Patents by Inventor Satoshi Manda

Satoshi Manda has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 10864590
    Abstract: The present application discloses a soldering apparatus including a driving portion for moving a soldering iron to perform soldering on a surface of an electronic board including soldering regions. The soldering regions have a base region and at least one replication region existing at a position different from the base region. The replication region has an arrangement pattern that is the same as an arrangement pattern of a soldering position in the base region. The soldering apparatus includes an input portion for receiving input of positional relationship data, which represents a positional relationship between the base region and the at least one replication region, and for receiving base pattern data, which represents the arrangement pattern of the soldering position in the base region. The soldering apparatus includes a controller which causes the driving portion to move the soldering iron based on the base pattern data and the positional relationship data in a soldering operation.
    Type: Grant
    Filed: September 27, 2018
    Date of Patent: December 15, 2020
    Assignee: HAKKO CORPORATION
    Inventors: Yoshitomo Teraoka, Satoshi Manda, Tomoo Takahara
  • Patent number: 10864589
    Abstract: A melting tool control apparatus comprises a drive mechanism, a melt processing assembly configured to perform a melt process, a receiving module that receives input of three-dimensional coordinate information of a first point where the melt process is to be performed and input of a position information indicating a position different from the first point, and a process control module configured to control the melt processing assembly to perform the melt process when the distal end is at the first point.
    Type: Grant
    Filed: January 16, 2018
    Date of Patent: December 15, 2020
    Assignee: HAKKO CORPORATION
    Inventors: Yoshitomo Teraoka, Satoshi Manda, Tomoo Takahara
  • Patent number: 10842061
    Abstract: A soldering apparatus comprises a soldering mechanism and a management unit. The management unit converts operation history of the soldering mechanism into a numerical value, compares the numerical value to a predetermined threshold value, and generates a notifying signal if the numerical value exceeds the predetermined threshold value. The notifying signal may result in cessation of operation of the soldering mechanism. The notifying signal may result in a visual and/or audio reminder to the operator to inspect or replace a part of the soldering mechanism. With the management unit, the operator need not guess or rely on personal experience to determine when to perform an inspection or replacement. Reliance on personal experience can be error prone and lead to inefficiency. The management unit may reduce the possibility of soldering with a degraded soldering tip or other part, which may have an adverse effect on soldering quality.
    Type: Grant
    Filed: October 1, 2018
    Date of Patent: November 17, 2020
    Assignee: HAKKO CORPORATION
    Inventors: Yoshitomo Teraoka, Satoshi Manda
  • Patent number: 10807239
    Abstract: A soldering apparatus is provided with a soldering iron for soldering with a tip, a driving portion for moving the soldering iron, a storage portion that stores position information indicating a soldering position and identification information associated each other, a reading portion that reads target identification information attached to the work target, an acquiring portion that acquires position information in the storage portion matching the target identification information read by the reading portion, and a process control portion for controlling the driving portion and the soldering iron so as to perform soldering at the position indicated by the position information acquired by the acquiring portion.
    Type: Grant
    Filed: September 26, 2018
    Date of Patent: October 20, 2020
    Assignee: HAKKO CORPORATION
    Inventors: Yoshitomo Teraoka, Satoshi Manda
  • Publication number: 20190160574
    Abstract: Gerber data for a substrate includes coordinates for physical features on the substrate. The coordinates are relative to a substrate origin point on the substrate. The gerber data allows a user to specify any of the physical features as soldering targets of a soldering apparatus that includes a motor for moving a soldering iron according to coordinates relative to a system origin point of the soldering apparatus. When the substrate is placed on the soldering apparatus, its substrate origin point differs from the system origin point of the soldering apparatus. The user may input coordinates for the substrate origin point, which are used by the soldering apparatus to derive coordinates, usable by soldering apparatus, from coordinates in the gerber data. In this way, it is possible to reduce the workload of the user when programming the soldering apparatus to perform a soldering process.
    Type: Application
    Filed: November 30, 2018
    Publication date: May 30, 2019
    Inventors: Yoshitomo TERAOKA, Satoshi MANDA, Tomoo TAKAHARA
  • Publication number: 20190099885
    Abstract: A soldering apparatus is provided with a soldering iron for soldering with a tip, a driving portion for moving the soldering iron, a storage portion that stores position information indicating a soldering position and identification information associated each other, a reading portion that reads target identification information attached to the work target, an acquiring portion that acquires position information in the storage portion matching the target identification information read by the reading portion, and a process control portion for controlling the driving portion and the soldering iron so as to perform soldering at the position indicated by the position information acquired by the acquiring portion.
    Type: Application
    Filed: September 26, 2018
    Publication date: April 4, 2019
    Inventors: Yoshitomo TERAOKA, Satoshi MANDA
  • Publication number: 20190099818
    Abstract: The present application discloses a soldering apparatus including a driving portion for moving a soldering iron to perform soldering on a surface of an electronic board including soldering regions. The soldering regions have a base region and at least one replication region existing at a position different from the base region. The replication region has an arrangement pattern that is the same as an arrangement pattern of a soldering position in the base region. The soldering apparatus includes an input portion for receiving input of positional relationship data, which represents a positional relationship between the base region and the at least one replication region, and for receiving base pattern data, which represents the arrangement pattern of the soldering position in the base region. The soldering apparatus includes a controller which causes the driving portion to move the soldering iron based on the base pattern data and the positional relationship data in a soldering operation.
    Type: Application
    Filed: September 27, 2018
    Publication date: April 4, 2019
    Inventors: Yoshitomo TERAOKA, Satoshi MANDA, Tomoo TAKAHARA
  • Publication number: 20190104659
    Abstract: A soldering apparatus comprises a soldering mechanism and a management unit. The management unit converts operation history of the soldering mechanism into a numerical value, compares the numerical value to a predetermined threshold value, and generates a notifying signal if the numerical value exceeds the predetermined threshold value. The notifying signal may result in cessation of operation of the soldering mechanism. The notifying signal may result in a visual and/or audio reminder to the operator to inspect or replace a part of the soldering mechanism. With the management unit, the operator need not guess or rely on personal experience to determine when to perform an inspection or replacement. Reliance on personal experience can be error prone and lead to inefficiency. The management unit may reduce the possibility of soldering with a degraded soldering tip or other part, which may have an adverse effect on soldering quality.
    Type: Application
    Filed: October 1, 2018
    Publication date: April 4, 2019
    Inventors: Yoshitomo TERAOKA, Satoshi MANDA
  • Publication number: 20180236582
    Abstract: A melting tool control apparatus comprises a drive mechanism, a melt processing assembly configured to perform a melt process, a receiving module that receives input of three-dimensional coordinate information of a first point where the melt process is to be performed and input of a position information indicating a position different from the first point, and a process control module configured to control the melt processing assembly to perform the melt process when the distal end is at the first point.
    Type: Application
    Filed: January 16, 2018
    Publication date: August 23, 2018
    Inventors: Yoshitomo TERAOKA, Satoshi MANDA, Tomoo TAKAHARA
  • Patent number: D774405
    Type: Grant
    Filed: March 17, 2015
    Date of Patent: December 20, 2016
    Assignee: Hakko Corporation
    Inventor: Satoshi Manda