Abstract: A process control method and data registration program for a surface mount line includes retrieving printing quality data, mounting quality data, and soldering pass/fail data from a primary recorder, recording the printing quality data, the mounting quality data, and the soldering pass/fail data for each of the components in a secondary recorder, and determining whether the solder printer and the mounter need adjustment by using the data of the components which are associated with the soldering pass/fail data recorded in the secondary recorder by a computer.

Abstract: A process control method and data registration program for a surface mount line includes retrieving printing quality data, mounting quality data, and soldering pass/fail data from a primary recorder, recording the printing quality data, the mounting quality data, and the soldering pass/fail data for each of the components in a secondary recorder, and determining whether the solder printer and the mounter need adjustment by using the data of the components which are associated with the soldering pass/fail data recorded in the secondary recorder by a computer.

Abstract: A process control method is provided for a surface mount line including a solder printer for printing solder on a surface of a substrate, a solder print inspector for inspecting the printed solder and outputting printing quality data, a mounter for mounting components on the substrate with the solder printed, a mount inspector for inspecting a state of the mounted components and outputting mounting quality data, a reflow furnace for heating the solder to solder the components to the substrate, and a soldering inspector for inspecting a state of the soldering and outputting soldering pass/fail data.

Abstract: A method for inspecting a pattern includes measuring, in a first direction, a width of a reference pattern at plural positions in the reference patter; measuring, in a second direction, a width of the reference pattern at the plural positions. Comparing the first and second width and determining which of the first and second widths is shortest; extracting a defect in a pattern to be inspected; and evaluating the extracted defect depending on the determined direction.

Abstract: A process control method is provided for a surface mount line including a solder printer for printing solder on a surface of a substrate, a solder print inspector for inspecting the printed solder and outputting printing quality data, a mounter for mounting components on the substrate with the solder printed, a mount inspector for inspecting a state of the mounted components and outputting mounting quality data, a reflow furnace for heating the solder to solder the components to the substrate, and a soldering inspector for inspecting a state of the soldering and outputting soldering pass/fail data.

Abstract: A method for inspecting a pattern includes measuring, in a first direction, a width of a reference pattern at plural positions in the reference patter; measuring, in a second direction, a width of the reference pattern at the plural positions. Comparing the first and second width and determining which of the first and second widths is shortest; extracting a defect in a pattern to be inspected; and evaluating the extracted defect depending on the determined direction.

Abstract: The difference data between the real patter data Sij, and a 5×5 window with a noticed pixel in the center and the design pattern data Rij obtained by the design pattern data of the window being shifted in a plurality of directions with respect to the design pattern data Rij is found by a shift direction operation section, and the design pattern data in the direction in which the total of the pixels is minimum is selected from the difference data by a selection section, the difference between the central pixels Sij, Qij of the selected design pattern data and the central pixels Sij, Qij of the windows of the real pattern data is found by a difference operation section, and the difference and a threshold are compared in a defect judgement section, and thereby the pattern inspection of the object is carried out.