol resin powder is also useful as a precursor of functional carbon materials such as a molecular sieve carbon and a carbon electrode material.

Abstract: Disclosed is a non-thermofusible phenol resin powder having an average particle diameter of not more than 20 ?m and a single particle ratio of not less than 0.7. This non-thermofusible phenol resin powder preferably has a chlorine content of not more than 500 ppm. This non-thermofusible phenol resin powder is useful as an organic filler for sealing materials for semiconductors and adhesives for semiconductors. The non-thermofusible phenol resin powder is also useful as a precursor of functional carbon materials such as a molecular sieve carbon and a carbon electrode material.

Abstract: Disclosed is a non-thermofusible phenol resin powder having an average particle diameter of not more than 20 ?m and a single particle ratio of not less than 0.7. This non-thermofusible phenol resin powder preferably has a chlorine content of not more than 500 ppm. This non-thermofusible phenol resin powder is useful as an organic filler for sealing materials for semiconductors and adhesives for semiconductors. The non-thermofusible phenol resin powder is also useful as a precursor of functional carbon materials such as a molecular sieve carbon and a carbon electrode material.

Abstract: It is acknowledged that an electric double layer capacitor is markedly superior in power density and cycle characteristics to a secondary battery. However, a higher energy density is required to apply it to a power supply of hybrid vehicle, electric vehicle or the like. The present inventors have found that a carbonaceous material containing copper or a compound of copper exhibits excellent characteristics as an electrode material for capacitor and can realize a capacitor having a large capacity. In the electrode material and the capacitor, copper or a compound of copper exists in the amount of 0.8 to 30 parts by weight calculated on the metal basis based on 100 parts by weight of the carbonaceous material, particularly preferably.

Abstract: It is acknowledged that an electric double layer capacitor is markedly superior in power density and cycle characteristics to a secondary battery. However, a higher energy density is required to apply it to a power supply of hybrid vehicle, electric vehicle or the like. The present inventors have found that a carbonaceous material containing copper or a compound of copper exhibits excellent characteristics as an electrode material for capacitor and can realize a capacitor having a large capacity. In the electrode material and the capacitor, copper or a compound of copper exists in the amount of 0.8 to 30 parts by weight calculated on the metal basis based on 100 parts by weight of the carbonaceous material, particularly preferably.

Abstract: Disclosed are electrode materials that exhibit very sharp pore size distribution within the range of mesopores and include pores having a pore diameter within a range of X±&agr; nm (3.0≦X<10, &agr;=1.0; range of pore size distribution) of which volume accounts for 15% or more of the total volume of mesopores having a pore diameter within a range from 2.0 to 50 nm, and are suited for use in electric double layer capacitor, battery or the like of large capacitance and discharge of large current. These electrode materials are obtained by adding at least one transition metal or at least one transition metal compound to a carbon material or a carbon material precursor, and subjecting to a heat treatment at a temperature of 600° C. or higher.

Abstract: Activated carbon having a specific surface area of 700 to 1,500 m2/g, a pore volume of pores having a pore diameter of 10 nm or less of 0.20 to 0.8 cc/g, a proportion of a pore volume of pores having a pore diameter of 0.6 to 0.8 nm to a pore volume of pores having a pore diameter of 10 nm or less of 75% by volume or more, a grain bulk density of 0.4 to 1.1 g/cc, a packing density of 0.30 to 0.70 g/cc, an ash content of 1.0% or less, and a tensile strength of activated carbon grains of 30 kg/cm2 or more.