Abstract: Provided are a composition for semiconductor treatment capable of suppressing damage due to corrosion to wiring or the like including tungsten on an object to be treated, and efficiently removing contamination from a surface of the object to be treated, and a treatment method using the composition for semiconductor treatment. The treatment method includes a step of, after subjecting a wiring board including tungsten as a wiring material to chemical mechanical polishing using a composition containing an iron ion and a peroxide, subjecting the wiring board to treatment with a composition for semiconductor treatment which includes: a compound (A) having two or more of at least one selected from a group consisting of tertiary amino groups and salts thereof; and a water-soluble compound (B) having a solubility parameter of 10 or more, and which has a pH of from 2 to 7.

Abstract: A semiconductor treatment composition includes particles having a particle size of 0.1 to 0.3 micrometers in a number of 3×101 to 1.5×103 per mL.

Abstract: A semiconductor treatment composition includes potassium, sodium, and a compound A represented by the formula (1), and has a potassium content MK (ppm) and a sodium content MNa (ppm) that satisfy MK/MNa=1×10?1 to 1×104.

Abstract: A semiconductor treatment composition includes potassium, sodium, and a compound A represented by the formula (1), and has a potassium content MK (ppm) and a sodium content MNa (ppm) that satisfy MK/MNa=1×10?1 to 1×104.

Abstract: A semiconductor treatment composition includes potassium, sodium, and a compound A represented by the formula (1), and has a potassium content MK (ppm) and a sodium content MNa (ppm) that satisfy MK/MNa=1×10?1 to 1×104.

Abstract: A treatment composition for chemical mechanical polishing includes: (A) a water-soluble amine; (B) a water-soluble polymer having an aromatic hydrocarbon group-containing repeating unit; and an aqueous medium. The treatment composition for chemical mechanical polishing preferably further includes (C) an organic acid having an aromatic hydrocarbon group and has a pH of 9 or more.

Abstract: A semiconductor treatment composition includes particles having a particle size of 0.1 to 0.3 micrometers in a number of 3×101 to 1.5×103 per mL.

Abstract: A semiconductor treatment composition includes potassium and sodium, and has a potassium content MK (ppm) and a sodium content MNa (ppm) that satisfy MK/MNa=5×103 to 1×105.

Abstract: According to one embodiment, a semiconductor device manufacturing method comprises forming a film to be polished on a semiconductor substrate, and performing a CMP method on the film to be polished. The CMP method includes polishing the film to be polished by bringing a surface of the film to be polished into contact with a surface of a polishing pad having a negative Rsk value.

Abstract: A chemical mechanical polishing pad includes a polishing layer that is formed of a composition that includes a polyurethane, the polishing layer having a specific gravity of 1.1 to 1.3 and a thermal conductivity of 0.2 W/m·K or more.

Abstract: A chemical mechanical polishing pad includes a polishing layer formed using a composition that includes a thermoplastic polyurethane, the polishing layer having a specific gravity of 1.15 to 1.30, and a durometer D hardness of 50 to 80.

Abstract: A resin composition for wire coatings that has excellent adhesion with the center conductor as well as having excellent manufacturing efficiency for the coating layer and sufficient strength is described and claimed. This radiation curable resin composition for wire coating comprises the following ingredients (A), (B) and (D): (A) a urethane(meth)acrylate having two or more structural parts derived from an aliphatic polyol (B) a compound having a cyclic structure and one ethylenically unsaturated group, (D) a compound given by the following Formula (4a), wherein, R8 is a monovalent organic group having an ethylenically unsaturated group, and R9 is a hydrogen atom or a monovalent organic group that may have an ethylenically unsaturated group.

Abstract: The invention relates to a curable liquid resin composition comprising the following components (A), (B), and (C): (A) a urethane (meth)acrylate oligomer, (B) a monomer shown by the following formula (1), CH2?CR1COOR2 (1) wherein R1 represents a hydrogen atom or a methyl group and R2 represents a monovalent organic group, 40 wt % or more of the total amount of the component (B) being a monomer in which the R2 group in the formula (1) is a nonpolar organic group, and the monomer in the component (B) in which the R2 group in the formula (1) is a nonpolar organic group being hereinafter referred to as “nonpolar (meth)acrylate-containing monomer”, and (C) a polymerization initiator.

Abstract: This invention is a radiation curable resin composition for wire coatings that have excellent adhesion with the center conductor as well as having excellent manufacturing efficiency for the coating layer and sufficient strength. This radiation curable resin composition for wire coating comprising the following ingredients (A), (B) and (D): (A) a mixture of a urethane (meth)acrylate having a structure derived from an aliphatic polyol and a urethane (meth)acrylate not having a structure derived from a polyol, (B) a compound having a cyclic structure and one ethylenically unsaturated group, (D) a compound given by the following formula (4a) wherein, R8 is a monovalent organic group having an ethylenically unsaturated group, and R9 is a hydrogen atom or a monovalent organic group that may have an ethylenically unsaturated group.

Abstract: The invention relates to a curable liquid resin composition comprising: (A) a urethane(meth)acrylate having a structure originating from a polyol and a number average molecular weight of 800 g/mol or more, but less than 6,000 g/mol, and (B) a urethane(meth)acrylate having a structure originating from a polyol and a number average molecular weight of 6,000 g/mol or more, but less than 20,000 g/mol, wherein the total amount of the component (A) and component (B) is 20-95 wt % of the curable liquid resin composition and the content of the component (B) is 0.1-30 wt % of the total of the component (A) and component (B).

Abstract: The present invention is a radiation curable resin composition comprising: (A) a urethane (meth) aerylate which is a reaction product of a polyol, a polyisocyanate, and a hydroxyl group-containing (meth) aerylate; (B) a compound having a cyclic structure and one ethylenically unsaturated group; (C) from about 0 to about 5 mass % of a compound having two or more ethylenically unsaturated group; and (D) a polyol having a number average molecular weight of about 1500 or more. In another embodiment of the invention component (A) must include a polyester polyol and the polyol of component (D) must have a number average molecular weight of from about 500 to about 1500. The composition is useful for coating electric wire.

Abstract: The present invention provides a curable liquid resin composition which, when cured, exhibits excellent removability from an adjacent coating layer and is suitable for an optical fiber upjacket material. The curable liquid resin optical fiber upjacket composition comprising a urethane (meth)acrylate or a (meth)acrylate oligomer, a reactive diluent, a polymerization initiator, and a polyol compound having a molecular weight of 1500 or more.

Abstract: The invention relates to a curable liquid resin composition comprising the following components (A), (B), and (C): (A) a urethane (meth)acrylate oligomer, (B) a monomer shown by the following formula (1), CH2?CR1COOR2 (1) wherein R1 represents a hydrogen atom or a methyl group and R2 represents a monovalent organic group, 40 wt % or more of the total amount of the component (B) being a monomer in which the R2 group in the formula (1) is a nonpolar organic group, and the monomer in the component (B) in which the R2 group in the formula (1) is a nonpolar organic group being hereinafter referred to as “nonpolar (meth)acrylate-containing monomer”, and (C) a polymerization initiator.

Abstract: The present invention provides a curable liquid resin composition which, when cured, exhibits excellent removability from an adjacent coating layer and is suitable for an optical fiber upjacket material. The curable liquid resin optical fiber upjacket composition comprising a urethane (meth)acrylate or a (meth)acrylate oligomer, a reactive diluent, a polymerization initiator, and a polyol compound having a molecular weight of 1500 or more.

Abstract: The present invention provides a curable liquid resin composition which, when cured, exhibits excellent removability from an adjacent coating layer and is suitable as an optical fiber upjacket material. The curable liquid resin optical fiber upjacket composition comprising a urethane(meth)acrylate or a (meth)acrylate oligomer containing two or more (meth)acryloyl groups, a reactive diluent, a polymerization initiator, and a urethane(meth)acrylate compound containing at least one (meth)acryloyl group and selected from (D1) to (D4) shown by the following general formula (1). (DI) In the formula (1), R1 represents a methyl group, R2 and R3 individually represent a divalent organic group, and R4 represents a monovalent organic group. (D2) In the formula (1), R1 represents a hydrogen atom, R2 and R3 individually represent divalent organic groups, and R4 represents a polyol residue having a molecular weight of 1500 or more.