Abstract: A plurality of pieces of design information created in the respective design processes and dependencies among the plurality of pieces of design information are stored. A piece of design information to be changed by a piece of design information that is input is extracted from the plurality of pieces of design information. The piece of design information is combined with the plurality of pieces of design information. An influence of the piece of design information on one or more pieces of design information other than the piece of design information to be changed is analyzed based on the dependencies, and it is determined whether the piece of design information is required to be changed. The design process is notified of a request for change of the piece of design information when it is determined that the piece of design information is required to be changed.

Abstract: A common parameter interface generation program being configured to cause a processor to execute a method, including: assigning identification information for identifying a control device, acquiring a list of parameters of a selected control device from a design information storage unit, associating the acquired list with the identification information and the names of the selected control device in each of the design information to generate a common parameter and of registering the common parameter in a common parameter storage unit, and generating, in each of design tools, a common parameter interface that acquires the value of the parameter of the control device from the common parameter storage unit and reads out the value to the design information in a data format in data format definition information which defines the data format required when the parameter is treated in the design tools.

Abstract: A sequence program creation device includes a search-key-circuit specification unit specifying a search key circuit; a search-area specification unit specifying a search area for searching for a circuit similar to the search key circuit; a search-index specification unit specifying an index in a process of calculating a similarity to the search key circuit; a similarity calculation unit calculating a similarity to the search key circuit, based on the index, for each circuit included in the search area; a search-target-part determination unit determining whether the similarity is equal to or more than a predetermined threshold for each circuit for which the similarity calculation unit has calculated the similarity; and a search-result display-screen display unit displaying on a search-result display screen a circuit whose similarity is determined to be equal to or more than the predetermined threshold by the search-target-part determination unit.

Abstract: A common parameter interface generation program being configured to cause a processor to execute a method, including: assigning identification information for identifying a control device, acquiring a list of parameters of a selected control device from a design information storage unit, associating the acquired list with the identification information and the names of the selected control device in each of the design information to generate a common parameter and of registering the common parameter in a common parameter storage unit, and generating, in each of design tools, a common parameter interface that acquires the value of the parameter of the control device from the common parameter storage unit and reads out the value to the design information in a data format in data format definition information which defines the data format required when the parameter is treated in the design tools.

Abstract: A sequence program creation device includes a search-key-circuit specification unit specifying a search key circuit; a search-area specification unit specifying a search area for searching for a circuit similar to the search key circuit; a search-index specification unit specifying an index in a process of calculating a similarity to the search key circuit; a similarity calculation unit calculating a similarity to the search key circuit, based on the index, for each circuit included in the search area; a search-target-part determination unit determining whether the similarity is equal to or more than a predetermined threshold for each circuit for which the similarity calculation unit has calculated the similarity; and a search-result display-screen display unit displaying on a search-result display screen a circuit whose similarity is determined to be equal to or more than the predetermined threshold by the search-target-part determination unit.

Abstract: A semiconductor device able to maintain a bonding state between a bump and an electrode and having high reliability even under thermal stress, wherein a sealing resin is interposed to bond the electrodes and bumps between a wiring board formed with a plurality of electrodes and an IC chip formed with a plurality of bumps, the bumps being formed under the condition that the following formula is satisfied. 100<((?A×F)/H)<125 where ?A represents the top diameter of a bump bonded with an electrode, H the height of a bump projecting from the IC chip and bonded with an electrode, and F the linear thermal expansion coefficient of the sealing resin.

Abstract: A semiconductor device able to maintain a bonding state between a bump and an electrode and having high reliability even under thermal stress, wherein a sealing resin is interposed to bond the electrodes and bumps between a wiring board formed with a plurality of electrodes and an IC chip formed with a plurality of bumps, the bumps being formed under the condition that the following formula is satisfied. 100<((?A×F)/H)<125 where ?A represents the top diameter of a bump bonded with an electrode, H the height of a bump projecting from the IC chip and bonded with an electrode, and F the linear thermal expansion coefficient of the sealing resin.

Abstract: A semiconductor device able to maintain a bonding state between a bump and an electrode and having high reliability even under thermal stress, wherein a sealing resin is interposed to bond the electrodes and bumps between a wiring board formed with a plurality of electrodes and an IC chip formed with a plurality of bumps, the bumps being formed under the condition that the following formula is satisfied. 100<((?A×F)/H)<125 where ?A represents the top diameter of a bump bonded with an electrode, H the height of a bump projecting from the IC chip and bonded with an electrode, and F the linear thermal expansion coefficient of the sealing resin.

Abstract: A semiconductor device able to maintain a bonding state between a bump and an electrode and having high reliability even under thermal stress, wherein a sealing resin is interposed to bond the electrodes and bumps between a wiring board formed with a plurality of electrodes and an IC chip formed with a plurality of bumps, the bumps being formed under the condition that the following formula is satisfied. 100<((?A×F)/H)<125 where ?A represents the top diameter of a bump bonded with an electrode, H the height of a bump projecting from the IC chip and bonded with an electrode, and F the linear thermal expansion coefficient of the sealing resin.

Abstract: A semiconductor device able to maintain a bonding state between a bump and an electrode and having high reliability even under thermal stress, wherein a sealing resin is interposed to bond the electrodes and bumps between a wiring board formed with a plurality of electrodes and an IC chip formed with a plurality of bumps, the bumps being formed under the condition that the following formula is satisfied. 100<((&PHgr;A×F)/H)<125 where &PHgr;A represents the top diameter of a bump bonded with an electrode, H the height of a bump projecting from the IC chip and bonded with an electrode, and F the linear thermal expansion coefficient of the sealing resin.

Abstract: A semiconductor device able to maintain a bonding state between a bump and an electrode and having high reliability even under thermal stress, wherein a sealing resin is interposed to bond the electrodes and bumps between a wiring board formed with a plurality of electrodes and an IC chip formed with a plurality of bumps, the bumps being formed under the condition that the following formula is satisfied. 100<((&PHgr;A×F)/H)<125 where &PHgr;A represents the top diameter of a bump bonded with an electrode, H the height of a bump projecting from the IC chip and bonded with an electrode, and F the linear thermal expansion coefficient of the sealing resin.

Abstract: A semiconductor device able to maintain a bonding state between a bump and an electrode and having high reliability even under thermal stress, wherein a sealing resin is interposed to bond the electrodes and bumps between a wiring board formed with a plurality of electrodes and an IC chip formed with a plurality of bumps, the bumps being formed under the condition that the following formula is satisfied.

Abstract: A semiconductor device comprising a semiconductor substrate on which metal bumps having narrowed base portions are bonded and coated on its top surface with a resin covering the base portions of the metal bumps, improving reliability of the bump bonds. Also, a method of production of a semiconductor device including steps of forming metal bumps in a wafer state, coating a resin for protecting a wiring surface of a semiconductor chip in the wafer state and cutting the semiconductor chip from the wafer, wherein the metal bumps have narrowed base portions and are bonded to the wiring surface of the semiconductor chip and the resin is coated covering the base portions of the metal bumps.

Abstract: A semiconductor device able to maintain a bonding state between a bump and an electrode and having high reliability even under thermal stress, wherein a sealing resin is interposed to bond the electrodes and bumps between a wiring board formed with a plurality of electrodes and an IC chip formed with a plurality of bumps, the bumps being formed under the condition that the following formula is satisfied.

Abstract: A spirally coiled electrode assembly has positive and negative electrodes each including a web-like collector coated with an active material on opposite surfaces thereof, and separators disposed between the positive and negative electrodes. A plurality of rectangular leads extend from opposite sides of the web-like collectors in directions perpendicular to a direction in which the positive and negative electrodes and the separators are wound. Positive and negative terminals are connected to the rectangular leads extending from the respective opposite sides of the web-like collectors. The spirally coiled electrode assembly, the rectangular leads, and the positive and negative terminals are housed in a cylindrical casing whose opposite ends are closed by respective caps. The positive and negative terminals are fixed to the caps, respectively.

Abstract: A nonaqueous electrolytic secondary battery is formed by winding a thin-film positive electrode, a thin-film negative electrode, and a thin-film separator. A cap is arranged at the distal end portion of a pole bored through the cap and interposed between a nut and a disk-like portion of the pole through a ceramic washer being in contact with the nut and a ceramic patch being in contact with the disk-like portion. The ceramic washer and the ceramic patch consist of alumina or zirconia. For a bolt for interposing a bus bar or a conductive line to fix the bus bar or the conductive line, a female screw portion formed in the pole is arranged in a space of a spindle.

Abstract: A nonaqueous electrolytic secondary battery has a seal whose transparency and permeability with respect to external gas or moisture can be suppressed to a low level and which has high reliability. The nonaqueous electrolytic secondary battery has an electrolytic solution injection port (32) for injecting a nonaqueous electrolytic solution and an expansion plug (4) for air-tightly sealing the electrolytic solution injection port. A metal seal (2) is arranged between the electrolytic solution injection port (32) and the expansion plug (4). The metal seal (2) is of a metal containing aluminum as a main component, or a stainless steel, and the expansion plug (4) is of stainless steel.

Abstract: A battery unit of a cartridge type for use as a power supply for electric motorcars, broadcasting apparatus and the like comprises a battery, a monitoring unit for monitoring the condition of the battery and storing information about the battery, a display for displaying data obtained by the monitoring unit, an I/O unit for sending out data representing the condition of the battery monitored by the monitoring unit to an external device, and a battery identification output unit for sending out a battery identification signal representing the type of the battery. The monitoring unit comprises a voltage measuring unit for measuring the supply voltage of the battery, a current measuring unit for measuring the current supplied from the battery, a temperature sensor for sensing the temperature of the battery, and a clock for indicating passage of time. The monitoring unit determines the quantity of residual electrical energy remaining in the battery when replacing the battery with a fully charged battery.