Patents by Inventor Satoshi Kokura

Satoshi Kokura has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 5325012
    Abstract: The features of the present invention are 1) to apply metallization on the bonding surface of a piezoelectric ceramic with a metal likely to react with the piezoelectric ceramic material, 2) when the piezoelectric ceramic material is soldered on the bonding surface, to apply metallization with a metal likely to react with the solder material, 3) to provide between the metallizing layers formed in 1) and 2) a metallizing layer including metal which prevents reaction between the metals and their diffusion, 4) to use a mounting member for the piezoelectric ceramic which has substantially the same thermal expansion coefficient as the piezoelectric ceramic in non-polarization condition and 5) to solder in the non-polarization condition and thereafter to polarize.
    Type: Grant
    Filed: February 20, 1992
    Date of Patent: June 28, 1994
    Assignees: Hitachi, Ltd, Hitachi Material Engineering, Ltd., Hitachi Engineering Service Co., Ltd.
    Inventors: Ichiya Sato, Takao Yoneyama, Hisanori Okamura, Satoshi Kokura, Minoru Yanagibashi
  • Patent number: 4902867
    Abstract: A high heat resisting wire (5) is made of amide-imide-coated wire, and a conductive terminal (4) is made of Cu or Cu alloy such as brass P-containing solder, BAg-1, BAg-2 are used as joining assistant (4). A high heat resisting wire (5) is made of an amide-imide-coated wire and a conductive terminal (3) is made of soft steel or SUS steel, a silver-solder is used as joining assistant (4). A metallic joining conductive layer (8) is formed between a Cu core wire (7) of the insulated wire (5) and the conductive terminal (3 ) with the joining assistant (4). The insulated wire (5) is joined to the conductive terminal (3) and a joined body having high joining strength can be obtained.
    Type: Grant
    Filed: October 6, 1988
    Date of Patent: February 20, 1990
    Assignee: Hitachi, Ltd.
    Inventors: Takashi Haramaki, Mitsuo Nakamura, Satoshi Kokura, Takao Funamoto, Katsuyoshi Terakado
  • Patent number: 4691856
    Abstract: Disclosed is a diffusion bonding method which can be applied to superalloys and comprises forming in advance an alloy layer containing an additional element or elements having a higher diffusion speed than that of the principal constituent element of a base metal and a lower melting point than that of the base metal on the joint surface of the base metal consisting of a heat-resistant superalloy based on Co, Ni, Fe, Ti or the like, and bringing the joint surfaces into contact so as to diffuse B.
    Type: Grant
    Filed: June 28, 1985
    Date of Patent: September 8, 1987
    Assignee: Hitachi, Ltd.
    Inventors: Takashi Haramaki, Takao Funamoto, Satoshi Kokura, Masahisa Inagaki, Ryutaro Jimbou, Toshimi Sasaki, Kousei Nagayama
  • Patent number: 4663649
    Abstract: A metallized layer formed on a SiC sintered body essentially consists of a metal conductor such as Cu or Au as its principal component and a binder such as phosphorous alloy, the oxide of which forms a vitreous material together with a silicon oxide formed previously on the surface of the SiC sintered body, the metallized layer is bonded to the SiC sintered body through a fused vitreous layer of a composite oxide formed during sintering of the metallized layer in an oxidizing atmosphere, the fused vitreous layer of the composite oxide essentially consists of the silicon oxide and the oxides of the binder.The metallized layer exhibits an improved wettability to solders.
    Type: Grant
    Filed: June 16, 1983
    Date of Patent: May 5, 1987
    Assignee: Hitachi, Ltd.
    Inventors: Hideo Suzuki, Satoshi Kokura, Osamu Asai, Kunio Miyazaki
  • Patent number: 4645119
    Abstract: A heat exchanger and a method of manufacturing a heat exchanger by brazing metal members mainly made of Al or Al alloy is disclosed. The heat exchanger has a plurality of brazed metal members, at least one of the brazed metal members being made of brazing sheet clad with a brazing material. The brazed portions of the metal members or the whole surface of the heat exchanger are coated with a corrosion-resistant fluoride flux consisting essentially of 25-40% KF, 38-54% AlF3 and 3-30% ZnF2 by weight which forms a corrosion-inhibiting metallic film.
    Type: Grant
    Filed: July 5, 1984
    Date of Patent: February 24, 1987
    Assignee: Hitachi, Ltd.
    Inventors: Takashi Haramaki, Katsuhiko Shiota, Satoshi Kokura, Takao Funamoto, Akira Tomita
  • Patent number: 4454408
    Abstract: An electric power supply in pulse form is applied between a welding electrode and workpieces. The temperature of a molten pool is measured by a radiation-type thermometer when no power supply pulse is applied, and the welding condition is controlled in response to an output signal of the radiation-type thermometer.
    Type: Grant
    Filed: July 27, 1981
    Date of Patent: June 12, 1984
    Assignee: Hitachi, Ltd.
    Inventors: Ryoichi Kajiwara, Satoshi Kokura, Yuzo Kozono, Akira Onuma
  • Patent number: 4436982
    Abstract: In a two electrode welding method wherein welding is carried out by means of arcs struck between two electrodes and a parent metal, the two electrodes being located in side-by-side, spaced-apart relation in a direction in which the welding surface advances and movable relative to the parent metal, a portion of the parent metal is preheated by the arc struck between the leading electrode and the parent metal, and a preheated portion is melted by the heat of the arc struck between the trailing electrode and the parent metal when the former has moved to a position above the preheated portion of the latter to provide a deposited metal. The method has particular utility in applications where metal of high heat conductivity, such as copper, is welded.
    Type: Grant
    Filed: November 19, 1981
    Date of Patent: March 13, 1984
    Assignee: Hitachi, Ltd.
    Inventors: Satoshi Kokura, Masayasu Nihei, Hiroshi Wachi, Hiromi Mashida, Kousaku Senda
  • Patent number: 4396823
    Abstract: In a welding apparatus having a plurality of electrodes and adapted for carrying out welding operation on a workpiece by alternately supplying currents to the individual electrodes through switching elements, an apparatus and method of controlling the currents supplied to the electrodes, comprising selecting the values of the currents supplied to the individual electrodes depending on the material of the workpiece, and carrying out the welding operation on the workpiece by alternately supplying the currents of the selected values to the individual electrodes respectively through the switching elements. The method is featured by the fact that the ratio between the individual currents is selected under the condition that the sum of the values of all the currents is maintained at a predetermined value.
    Type: Grant
    Filed: October 22, 1981
    Date of Patent: August 2, 1983
    Assignee: Hitachi, Ltd.
    Inventors: Masayasu Nihei, Satoshi Kokura, Eiji Ashida, Yuzo Kozono, Akira Onuma
  • Patent number: 4280137
    Abstract: Disclosed is a method and apparatus for automatically controlling arc welding, wherein pieces of optical information provided by at least two bands of different wavelengths of light radiated from a weld area being arc-welded under predetermined welding conditions are alternately picked up by an optical device to extract various weld factors representing the actual status of the weld area from these pieces of optical information, and the extracted weld factors representing the actual status of the weld area are compared with the desired values of the weld factors representing the desired status of the weld area to compute the error or errors of the welding conditions, so that the welding conditions can be corrected on the basis of the detected error or errors of the welding conditions, whereby the weld factors can be controlled to the desired values.
    Type: Grant
    Filed: January 22, 1979
    Date of Patent: July 21, 1981
    Assignee: Hitachi, Ltd.
    Inventors: Eiji Ashida, Masayasu Nihei, Hiroshi Wachi, Akira Sato, Satoshi Kokura