Patents by Inventor Satoshi Maji

Satoshi Maji has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Substrate for power module, circuit board for power module, and power module
    Patent number: 10720375
    Abstract: A substrate for a power module (100) of the present invention includes a metal substrate (101), an insulating resin layer (102) provided on the metal substrate (101), and a metal layer (103) provided on the insulating resin layer (102). The insulating resin layer (102) includes a thermosetting resin (A) and inorganic fillers (B) dispersed in the thermosetting resin (A), a maximum value of a dielectric loss ratio of the insulating resin layer (102) at a frequency of 1 kHz and 100° C. to 175° C. is equal to or less than 0.030, and a change in a relative permittivity is equal to or less than 0.10.
    Type: Grant
    Filed: July 20, 2016
    Date of Patent: July 21, 2020
    Assignee: SUMITOMO BAKELITE CO., LTD.
    Inventors: Shunsuke Mochizuki, Kazuya Kitagawa, Yoji Shirato, Keita Nagahashi, Mika Tsuda, Satoshi Maji
  • SUBSTRATE FOR POWER MODULE, CIRCUIT BOARD FOR POWER MODULE, AND POWER MODULE
    Publication number: 20190341331
    Abstract: A substrate for a power module (100) of the present invention includes a metal substrate (101), an insulating resin layer (102) provided on the metal substrate (101), and a metal layer (103) provided on the insulating resin layer (102). The insulating resin layer (102) includes a thermosetting resin (A) and inorganic fillers (B) dispersed in the thermosetting resin (A), a maximum value of a dielectric loss ratio of the insulating resin layer (102) at a frequency of 1 kHz and 100° C. to 175° C. is equal to or less than 0.030, and a change in a relative permittivity is equal to or less than 0.10.
    Type: Application
    Filed: July 20, 2016
    Publication date: November 7, 2019
    Applicant: SUMITOMO BAKELITE CO., LTD.
    Inventors: Shunsuke Mochizuki, Kazuya Kitagawa, Yoji Shirato, Keita Nagahashi, Mika Tsuda, Satoshi Maji
  • Thermally conductive sheet and semiconductor device
    Patent number: 10269689
    Abstract: A thermally conductive sheet of the present invention includes a thermosetting resin (A), and an inorganic filler material (B) which is dispersed in the thermosetting resin (A). In the thermally conductive sheet according to the present invention, the volume resistivity of the cured product of the thermally conductive sheet, which is measured one minute later after an applied voltage of 1000 V is applied thereto on the basis of JIS K 6911 and at a temperature of 175° C., is greater than or equal to 1.0×108 ?·m.
    Type: Grant
    Filed: January 28, 2015
    Date of Patent: April 23, 2019
    Assignee: SUMITOMO BAKELITE COMPANY LIMITED
    Inventors: Shunsuke Mochizuki, Kazuya Kitagawa, Yoji Shirato, Keita Nagahashi, Mika Tsuda, Satoshi Maji, Motomi Kurokawa, Kazuya Hirasawa
  • Thermally conductive sheet and semiconductor device
    Patent number: 9859189
    Abstract: A thermally conductive sheet of the present invention includes a thermosetting resin (A) and an inorganic filler material (B) that is dispersed in the thermosetting resin (A). In the thermally conductive sheet of the present invention, at a frequency of 1 kHz and at a temperature of 100° C. to 175° C., the maximum value of a dielectric loss factor of a cured product of the thermally conductive sheet is less than or equal to 0.030, and a change in relative dielectric constant of the cured product of the thermally conductive sheet is less than or equal to 0.10.
    Type: Grant
    Filed: January 28, 2015
    Date of Patent: January 2, 2018
    Assignee: SUMITOMO BAKELITE CO., LTD.
    Inventors: Shunsuke Mochizuki, Kazuya Kitagawa, Yoji Shirato, Keita Nagahashi, Mika Tsuda, Satoshi Maji, Motomi Kurokawa, Kazuya Hirasawa
  • THERMALLY CONDUCTIVE SHEET AND SEMICONDUCTOR DEVICE
    Publication number: 20170162484
    Abstract: A thermally conductive sheet of the present invention includes a thermosetting resin (A), and an inorganic filler material (B) which is dispersed in the thermosetting resin (A). In the thermally conductive sheet according to the present invention, the volume resistivity of the cured product of the thermally conductive sheet, which is measured one minute later after an applied voltage of 1000 V is applied thereto on the basis of JIS K 6911 and at a temperature of 175° C., is greater than or equal to 1.0×108 ?·m.
    Type: Application
    Filed: January 28, 2015
    Publication date: June 8, 2017
    Applicant: SUMITOMO BAKELITE CO., LTD.
    Inventors: Shunsuke Mochizuki, Kazuya Kitagawa, Yoji Shirato, Keita Nagahashi, Mika Tsuda, Satoshi Maji, Motomi Kurokawa, Kazuya Hirasawa
  • THERMALLY CONDUCTIVE SHEET AND SEMICONDUCTOR DEVICE
    Publication number: 20170011986
    Abstract: A thermally conductive sheet of the present invention includes a thermosetting resin (A) and an inorganic filler material (B) that is dispersed in the thermosetting resin (A). In the thermally conductive sheet of the present invention, at a frequency of 1 kHz and at a temperature of 100° C. to 175° C., the maximum value of a dielectric loss factor of a cured product of the thermally conductive sheet is less than or equal to 0.030, and a change in relative dielectric constant of the cured product of the thermally conductive sheet is less than or equal to 0.10.
    Type: Application
    Filed: January 28, 2015
    Publication date: January 12, 2017
    Applicant: SUMITOMO BAKELITE CO., LTD.
    Inventors: Shunsuke Mochizuki, Kazuya Kitagawa, Yoji Shirato, Keita Nagahashi, Mika Tsuda, Satoshi Maji, Motomi Kurokawa, Kazuya Hirasawa