Abstract: A semiconductor device includes a substrate, a semiconductor package including a semiconductor chip, and a connector between the substrate and the semiconductor package, the connector having opposing first and second planar surfaces, the first planar surface in contact with the substrate and the second planar surface in contact with the semiconductor package. The connector also includes a plurality of wires extending between the first and second planar surfaces to electrically connect electrodes of the substrate to electrodes of the semiconductor package.

Abstract: A semiconductor device includes a substrate, a semiconductor package including a semiconductor chip, and a connector between the substrate and the semiconductor package, the connector having opposing first and second planar surfaces, the first planar surface in contact with the substrate and the second planar surface in contact with the semiconductor package. The connector also includes a plurality of wires extending between the first and second planar surfaces to electrically connect electrodes of the substrate to electrodes of the semiconductor package.

Abstract: An analyzing apparatus for a semiconductor device includes an image acquiring unit configured to acquire an image of a sample and generate image data of the acquired image, a specifying unit configured to specify a failure position of the sample based on the image data, and a marking unit configured to make a mark on a surface position of the sample that corresponds to the failure position as specified by the specifying unit.