Patents by Inventor Satoshi Kitaichi

Satoshi Kitaichi has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 5705793
    Abstract: A thin film electric heater employs voltage and current suppressed below values of an allowable voltage and an allowable current. The thin film electric heater includes a thin film electric resistor to be formed directly on a surface of an object to be heated and is energized to effect heating. The resistor has a surface resistivity r, expressed by r=.rho./t (where .rho. is the volume resistivity of the thin film electric resistor and t is the film thickness of the thin film electric resistor), within a range to achieve the heating function of the thin film electric heater while the values of voltage and current applied to the thin film electric heater are suppressed below the values of the allowable voltage and the allowable current.
    Type: Grant
    Filed: May 28, 1996
    Date of Patent: January 6, 1998
    Assignee: Daiho Industrial Co., Ltd.
    Inventors: Satoshi Kitaichi, Chiaki Nakamura, Michio Tanaka, Atushi Fukuta
  • Patent number: 5569474
    Abstract: A mold includes a thin film electric heating employing voltage and current suppressed below values of an allowable voltage and an allowable current. The thin film electric heat includes a thin film electric resistor formed directly on a surface of the mold and is energized to effect heating. The resistor has a surface resistivity r, expressed by r=.rho./t (where .rho. is the volume resistivity of the thin film electric resistor and t is the film thickness of the thin film electric resistor), within a range to achieve the heating function of the thin film electric heater while the values of voltage and current applied to the thin film electric heater are suppressed below the values of the allowable voltage and the allowable current.
    Type: Grant
    Filed: June 5, 1995
    Date of Patent: October 29, 1996
    Assignee: Daiho Industrial Co., Ltd.
    Inventors: Satoshi Kitaichi, Chiaki Nakamura, Michio Tanaka, Atushi Fukuta
  • Patent number: 4127432
    Abstract: Chip type circuit elements are mounted on adhesive layers provided on predetermined positions of a printed circuit board by pushing up each circuit element stack inserted in a magazine which is vertically held just below the corresponding adhesive layer and which is inserted through a corresponding through-hole defined by a lattice-shaped and horizontally placed magazine guide. This method and apparatus can quickly mount chip type circuit elements on the printed circuit board, and make possible an easy change of the circuit element pattern, without necessitating the use of an NC machine.
    Type: Grant
    Filed: April 12, 1977
    Date of Patent: November 28, 1978
    Assignee: Matsushita Electric Industrial Co., Ltd.
    Inventors: Satoshi Kuwano, Shun-ichi Yabuzaki, Satoshi Kitaichi, Seiichi Takesawa, Hitoshi Minabe, Tsuneshi Nakamura