Patents by Inventor Satoshi IDESAKO

Satoshi IDESAKO has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Pressurizing device and pressurizing method
    Patent number: 11901199
    Abstract: A pressurizing device includes: a mounting base; an upper mold which pressurizes the target object mounted on the mounting base from above; a heating lower mold which is a lower mold heated in advance by a heater, and which heats the target object under pressure by sandwiching the mounting base with the upper mold; a cooling lower mold which is a lower mold cooled in advance by a cooler, and which cools the target object under pressure by sandwiching the mounting base with the upper mold; and a control device which switches the lower mold that contributes to the pressurization of the target object to the heating lower mold or the cooling lower mold in accordance with the status of progress of the pressurization process for the target object.
    Type: Grant
    Filed: September 17, 2020
    Date of Patent: February 13, 2024
    Assignee: NIKKISO CO., LTD.
    Inventors: Takahiro Mori, Satoshi Idesako
  • Pressurizing device and pressurizing method
    Patent number: 11037790
    Abstract: A pressurizing device includes: a mounting base; an upper mold which pressurizes the target object mounted on the mounting base from above; a heating lower mold which is a lower mold heated in advance by a heater, and which heats the target object under pressure by sandwiching the mounting base with the upper mold; a cooling lower mold which is a lower mold cooled in advance by a cooler, and which cools the target object under pressure by sandwiching the mounting base with the upper mold; and a control device which switches the lower mold that contributes to the pressurization of the target object to the heating lower mold or the cooling lower mold in accordance with the status of progress of the pressurization process for the target object.
    Type: Grant
    Filed: February 14, 2017
    Date of Patent: June 15, 2021
    Assignee: NIKKISO CO., LTD.
    Inventors: Takahiro Mori, Satoshi Idesako
  • PRESSURIZING DEVICE AND PRESSURIZING METHOD
    Publication number: 20210028018
    Abstract: A pressurizing device includes: a mounting base; an upper mold which pressurizes the target object mounted on the mounting base from above; a heating lower mold which is a lower mold heated in advance by a heater, and which heats the target object under pressure by sandwiching the mounting base with the upper mold; a cooling lower mold which is a lower mold cooled in advance by a cooler, and which cools the target object under pressure by sandwiching the mounting base with the upper mold; and a control device which switches the lower mold that contributes to the pressurization of the target object to the heating lower mold or the cooling lower mold in accordance with the status of progress of the pressurization process for the target object.
    Type: Application
    Filed: September 17, 2020
    Publication date: January 28, 2021
    Applicant: NIKKISO CO., LTD.
    Inventors: Takahiro MORI, Satoshi IDESAKO
  • PRESSURIZING DEVICE AND PRESSURIZING METHOD
    Publication number: 20190139769
    Abstract: A pressurizing device includes: a mounting base; an upper mold which pressurizes the target object mounted on the mounting base from above; a heating lower mold which is a lower mold heated in advance by a heater, and which heats the target object under pressure by sandwiching the mounting base with the upper mold; a cooling lower mold which is a lower mold cooled in advance by a cooler, and which cools the target object under pressure by sandwiching the mounting base with the upper mold; and a control device which switches the lower mold that contributes to the pressurization of the target object to the heating lower mold or the cooling lower mold in accordance with the status of progress of the pressurization process for the target object.
    Type: Application
    Filed: February 14, 2017
    Publication date: May 9, 2019
    Applicant: NIKKISO CO., LTD.
    Inventors: Takahiro MORI, Satoshi IDESAKO