Patents by Inventor Satoshi Kuwazaki

Satoshi Kuwazaki has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 6247640
    Abstract: A device for arranging conductive particles in a preselected pattern for the connection of electric circuit boards or electric parts is disclosed. Particularly, a device capable of surely and efficiently transferring, e.g., solder bumps to the electrode pads of a semiconductor chip or the leads of a TAB (Tape Automated Bonding) tape and a conductive particle transferring method using the same are disclosed.
    Type: Grant
    Filed: January 12, 2000
    Date of Patent: June 19, 2001
    Assignee: Ricoh Company, Ltd.
    Inventors: Satoshi Kuwazaki, Kazushi Iwata, Yoshihiro Yoshida, Tsutomu Sakatsu, Toshiaki Iwafuchi
  • Patent number: 6063701
    Abstract: A process for manufacturing a device for arranging conductive particles in a preselected pattern for the connection of electric circuit boards or electric parts is disclosed. Particularly, a device capable of surely and efficiently transferring, e.g., solder bumps to the electrode pads of a semiconductor chip or the leads of a TAB (Tape Automated Bonding) tape and a conductive particle transferring method using the same are disclosed.
    Type: Grant
    Filed: September 15, 1997
    Date of Patent: May 16, 2000
    Assignee: Ricoh Company, Ltd.
    Inventors: Satoshi Kuwazaki, Kazushi Iwata, Yoshihiro Yoshida, Tsutomu Sakatsu, Toshiaki Iwafuchi