Patents by Inventor Satoshi Imaeda

Satoshi Imaeda has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 10381159
    Abstract: A plurality of dielectric layers containing one of CaZrO3 and SrZrO3 and a plurality of internal electrodes containing Ni are alternately disposed in a second direction. The plurality of internal electrodes includes a plurality of first internal electrodes and a plurality of second internal electrodes. Each of first connecting portions of the first internal electrodes includes a first end portion connected to a first terminal electrode. Each of second connecting portions of the second internal electrodes includes a second end portion connected to a second terminal electrode. The first end portions of the first connecting portions adjacent to each other in the second direction are located not to overlap with each other when viewed from the second direction. The second end portions of the second connecting portions adjacent to each other in the second direction are located not to overlap with each other when viewed from the second direction.
    Type: Grant
    Filed: April 26, 2017
    Date of Patent: August 13, 2019
    Assignee: TDK CORPORATION
    Inventors: Takuya Imaeda, Toshihiro Iguchi, Satoshi Takahara
  • Patent number: 9011750
    Abstract: The injection molding device of the present invention is provided with a supply pipe which supplies a heat medium to a mold, a discharge pipe which discharges the heat medium from the mold, a mold temperature adjustor to which the supply pipe and the discharge pipe are connected to adjust the temperature of the mold, and a discharge rate adjusting unit which is provided with a variable flow control valve installed on the discharge pipe to adjust a flow rate of the heat medium, a discharge pipe variable flow control valve bypass pipe for bypassing the variable flow control valve and a discharge pipe bypass on-off valve installed on the bypass pipe to change a flow rate of the heat medium and which is installed at a position upstream from the mold temperature adjustor on the discharge pipe.
    Type: Grant
    Filed: April 21, 2010
    Date of Patent: April 21, 2015
    Assignee: Mitsubishi Heavy Industries Plastic Technology Co., Ltd.
    Inventors: Michitaka Hattori, Satoshi Imaeda, Toshihiko Kariya
  • Patent number: 8932506
    Abstract: The resin injection molding method of the present invention is a method for molding resins inside a cavity formed within a mold. The method comprises injecting resins into the cavity through a plurality of paths installed so as to be openable and closable and optionally maintaining the resin inside the cavity at a pressure; closing each of the plurality of paths such that the resins injected from each path converge, there being a time difference between when a first path and a second path of the plurality of paths are closed; and solidifying at least the resin which is injected from the path closed earliest with a crystallinity greater than or equal to a predetermined crystallinity degree.
    Type: Grant
    Filed: April 7, 2010
    Date of Patent: January 13, 2015
    Assignee: Mitsubishi Heavy Industries Plastic Technology
    Inventors: Naoki Toda, Satoshi Imaeda, Takeshi Yamaguchi, Toshihiko Kariya
  • Patent number: 8741193
    Abstract: The injection molding method for injecting a resin into a cavity formed within a mold is provided with a heating step in which the temperature of a cavity surface forming the cavity of the mold is heated to a temperature equal to or higher than a heat distortion temperature of the resin and an injection step in which after the heating step, during a decrease in temperature of the cavity surface of the mold, the resin is injected into the cavity.
    Type: Grant
    Filed: March 18, 2010
    Date of Patent: June 3, 2014
    Assignee: Mitsubishi Heavy Industries Plastic Technology Co., Ltd.
    Inventors: Naoki Toda, Satoshi Imaeda, Toshihiko Kariya, Takeshi Yamaguchi
  • Patent number: 8460586
    Abstract: An injection molding device is provided with a mold, an injection unit equipped with an injection screw that is displaceably configured such that a molten resin is filled into a cavity by forward movement to perform plural injection operations including at least a filling operation and a pressure keeping operation by displacing the injection screw, a position sensor for detecting the position of the injection screw, a temperature sensor capable of measuring the temperature of the vicinity of the cavity of the mold, a temperature adjustment unit capable of adjusting the temperature of the mold by heating or cooling the mold, a control unit for controlling the displacement of the injection screw and the temperature of the mold and determining plural switching timings of the injection operations on the basis of the position of the screw, and a display unit for displaying an image.
    Type: Grant
    Filed: April 15, 2009
    Date of Patent: June 11, 2013
    Assignee: Mitsubishi Heavy Industries Plastics Technology Co., Ltd.
    Inventors: Toshihiko Kariya, Michitaka Hattori, Shigeru Nozaki, Satoshi Imaeda
  • Patent number: 8318061
    Abstract: In a mold temperature control circuit of an injection molding device, such a molding cycle is repeated that, prior to injection of a resin, a heating-use medium is returned to molds and heated to a temperature suitable for resin injection, after injection of the resin, the heating-use medium is switched to a cooling-use medium, thereby the cooling-use medium is returned to the molds and cooling is conducted to give a temperature equal to or lower than a temperature at which the resin is solidified.
    Type: Grant
    Filed: June 29, 2009
    Date of Patent: November 27, 2012
    Assignee: Mitsubishi Heavy Industries Plastic Technology Co., Ltd.
    Inventors: Michitaka Hattori, Satoshi Imaeda, Toshihiko Kariya
  • Publication number: 20120286451
    Abstract: The injection molding method for injecting a resin into a cavity formed within a mold is provided with a heating step in which the temperature of a cavity surface forming the cavity of the mold is heated to a temperature equal to or higher than a heat distortion temperature of the resin and an injection step in which after the heating step, during a decrease in temperature of the cavity surface of the mold, the resin is injected into the cavity.
    Type: Application
    Filed: March 18, 2010
    Publication date: November 15, 2012
    Applicant: MITSUBISHI HEAVY INDUSTRIES PLASTIC TECHNOLOGY CO., LTD
    Inventors: Naoki Toda, Satoshi Imaeda, Toshihiko Kariya, Takeshi Yamaguchi
  • Publication number: 20120241125
    Abstract: The injection molding device of the present invention is provided with a supply pipe which supplies a heat medium to a mold, a discharge pipe which discharges the heat medium from the mold, a mold temperature adjustor to which the supply pipe and the discharge pipe are connected to adjust the temperature of the mold, and a discharge rate adjusting unit which is provided with a variable flow control valve installed on the discharge pipe to adjust a flow rate of the heat medium, a discharge pipe variable flow control valve bypass pipe for bypassing the variable flow control valve and a discharge pipe bypass on-off valve installed on the bypass pipe to change a flow rate of the heat medium and which is installed at a position upstream from the mold temperature adjustor on the discharge pipe.
    Type: Application
    Filed: April 21, 2010
    Publication date: September 27, 2012
    Applicant: MITSUBISHI HEAVY INDUSTRIES PLASTIC TECHNOLOGY CO., LTD.
    Inventors: Michitaka Hattori, Satoshi Imaeda, Toshihiko Kariya
  • Publication number: 20120211921
    Abstract: The resin injection molding method of the present invention is a method for molding resins inside a cavity formed within a mold. The method comprises injecting resins into the cavity through a plurality of paths installed so as to be openable and closable and optionally maintaining the resin inside the cavity at a pressure; closing each of the plurality of paths such that the resins injected from each path converge, there being a time difference between when a first path and a second path of the plurality of paths are closed; and solidifying at least the resin which is injected from the path closed earliest with a crystallinity greater than or equal to a predetermined crystallinity degree.
    Type: Application
    Filed: April 7, 2010
    Publication date: August 23, 2012
    Applicant: MITSUBISHI HEAVY INDUSTRIES PLASTIC TECHNOLOGY CO., LTD.
    Inventors: Naoki Toda, Satoshi Imaeda, Takeshi Yamaguchi, Toshihiko Kariya
  • Patent number: 8043537
    Abstract: There are provided an injection molding system, a computer program, a method of injection molding, and an injection molding machine capable of performing precise temperature control of a mold even when there is a delay in temperature increase of the mold in heat supply with a heating medium. The temperature control is performed so that temperatures of a fixed mold and a movable mold are maintained between an upper limit TU and a lower limit TL of a predetermined temperature range after start of injection of resin during an injection molding cycle. The temperature control of the fixed mold and the movable mold is performed only by switching ON/OFF supply of the heating medium, and cooling with a cooling medium is not performed.
    Type: Grant
    Filed: October 31, 2007
    Date of Patent: October 25, 2011
    Assignee: Mitsubishi Heavy Industries Plastics Technology Co., Ltd.
    Inventors: Yoshio Shikase, Michitaka Hattori, Shigeru Nozaki, Satoshi Imaeda, Toshihiko Kariya
  • Patent number: 8043538
    Abstract: In a mold temperature control circuit of an injection molding device, such a molding cycle is repeated that, prior to injection of a resin, a heating-use medium is returned to molds and heated to a temperature suitable for resin injection, after injection of the resin, the heating-use medium is switched to a cooling-use medium, thereby the cooling-use medium is returned to the molds and cooling is conducted to give a temperature equal to or lower than a temperature at which the resin is solidified.
    Type: Grant
    Filed: June 29, 2009
    Date of Patent: October 25, 2011
    Assignee: Mitsubishi Heavy Industries Plastic Technology Co., Ltd.
    Inventors: Michitaka Hattori, Satoshi Imaeda, Toshihiko Kariya
  • Publication number: 20110210461
    Abstract: An injection molding device is provided with a mold, an injection unit equipped with an injection screw that is displaceably configured such that a molten resin is filled into a cavity by forward movement to perform plural injection operations including at least a filling operation and a pressure keeping operation by displacing the injection screw, a position sensor for detecting the position of the injection screw, a temperature sensor capable of measuring the temperature of the vicinity of the cavity of the mold, a temperature adjustment unit capable of adjusting the temperature of the mold by heating or cooling the mold, a control unit for controlling the displacement of the injection screw and the temperature of the mold and determining plural switching timings of the injection operations on the basis of the position of the screw, and a display unit for displaying an image.
    Type: Application
    Filed: April 15, 2009
    Publication date: September 1, 2011
    Applicant: Mitsubishi Heavy Industries Plastic Technology Co. Ltd.
    Inventors: Toshihiko Kariya, Michitaka Hattori, Shigeru Nozaki, Satoshi Imaeda
  • Publication number: 20110115120
    Abstract: In a mold temperature control circuit of an injection molding device, such a molding cycle is repeated that, prior to injection of a resin, a heating-use medium is returned to molds and heated to a temperature suitable for resin injection, after injection of the resin, the heating-use medium is switched to a cooling-use medium, thereby the cooling-use medium is returned to the molds and cooling is conducted to give a temperature equal to or lower than a temperature at which the resin is solidified.
    Type: Application
    Filed: June 29, 2009
    Publication date: May 19, 2011
    Applicant: Mitsubishi Heavy Industries Plastic Technology Co. Ltd.
    Inventors: Michitaka Hattori, Satoshi Imaeda, Toshihiko Kariya
  • Publication number: 20100044900
    Abstract: There are provided an injection molding system, a computer program, a method of injection molding, and an injection molding machine capable of performing precise temperature control of a mold even when there is a delay in temperature increase of the mold in heat supply with a heating medium. The temperature control is performed so that temperatures of a fixed mold and a movable mold are maintained between an upper limit TU and a lower limit TL of a predetermined temperature range after start of injection of resin during an injection molding cycle. The temperature control of the fixed mold and the movable mold is performed only by switching ON/OFF supply of the heating medium, and cooling with a cooling medium is not performed.
    Type: Application
    Filed: October 31, 2007
    Publication date: February 25, 2010
    Applicant: MITSUBISHI HEAVY INDUSTRIES PLASTIC TECHNOLOGY CO
    Inventors: Yoshio Shikase, Michitaka Hattori, Shigeru Nozaki, Satoshi Imaeda, Toshihiko Kariya
  • Patent number: 7578666
    Abstract: Provided is a molding machine system enabling a free setting of execution timings of respective steps in a molding cycle of heating of a mold, injection and pressure holding of a molding material, cooling of the mold, etc. The molding machine system repeating a series of molding cycle comprises three temperature sensors arranged at predetermined places of a mold, a change-over valve unit having a heat medium channel by which heating medium from a heating unit, cooling medium from a cooling unit and pressurized air are changed over to be supplied into and recovered from the mold and a molding control means, provided on the change-over valve unit, having a temperature judging program judging respective detected temperatures of the three temperature sensors to give a judgement result and a timer to give a time set signal.
    Type: Grant
    Filed: September 12, 2006
    Date of Patent: August 25, 2009
    Assignee: Mitsubishi Heavy Industries Plastic Technology Co., Ltd.
    Inventors: Toshio Shimoda, Toshifumi Furukawa, Satoshi Imaeda
  • Publication number: 20090053347
    Abstract: Provided is a molding machine system enabling a free setting of execution timings of respective steps in a molding cycle of heating of a mold, injection and pressure holding of a molding material, cooling of the mold, etc. The molding machine system repeating a series of molding cycle comprises three temperature sensors arranged at predetermined places of a mold, a change-over valve unit having a heat medium channel by which heating medium from a heating unit, cooling medium from a cooling unit and pressurized air are changed over to be supplied into and recovered from the mold and a molding control means, provided on the change-over valve unit, having a temperature judging program judging respective detected temperatures of the three temperature sensors to give a judgement result and a timer to give a time set signal.
    Type: Application
    Filed: September 12, 2006
    Publication date: February 26, 2009
    Applicant: Mitsubishi Heavy Industries Plastic Technology Co., Ltd.
    Inventors: Toshio Shimodo, Toshifumi Furukawa, Satoshi Imaeda