Abstract: A cooling system includes a first module provided with a substrate, a heat generating member, and a cooling member, a second module provided on a first side of a housing in a depth direction with respect to the first module and provided with a substrate, a heat generating member, and a cooling member, an upstream side tube configured to supply a cooling medium to the cooling member of the first module from an outside, a downstream side tube configured to supply the cooling medium passed through the cooling member of the first module to the cooling member of the second module, and a discharge tube configured to discharge the cooling medium passed through the first module and the second module.

Abstract: A pipe protection device which is provided at a supply-side coupler provided at an end portion of a supply pipe which supplies a heat exchange medium to a heat exchange unit, and a discharge-side coupler provided at an end portion of a discharge pipe from which the heat exchange medium, which is supplied from the supply pipe to the heat exchange unit, is discharged, includes a supply-side support part having a recess along a contour of part of the supply pipe, a discharge-side support part having a recess along a contour of part of the discharge pipe, and a connecting part which supports the supply-side support part and the discharge-side support part at a predetermined interval and connects the supply-side support part and the discharge-side support part to a housing constituting a server.

Abstract: An electronic device includes a substrate which is provided in a housing and on which a heat generating member is mounted, a cooling member configured to cool the heat generating member, a first tube including one end connected to the cooling member and configured to supply a cooling medium to the cooling member or discharge the cooling medium from the cooling member, a joint member including a first connection portion extending in a tube axial direction of the first tube and connected to another end of the first tube, a support member fixed to the housing or the substrate, and a tube fixing portion configured to fix the first tube to the support member.

Abstract: The cooling component cools the object to be cooled that includes a high-temperature region and another region. Inside the cooling component, disposed is a flow passage through which the refrigerant that is supplied from a supply port and discharged toward a discharge port flows. The cooling component includes a cooling section opposing the high-temperature region and another cooling section. The flow passage includes: a refrigerant supply passage that includes an upstream-side passage disposed inside the cooling section and that cools the high-temperature region by the refrigerant; a connecting passage that connects to the refrigerant supply passage and that is disposed at a position further from the object to be cooled than the upstream-side passage; and a refrigerant discharge passage that is disposed inside the another cooling section, that includes a downstream-side passage connected to the connecting passage, that cools the other region by the refrigerant, and that discharges the refrigerant.

Abstract: The purpose of the present invention is to provide a cooling device that enable improvement in storage capacity in a casing to which a plurality of modules including heat generation members are mounted. The cooling device includes: a supply pipe that supplies a heat medium from the outside to the inside of a casing having mounted therein a plurality of modules each including an electronic circuit substrate having a heat generation member mounted therein and a cooling member for receiving heat from the heat generation member and for cooling the heat generation member by using the heat medium; and a relay member that includes first flow channels provided inside the casing and allowing the heat medium flowing in from the supply pipe to be delivered to a plurality of directions and that distributes the heat medium to a plurality of the cooling members via the first flow channels.

Abstract: A cooling apparatus according to an aspect of the present disclosure includes: a first flexible pipe at least a part of which is arranged inside a housing and through which a heat medium supplied from an outside of the housing passes, the housing including a plurality of modules installed in the housing, each of the plurality of modules including an electronic circuit board including a heat-generating member and a cooling member that receives heat from the heat-generating member and cools the heat-generating member by using the heat medium; and a branching member that causes the heat medium to branch from the first flexible pipe into the cooling member and a second flexible pipe, the cooling member being included in any one of the plurality of modules, the second flexible pipe supplying the heat medium to the cooling member included in any other module of the plurality of modules.

Abstract: An electronic device includes a substrate which is provided in a housing and on which a heat generating member is mounted, a cooling member configured to cool the heat generating member, a first tube including one end connected to the cooling member and configured to supply a cooling medium to the cooling member or discharge the cooling medium from the cooling member, a joint member including a first connection portion extending in a tube axial direction of the first tube and connected to another end of the first tube, a support member fixed to the housing or the substrate, and a tube fixing portion configured to fix the first tube to the support member.

Abstract: A cooling system includes a first module provided with a substrate, a heat generating member, and a cooling member, a second module provided on a first side of a housing in a depth direction with respect to the first module and provided with a substrate, a heat generating member, and a cooling member, an upstream side tube configured to supply a cooling medium to the cooling member of the first module from an outside, a downstream side tube configured to supply the cooling medium passed through the cooling member of the first module to the cooling member of the second module, and a discharge tube configured to discharge the cooling medium passed through the first module and the second module.

Abstract: A pipe protection device which is provided at a supply-side coupler provided at an end portion of a supply pipe which supplies a heat exchange medium to a heat exchange unit, and a discharge-side coupler provided at an end portion of a discharge pipe from which the heat exchange medium, which is supplied from the supply pipe to the heat exchange unit, is discharged, includes a supply-side support part having a recess along a contour of part of the supply pipe, a discharge-side support part having a recess along a contour of part of the discharge pipe, and a connecting part which supports the supply-side support part and the discharge-side support part at a predetermined interval and connects the supply-side support part and the discharge-side support part to a housing constituting a server.