Patents by Inventor Satoshi Matsuno
Satoshi Matsuno has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 12133388Abstract: A memory device includes a lower source-level semiconductor layer, a source contact layer, an upper source-level semiconductor layer, and an alternating stack of insulating layers and electrically conductive layers, and a memory opening fill structure vertically extending through the alternating stack and down to an upper portion of the lower source-level semiconductor layer. The memory opening fill structure includes a vertical semiconductor channel, a memory film laterally surrounding the vertical semiconductor channel, and an annular semiconductor cap contacting a bottom surface of the memory film and contacting a top surface segment of the source contact layer. The annular semiconductor cap may be employed as an etch stop structure during a manufacturing process.Type: GrantFiled: January 25, 2022Date of Patent: October 29, 2024Assignee: SANDISK TECHNOLOGIES LLCInventors: Kota Funayama, Satoshi Shimizu, Koichi Matsuno
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Patent number: 12042745Abstract: A novel optically readable identification code and a toy with identification code with which a toy main body can be prevented from having the appearance compromised as much as possible are provided. A toy with identification code 10 includes a toy main body 11 with a surface provided with an identification code portion 12 including an optically readable identification code 13. The identification code 13 includes a plurality of dark color portions and a plurality of light color portions, and a chromatic color having an intensity lower than an intensity of a chromatic color used for the dark color portions is used for the light color portions.Type: GrantFiled: June 4, 2020Date of Patent: July 23, 2024Assignee: BANDAI CO., LTD.Inventors: Shotaro Matsuno, Satoshi Kitagawa, Kazuki Ogiya, Hirotaka Hatayama, Yuta Abe
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Patent number: 10535468Abstract: A method for manufacturing a multilayer ceramic capacitor includes preparing a green multilayer body including a stack of dielectric sheets printed with inner electrodes, coating the green multilayer body with a conductive paste that is connected to the inner electrodes, and firing the conductive paste and the green multilayer body at the same time, wherein a rate of temperature increase from about 800° C. to about 1,100° C. during the firing is about 15° C. per minute or more.Type: GrantFiled: October 16, 2017Date of Patent: January 14, 2020Assignee: MURATA MANUFACTURING CO., LTD.Inventors: Takehisa Sasabayashi, Yasuhiro Nishisaka, Satoshi Matsuno, Yoko Okabe
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Patent number: 10483041Abstract: A first outer electrode and first inner electrodes are supplied with an anode potential and a second outer electrode and second inner electrodes are supplied with a cathode potential when a monolithic ceramic capacitor is mounted and in use. The first outer electrode supplied with the anode potential has a thickness that is greater than a thickness of the second outer electrode supplied with the cathode potential.Type: GrantFiled: March 25, 2015Date of Patent: November 19, 2019Assignee: MURATA MANUFACTURING CO., LTD.Inventors: Yoshito Saito, Satoshi Matsuno, Shinji Otani, Tomochika Miyazaki, Yasuhiro Nishisaka
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Patent number: 10186378Abstract: A multilayer ceramic capacitor includes a laminate of ceramic layers and internal electrodes, and a pair of external electrodes located on both end surfaces of the laminate and electrically connected to the internal electrodes. Each of the pair of external electrodes includes an underlying electrode layer on the surface of the laminate and including Cu, a bonding portion partially provided on a surface of the underlying electrode layer and including a Cu3Sn alloy, and a conductive resin layer provided on surfaces of the underlying electrode layer and the bonding portion, and a total area of the bonding portion is not less than about 2.7% and not more than about 40.6% of a total area of the underlying electrode layer.Type: GrantFiled: December 8, 2017Date of Patent: January 22, 2019Assignee: Murata Manufacturing Co., Ltd.Inventors: Kenichi Hamanaka, Satoshi Matsuno
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Publication number: 20180166215Abstract: A multilayer ceramic capacitor includes a laminate of ceramic layers and internal electrodes, and a pair of external electrodes located on both end surfaces of the laminate and electrically connected to the internal electrodes. Each of the pair of external electrodes includes an underlying electrode layer on the surface of the laminate and including Cu, a bonding portion partially provided on a surface of the underlying electrode layer and including a Cu3Sn alloy, and a conductive resin layer provided on surfaces of the underlying electrode layer and the bonding portion, and a total area of the bonding portion is not less than about 2.7% and not more than about 40.6% of a total area of the underlying electrode layer.Type: ApplicationFiled: December 8, 2017Publication date: June 14, 2018Inventors: Kenichi HAMANAKA, Satoshi MATSUNO
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Publication number: 20180108483Abstract: A method for manufacturing a multilayer ceramic capacitor includes preparing a green multilayer body including a stack of dielectric sheets printed with inner electrodes, coating the green multilayer body with a conductive paste that is connected to the inner electrodes, and firing the conductive paste and the green multilayer body at the same time, wherein a rate of temperature increase from about 800° C. to about 1,100° C. during the firing is about 15° C. per minute or more.Type: ApplicationFiled: October 16, 2017Publication date: April 19, 2018Inventors: Takehisa SASABAYASHI, Yasuhiro NISHISAKA, Satoshi MATSUNO, Yoko OKABE
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Patent number: 9667174Abstract: A ceramic electronic component includes a ceramic body, inner electrodes, a glass coating layer, and outer electrodes. The glass coating layer extends from an exposed portion of one of the inner electrodes at a first end surface to a first principal surface. The outer electrodes are each constituted by a plating film disposed directly above the glass coating layer. The glass coating layer includes a glass medium and metal powder particles that define conductive paths. The metal powder particles have an elongated or substantially elongated shape and are dispersed in the glass medium. The dimension of a portion of the glass coating layer located on the first principal surface in the length direction, is larger than that of a portion of the glass coating layer located on the first end surface in the thickness direction.Type: GrantFiled: February 27, 2014Date of Patent: May 30, 2017Assignee: MURATA MANUFACTURING CO., LTD.Inventors: Yasuhiro Nishisaka, Satoshi Matsuno, Tetsuya Kisumi, Yoko Okabe
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Patent number: 9328014Abstract: A ceramic electronic component includes a ceramic body, a glass coating layer, and terminal electrodes. End portions of inner electrodes are exposed at a surface of the ceramic body. The glass coating layer covers portions of the ceramic body in which the inner electrodes are exposed. The terminal electrodes are disposed directly above the glass coating layer and are each constituted by a plating film. The glass coating layer includes a glass medium and metal powder particles that are dispersed in the glass medium and define conductive paths which electrically connect the inner electrodes and the terminal electrodes. The metal powder particles include first metal powder particles and second metal powder particles. The first metal powder particles are flat or substantially flat powder particles. The second metal powder particles are spherical or substantially spherical powder particles.Type: GrantFiled: February 27, 2014Date of Patent: May 3, 2016Assignee: Murata Manufacturing Co., Ltd.Inventors: Yasuhiro Nishisaka, Satoshi Matsuno, Tetsuya Kisumi, Yoko Okabe
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Publication number: 20150279568Abstract: A first outer electrode and first inner electrodes are supplied with an anode potential and a second outer electrode and second inner electrodes are supplied with a cathode potential when a monolithic ceramic capacitor is mounted and in use. The first outer electrode supplied with the anode potential has a thickness that is greater than a thickness of the second outer electrode supplied with the cathode potential.Type: ApplicationFiled: March 25, 2015Publication date: October 1, 2015Inventors: Yoshito Saito, Satoshi Matsuno, Shinji Otani, Tomochika Miyazaki, Yasuhiro Nishisaka
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Patent number: 9148954Abstract: A ceramic electronic component includes a ceramic body and an outer electrode. The ceramic body includes first and second principal surfaces, first and second lateral surfaces, and first and second end surfaces. The outer electrode is provided on the first principal surface. The outer electrode includes an underlying electrode layer containing Cu and glass, and a Cu plating layer. The underlying electrode layer is disposed on the first principal surface. The Cu plating layer is disposed on the underlying electrode layer. The Cu plating layer is thicker than the underlying electrode layer.Type: GrantFiled: March 24, 2014Date of Patent: September 29, 2015Assignee: Murata Manufacturing Co., Ltd.Inventors: Yasuhiro Nishisaka, Satoshi Matsuno, Akihiro Yoshida, Yasunori Taseda
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Publication number: 20140291000Abstract: A ceramic electronic component includes a ceramic body and an outer electrode. The ceramic body includes first and second principal surfaces, first and second lateral surfaces, and first and second end surfaces. The outer electrode is provided on the first principal surface. The outer electrode includes an underlying electrode layer containing Cu and glass, and a Cu plating layer. The underlying electrode layer is disposed on the first principal surface. The Cu plating layer is disposed on the underlying electrode layer. The Cu plating layer is thicker than the underlying electrode layer.Type: ApplicationFiled: March 24, 2014Publication date: October 2, 2014Applicant: MURATA MANUFACTURING CO., LTD.Inventors: Yasuhiro NISHISAKA, Satoshi MATSUNO, Akihiro YOSHIDA, Yasunori TASEDA
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Publication number: 20140292142Abstract: A ceramic electronic component includes a ceramic body, a glass coating layer, and terminal electrodes. End portions of inner electrodes are exposed at a surface of the ceramic body. The glass coating layer covers portions of the ceramic body in which the inner electrodes are exposed. The terminal electrodes are disposed directly above the glass coating layer and are each constituted by a plating film. The glass coating layer includes a glass medium and metal powder particles that are dispersed in the glass medium and define conductive paths which electrically connect the inner electrodes and the terminal electrodes. The metal powder particles include first metal powder particles and second metal powder particles. The first metal powder particles are flat or substantially flat powder particles. The second metal powder particles are spherical or substantially spherical powder particles.Type: ApplicationFiled: February 27, 2014Publication date: October 2, 2014Applicant: Murata Manufacturing Co., Ltd.Inventors: Yasuhiro NISHISAKA, Satoshi MATSUNO, Tetsuya KISUMI, Yoko OKABE
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Publication number: 20140292141Abstract: A ceramic electronic component includes a ceramic body, inner electrodes, a glass coating layer, and outer electrodes. The glass coating layer extends from an exposed portion of one of the inner electrodes at a first end surface to a first principal surface. The outer electrodes are each constituted by a plating film disposed directly above the glass coating layer. The glass coating layer includes a glass medium and metal powder particles that define conductive paths. The metal powder particles have an elongated or substantially elongated shape and are dispersed in the glass medium. The dimension of a portion of the glass coating layer located on the first principal surface in the length direction, is larger than that of a portion of the glass coating layer located on the first end surface in the thickness direction.Type: ApplicationFiled: February 27, 2014Publication date: October 2, 2014Applicant: MURATA MANUFACTURING CO., LTD.Inventors: Yasuhiro NISHISAKA, Satoshi MATSUNO, Tetsuya KISUMI, Yoko OKABE
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Publication number: 20090235878Abstract: In one embodiment of the present invention, a cooling water path that extends in the direction of a row of cylinders is provided between left and right banks. A communication port that communicates with a discharge port of the water pump is provided at a position on the front side between the left and right banks in the direction of the row of cylinders, and first to third and fourth to sixth introduction ports that introduce cooling water to a water jacket of the left and right banks of the cylinder block from the rear side in the direction of the row of cylinders, are formed in the cooling water path.Type: ApplicationFiled: August 1, 2007Publication date: September 24, 2009Applicant: Toyota Jidosha Kabushiki KaishaInventors: Tooru Kitamura, Kouichi Hiratsuka, Takanori Kawazu, Satoshi Matsuno
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Patent number: 5397221Abstract: A valve operating mechanism which opens and closes a passage communicating to a cavity by contraction and restoration of a packing, with little mechanical movable parts for the opening/closing operation.Type: GrantFiled: July 26, 1994Date of Patent: March 14, 1995Assignee: Yamamoto Suiatu Kogyosho Co., Ltd.Inventors: Katsumi Onizuka, Satoshi Matsuno, Kazuo Sasaki