Patents by Inventor Satoshi Maeda

Satoshi Maeda has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20250252429
    Abstract: Provided is a settlement system including a settlement terminal, a settlement server, and a settlement authentication server. The settlement server is connected to a community-currency management server, the community-currency management server includes a member information saving device, a member-account transaction-history recording device, and a zero-sum checking device.
    Type: Application
    Filed: February 4, 2025
    Publication date: August 7, 2025
    Inventors: Makoto NISHIBE, Satoshi Maeda, Kota Sanuki, Tetsuji Naneko
  • Publication number: 20250157593
    Abstract: A reaction-path search system calculates a reaction path in a structure formed of multiple atoms as a change in a structure represented by a positional relationship of the multiple atoms. The reaction-path search system including: a structural change calculation unit which calculates a change in the structure in which a result of a function FAFIR(Q) is at the minimum; a differential coefficient calculation unit which calculates at least one of a second differential coefficient b or a third differential coefficient a of E(Q) at the positions of the multiple atoms; and an equilibrium state change calculation unit which causes the structural change calculation unit to calculate the change in the structure in transition from the first equilibrium state to the second equilibrium state, prior to the other fragment pairs with lower priority than the fragment pair with higher priority based on the magnitude of a and b.
    Type: Application
    Filed: January 26, 2023
    Publication date: May 15, 2025
    Applicant: NATIONAL UNIVERSITY CORPORATION HOKKAIDO UNIVERSITY
    Inventor: Satoshi MAEDA
  • Publication number: 20250142975
    Abstract: A semiconductor device includes a semiconductor chip having a plurality of layers formed on a surface. Here, a power supply wiring to which a power supply voltage is supplied, a ground wiring to which a ground voltage is supplied, MOS transistors connected to the power supply and ground wirings, and a trigger circuit, which is electrically connected to a gate electrode of the MOS transistor via a first wiring, are formed in the plurality of layers. The MOS transistors and the trigger circuit are formed in a first layer, the first wiring is formed in a second layer which is an upper layer of the first layer, and the first wiring includes a first portion extending in a first direction and a second portion which extends in a second direction intersecting the first direction and is electrically connected to the first portion.
    Type: Application
    Filed: October 15, 2024
    Publication date: May 1, 2025
    Inventors: Yasuyuki MORISHITA, Koki NARITA, Satoshi MAEDA
  • Patent number: 12172409
    Abstract: An inorganic substrate/polymer film laminate with an attached protective film that allows for easy individual removal even when stored in a stacked state for a long period of time is provided. A first laminate is characterized by including an inorganic substrate, a polymer film layer and a first protective film, in that order, wherein the surface roughness Ra of the surface of the inorganic substrate opposite of the polymer film layer is 0.02-1.2 ?m.
    Type: Grant
    Filed: February 22, 2022
    Date of Patent: December 24, 2024
    Assignee: TOYOBO CO., LTD.
    Inventors: Kaya Tokuda, Satoshi Maeda, Tetsuo Okuyama, Naoki Watanabe
  • Publication number: 20240395547
    Abstract: This semiconductor apparatus has a base film and a semiconductor film formed on the base film, wherein the base film comprises a polyimide obtained by condensation polymerization of an aromatic diamine and an aromatic tetracarboxylic acid anhydride and has a tensile elasticity in the machine direction of 7 GPa or more, and the semiconductor film is polycrystalline and comprises crystal particles having an average particle size of 1 ?m or more.
    Type: Application
    Filed: July 26, 2022
    Publication date: November 28, 2024
    Applicants: University of Tsukuba, TOYOBO CO., LTD.
    Inventors: Kaoru TOKO, Muneatsu NAKAMURA, Satoshi MAEDA
  • Publication number: 20240352052
    Abstract: One aspect of the present invention is a method for producing a compound represented by following general formula (1), the method being characterized by including a step of mixing ethylene, a compound represented by following general formula (2), and a compound represented by following general formula (3) to react with each other to give a compound represented by following general formula (4): A1 to A4 each independently represent an aromatic group, and Z1 and Z2 each independently represent an oxygen atom, a sulfur atom, or a borane (BH3), Z3 represents an oxygen atom or a sulfur atom, n1 to n3 each independently represent 0 or 1, and X represents a halogen atom.
    Type: Application
    Filed: August 10, 2022
    Publication date: October 24, 2024
    Inventors: Tsuyoshi Mita, Satoshi Maeda, Hideaki Takano
  • Publication number: 20240307991
    Abstract: Provided is a resistance spot welding method suitable for manufacturing a welded joint exhibiting excellent delayed fracture resistance. The resistance spot welding method includes sandwiching two or more overlapped steel sheets between a pair of welding electrodes, applying current to the steel sheets while pressing the steel sheets, forming a nugget on overlapping surfaces of the steel sheets to join the steel sheets, and after the joining, applying vibration directly or indirectly to the nugget so that the steel sheets are caused to vibrate at a frequency of 100 Hz or more and a maximum amplitude of 10 nm to 500 ?m.
    Type: Application
    Filed: May 17, 2022
    Publication date: September 19, 2024
    Applicant: JFE STEEL CORPORATION
    Inventors: Satoshi MAEDA, Kazuki ENDOH, Yuki TOJI, Nao KAWABE
  • Publication number: 20240227363
    Abstract: Provided is an inorganic substrate/heat-resistant polymer film laminate in which vibration during handling is suppressed. A laminate of a heat-resistant polymer film and an inorganic substrate that uses substantially no adhesive is characterized by that a shear peel strength between the heat-resistant polymer film and the inorganic substrate is 0.8 MPa or more and a tensile modulus of the heat-resistant polymer film is 4-9 GPa.
    Type: Application
    Filed: July 7, 2022
    Publication date: July 11, 2024
    Applicant: TOYOBO CO., LTD.
    Inventors: Kaya TOKUDA, Tetsuo OKUYAMA, Satoshi MAEDA, Harumi YONEMUSHI, Denichirou MIZUGUCHI
  • Publication number: 20240227373
    Abstract: The present invention provides a multilayer body of an inorganic substrate and a heat-resistant polymer film, the multilayer body being suppressed in vibrations during handling. A multilayer body of a heat-resistant polymer film and an inorganic substrate according to the present invention does not substantially use an adhesive and is characterized in that: the heat-resistant polymer film is transparent; the tensile elastic modulus E1 (GPa) and the thickness T1 (?m) of the multilayer body satisfy formula (1); and the storage elastic modulus E2 (GPa) at 280° C. and the thickness T1 (?m) of the multilayer body satisfy formula (2).
    Type: Application
    Filed: July 7, 2022
    Publication date: July 11, 2024
    Applicant: TOYOBO CO., LTD.
    Inventors: Kaya TOKUDA, Tetsuo OKUYAMA, Satoshi MAEDA, Harumi YONEMUSHI, Denichirou MIZUGUCHI
  • Publication number: 20240150882
    Abstract: To provide a galvanized steel sheet having high strength, specifically, a tensile strength of 1,150 MPa or more, and excellent resistance spot weldability, a base steel sheet has a defined chemical composition, an amount of diffusible hydrogen in the base steel sheet is 0.20 mass ppm or less, and surface roughness Ra of the galvanized steel sheet is 0.6 ?m or less.
    Type: Application
    Filed: February 25, 2022
    Publication date: May 9, 2024
    Applicant: JFE STEEL CORPORATION
    Inventors: Satoshi MAEDA, Hiromi YOSHITOMI, Masaki KOBA, Nao KAWABE, Tatsuya NAKAGAITO, Katsuya HOSHINO, Hiroshi MATSUDA
  • Publication number: 20240150864
    Abstract: To provide a galvanized steel sheet having high strength; specifically, with a tensile strength of 1160 MPa or more and excellent resistance spot weldability. A chemical composition of a base steel sheet contains one or more of Ti, Nb, V, and Zr: 0.02% or more and 0.20% or less in total, and an amount of diffusible hydrogen in a zinc or zinc alloy coating layer is 0.40 mass ppm or less.
    Type: Application
    Filed: February 25, 2022
    Publication date: May 9, 2024
    Applicant: JFE STEEL CORPORATION
    Inventors: Satoshi MAEDA, Nao KAWABE, Hiromi YOSHITOMI
  • Publication number: 20240116274
    Abstract: An inorganic substrate/polymer film laminate with an attached protective film that allows for easy individual removal even when stored in a stacked state for a long period of time is provided. A first laminate is characterized by including an inorganic substrate, a polymer film layer and a first protective film, in that order, wherein the surface roughness Ra of the surface of the inorganic substrate opposite of the polymer film layer is 0.02-1.2 ?m.
    Type: Application
    Filed: February 22, 2022
    Publication date: April 11, 2024
    Applicant: TOYOBO CO., LTD.
    Inventors: Kaya TOKUDA, Satoshi MAEDA, Tetsuo OKUYAMA, Naoki WATANABE
  • Publication number: 20240083867
    Abstract: A compound of the formula (I) or a salt thereof (R represents methyl group or fluorine atom) having an mPGES-1 inhibitory activity and useful as an active ingredient of a medicament for prophylactic and/or therapeutic treatment of such diseases as inflammation, pain, or rheumatism.
    Type: Application
    Filed: February 1, 2022
    Publication date: March 14, 2024
    Applicant: ASKA PHARMACEUTICAL CO., LTD.
    Inventors: Makoto OKADA, Youichi NAKANO, Takashi NOSE, Satoshi MAEDA, Tomoaki WATANABE
  • Publication number: 20240075718
    Abstract: The invention provides a laminate having a protective film release auxiliary tape and comprising a rigid temporary support body (inorganic substrate) and a polymer film provided with a protective film. The laminate is configured such that the protective film can be peeled from the polymer film without separating the polymer film from the temporary support body. The laminate comprises an inorganic substrate, a heat-resistant polymer film, a protective film, and a protective film release auxiliary tape in this order. The adhesion strength F1 according to a 90 degree peeling method between the inorganic substrate and the heat-resistant polymer film, the adhesion strength F2 according to a 90 degree peeling method between the heat-resistant polymer film and the protective film, and the adhesion strength F3 according to a 90 degree peeling method between the protective film and the protective film release auxiliary tape satisfy the relationship F3>F1>F2.
    Type: Application
    Filed: June 9, 2022
    Publication date: March 7, 2024
    Applicant: TOYOBO CO., LTD.
    Inventors: Kaya TOKUDA, Satoshi MAEDA, Tetsuo OKUYAMA, Harumi YONEMUSHI, Denichirou MIZUGUCHI
  • Patent number: 11924736
    Abstract: A wireless communication unit and a wireless network system enable a plurality of wireless communication units to be wirelessly cooperated with a simple structure, can easily realize cooperative operations, and can execute IP packet transfer control without acquiring communication path information from an external network. A relay wireless communication portion that is connectable to an upstream unit (upstream wireless base station portion) that is another upstream wireless communication unit via an upstream inter-unit wireless bearer is provided. A wireless base station portion is connectable to a downstream unit (downstream relay wireless communication portion) that is another downstream wireless communication unit via a downstream inter-unit wireless bearer.
    Type: Grant
    Filed: December 23, 2019
    Date of Patent: March 5, 2024
    Assignee: Japan Radio Co., Ltd.
    Inventors: Katsuhiko Sato, Yusuke Egawa, Kunimitsu Arai, Satoshi Maeda, Sadayuki Katsumata
  • Publication number: 20240059057
    Abstract: Provided is a laminated film that includes a heat-resistant polymer film and a first protective film laminated on one of the surfaces of the heat-resistant polymer film, wherein: the first protective film has a first substrate and a first adhesive layer provided on the first substrate; the first substrate, the first adhesive layer, and the heat-resistant polymer film are laminated in this order; the first substrate is a polyester film or a polyolefin film; the first adhesive layer contains a urethane-based resin; and the maximum diameter of a gelled product in the first adhesive layer is equal to or less than 14 ?m.
    Type: Application
    Filed: October 28, 2021
    Publication date: February 22, 2024
    Applicant: TOYOBO CO., LTD.
    Inventors: Kaya TOKUDA, Tetsuo OKUYAMA, Satoshi MAEDA, Naoki WATANABE, Mayumi AKASHI
  • Patent number: 11833795
    Abstract: The invention provides a multilayer body of an inorganic substrate and a highly heat-resistant film, wherein the surface of the inorganic substrate is sufficiently smooth after removal of the highly heat-resistant film from the multilayer body, and the inorganic substrate is re-usable. The multilayer body uses substantially no adhesive and is characterized by (1) a tensile elastic modulus of the highly heat-resistant film of 4 GPa or more, (2) a bonding strength between the highly heat-resistant film and the inorganic substrate of 0.3 N/cm or less, (3) a surface roughness Ra of a surface of the highly heat-resistant film, said surface being in contact with the inorganic substrate, of 5 nm or less, and (4) a surface roughness Ra of the surface of the inorganic substrate after removal of the highly heat-resistant film from the multilayer body of 3 nm or less.
    Type: Grant
    Filed: June 9, 2021
    Date of Patent: December 5, 2023
    Assignee: TOYOBO CO., LTD.
    Inventors: Kaya Tokuda, Tetsuo Okuyama, Satoshi Maeda, Naoki Watanabe, Harumi Yonemushi, Denichirou Mizuguchi
  • Publication number: 20230256534
    Abstract: Provided is a resistance spot welding method suitable for manufacturing a weld joint exhibiting excellent delayed fracture resistance. The resistance spot welding method includes sandwiching two or more overlapped steel sheets between a pair of welding electrodes, applying current to the steel sheets while pressing the steel sheets, forming a nugget on overlapping surfaces of the steel sheets to join the steel sheets, and after the joining, directly or indirectly irradiating the nugget with sound waves having a frequency of 10 Hz or more and 100000 Hz or less so that a sound pressure level on a surface of the steel sheet is 30 dB or more.
    Type: Application
    Filed: May 26, 2021
    Publication date: August 17, 2023
    Applicant: JFE STEEL CORPORATION
    Inventors: Satoshi MAEDA, Kazuki ENDOH, Yuki TOJI, Nao KAWABE
  • Publication number: 20230243364
    Abstract: An impeller includes a hub having a circular plate shape with an axial line as a center, a shroud disposed to face the hub in a direction of the axial line, and a plurality of blades disposed with a space from each other in a circumferential direction between the hub and the shroud. A meridian plane shape of the impeller differs in the circumferential direction.
    Type: Application
    Filed: December 30, 2022
    Publication date: August 3, 2023
    Applicants: MITSUBISHI HEAVY INDUSTRIES, LTD., WASEDA UNIVERSITY
    Inventors: Satoshi Maeda, Takeshi Sano, Shinji Fukao, Atsushi Nakagawa, Keisuke Matsumoto, Kazuyoshi Miyagawa
  • Publication number: 20230229746
    Abstract: A computer extracts, by a processor, one or more registrants from among a plurality of registrants based on first biometric information detected by a first sensor. The computer acquires, by the processor, attribute information associated with each of the one or more registrants from among attribute information associated with each of the plurality of registrants. The computer outputs information in a mode corresponding to the attribute information associated with each of the one or more registrants. The computer performs, by the processor, authentication for second biometric information detected by a second sensor according to output of the information by using the second biometric information and registered biometric information associated with each of the one or more registrants.
    Type: Application
    Filed: March 27, 2023
    Publication date: July 20, 2023
    Applicant: FUJITSU LIMITED
    Inventors: Kazuki Osamura, Satoshi Maeda, Akira Fujii, Eiji Nagao, Yoshihiko Nishida