Patents by Inventor Satoshi Matsuo

Satoshi Matsuo has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240117746
    Abstract: A stator blade including a blade body, a first insert, a second insert, and an end cover. The blade body has a first blade air passage and a second blade air passage extending in the blade height direction within the blade body. Each passage has an open end on a blade-height second side. The first insert and the second insert have tubular outer peripheral plate portions. A plurality of impinge holes are formed in the outer peripheral plate portion. The tube height opening side of the outer peripheral plate portion in the tube height direction is open. The outer peripheral plate portion of the first insert is disposed in the first blade air passage such that cooling air flows into the outer peripheral plate portion from the opening of the first insert. The outer peripheral plate portion of the second insert is disposed in the second wing air passage.
    Type: Application
    Filed: March 17, 2022
    Publication date: April 11, 2024
    Inventors: Saki MATSUO, Satoshi HADA, Yasuo MIYAHISA, Satoshi MIZUKAMI
  • Patent number: 11935905
    Abstract: An imaging device comprises pixels. The pixel includes first semiconductor regions of a first conductivity type provided in a surface part of a semiconductor substrate and a second semiconductor region of a second conductivity type provided in the surface part of the semiconductor substrate between the first semiconductor regions. The pixel includes: a light-receiving unit in which photodiodes each configured between the second semiconductor region and one of the first semiconductor regions; quenching circuits, each connected to a corresponding one of the first semiconductor regions; and a counter unit connected to each of connection nodes between the first semiconductor regions and the quenching circuits and counts a pulse generated in response to a photon being incident on the light-receiving unit. The second semiconductor region is provided across a deeper part of the semiconductor substrate than the first semiconductor regions.
    Type: Grant
    Filed: October 5, 2020
    Date of Patent: March 19, 2024
    Assignee: CANON KABUSHIKI KAISHA
    Inventors: Hirokazu Kobayashi, Hisataka Hirose, Satoshi Kumaki, Yasuhiro Matsuo
  • Patent number: 11091773
    Abstract: In order to identify a novel gene responsible for parthenocarpy and to provide use of the gene, the parthenocarpy regulatory gene of the present invention includes a polynucleotide (1) that encodes an amino acid sequence represented by SEQ ID NO: 1, (2) that encodes an amino acid sequence (i) having a sequence identity of 75% or higher relative to the amino acid sequence represented by SEQ ID NO: 1, (3) that encodes an amino acid sequence in which 1 to 98 amino acids are substituted, etc. in the amino acid sequence represented by SEQ ID NO: 1, or (4) that is hybridized with a polynucleotide, which has a sequence complementary to the polynucleotide for encoding the amino acid sequence represented by SEQ ID NO: 1 under a stringent condition.
    Type: Grant
    Filed: January 19, 2015
    Date of Patent: August 17, 2021
    Assignees: NATIONAL RESEARCH AND DEVELOPMENT AGENCY NATIONAL AGRICULTURE AND FOOD RESEARCH ORGANIZATION, TAKII & CO., LTD.
    Inventors: Hiroyuki Fukuoka, Satoshi Matsuo, Koji Miyatake, Satoshi Shimakoshi, Souichi Urashimo, Makoto Endo
  • Publication number: 20170002376
    Abstract: In order to identify a novel gene responsible for parthenocarpy and to provide use of the gene, the parthenocarpy regulatory gene of the present invention includes a polynucleotide (1) that encodes an amino acid sequence represented by SEQ ID NO: 1, (2) that encodes an amino acid sequence (i) having a sequence identity of 75% or higher relative to the amino acid sequence represented by SEQ ID NO: 1, (3) that encodes an amino acid sequence in which 1 to 98 amino acids are substituted, etc. in the amino acid sequence represented by SEQ ID NO: 1, or (4) that is hybridized with a polynucleotide, which has a sequence complementary to the polynucleotide for encoding the amino acid sequence represented by SEQ ID NO: 1 under a stringent condition.
    Type: Application
    Filed: January 19, 2015
    Publication date: January 5, 2017
    Inventors: Hiroyuki FUKUOKA, Satoshi MATSUO, Koji MIYATAKE, Satoshi SHIMAKOSHI, Souichi URASHIMO, Makoto ENDO
  • Patent number: 8785660
    Abstract: Provided are a thiol-reactive polyoxyalkylene-modified lipid which can be used to chemically modify bioactive substances and which can be used for drug delivery systems such as liposomes and a method for producing the same. The polyoxyalkylene-modified lipid is represented by the following formula (1): (wherein, R1 and R2 are hydrocarbon groups which are the same as or different from each other and which contain 4 to 24 carbon atoms, R3 is a divalent hydrocarbon group containing 1 to 6 carbon atoms, OA is oxyalkylene groups containing 2 to 4 carbon atoms, n is the average addition mole number of the oxyalkylene groups and is 5 to 1,000, and Z is a group containing either maleimide or iodoacetamide.
    Type: Grant
    Filed: March 27, 2012
    Date of Patent: July 22, 2014
    Assignee: NOF Corporation
    Inventors: Satoshi Matsuo, Yuji Yamamoto, Chika Itoh
  • Patent number: 8501998
    Abstract: A method for producing a polyoxyalkylene derivative represented by the following general formula (1): Z(OA)n-OH]m??(1) wherein Z is a residue of glycerin or diglycerin, OA is an oxyalkylene group having 2 to 4 carbon atoms, n is an average number of moles of the oxyalkylene group added and is 80 to 800, and m is 3 to 4, the method comprising steps (A), (B), (C), (D), (E), and (F) defined in the present description.
    Type: Grant
    Filed: March 31, 2010
    Date of Patent: August 6, 2013
    Assignee: NOF Corporation
    Inventors: Satoshi Matsuo, Kazuhiro Hashimoto, Ken-ichiro Nakamoto, Chika Itoh
  • Patent number: 8163869
    Abstract: An object of the present invention is to provide a purification method of separating impurities from a carboxyl group-containing polyoxyethylene derivative having a molecular weight of 2,000 to 100,000. The purification method according to the invention includes the following steps. The polyoxyethylene derivative is dissolved to form a solution using toluene, xylene, benzene, ethyl acetate, or butyl acetate in an amount 5 times by mass or more the amount of the polyoxyethylene derivative. A slurry is formed by adding to the solution an inorganic adsorbent containing at least one of an oxide and a hydroxide of one or more elements selected from the group consisting of magnesium, silicon, and aluminum in an amount 0.5 to 10 times by mass the amount of the polyoxyethylene derivative. The slurry is stirred at a temperature of 25° C. or higher. Toluene, xylene, benzene, ethyl acetate, or butyl acetate is added to a filtration cake obtained by filtration of the slurry, and further filtration is performed.
    Type: Grant
    Filed: December 27, 2010
    Date of Patent: April 24, 2012
    Assignee: NOF Corporation
    Inventors: Shuichi Yoshimura, Ken-ichiro Nakamoto, Satoshi Matsuo, Takashi Ichikawa
  • Publication number: 20100256423
    Abstract: A method for producing a polyoxyalkylene derivative represented by the following general formula (1): Z?(OA)n—OH]m??(1) wherein Z is a residue of glycerin or diglycerin, OA is an oxyalkylene group having 2 to 4 carbon atoms, n is an average number of moles of the oxyalkylene group added and is 80 to 800, and m is 3 to 4, the method comprising steps (A), (B), (C), (D), (E), and (F) defined in the present description.
    Type: Application
    Filed: March 31, 2010
    Publication date: October 7, 2010
    Applicant: NOF CORPORATION
    Inventors: Satoshi MATSUO, Kazuhiro HASHIMOTO, Ken-ichiro NAKAMOTO, Chika ITOH
  • Patent number: 7345362
    Abstract: An electronic component, in which a chip can be mounted on a certain predetermined place of the package at a high accuracy level, which package having a stepped level-difference in the inner wall of a cavity. The package is provided with a stepped level-difference in the inner wall surface, and an internal contact electrode formed on the upper surface of the stepped level-difference. At the bottom of the package is a shield electrode, on which a chip is mounted via an adhesion layer. The chip and the internal contact electrode are electrically connected by an interconnection wire. Location aligning for the chip and the interconnection wire, at least either one of these, is conducted by making use of a region, which is non-electrode portion, provided on the inner bottom surface of the package.
    Type: Grant
    Filed: September 2, 2004
    Date of Patent: March 18, 2008
    Assignee: Matsushita Electric Industrial Co., Ltd.
    Inventors: Kozo Murakami, Kunihiro Fujii, Satoshi Matsuo
  • Patent number: 7334974
    Abstract: A composition for use as a self-locking agent is provided which comprises an aqueous dispersion of the following ingredients dissolved and dispersed in water: (a) a polyamide powder insoluble or slightly soluble in water, (b) an isocyanate compound, (c) a surfactant and (d) a water-soluble polyamide. The composition permits a polyamide resin layer of a smooth surface to be formed on a screw surface of a to-be-coated member. With use of the composition, it is possible to prevent slippage and sagging of the resin layer coated on the screw surface and improve the precision in resin coating processing.
    Type: Grant
    Filed: October 25, 2002
    Date of Patent: February 26, 2008
    Assignee: Three Bond Co. Ltd.
    Inventors: Satoshi Matsuo, Hidenori Kanazawa
  • Patent number: 7236262
    Abstract: A printer driver recognizes, of a plurality of printers on a network, a printer included in a common category. Only basic settings for printing (the paper size, the print direction, etc.) are made on the printers included in the same category by the printer driver. So that, the printers on the network can be easily used without a waste of space of a storage device included in the system.
    Type: Grant
    Filed: September 13, 2001
    Date of Patent: June 26, 2007
    Assignee: Minolta Co., Ltd.
    Inventor: Satoshi Matsuo
  • Patent number: 6998687
    Abstract: A surface acoustic wave (SAW) device having improved moisture resistance is provided. The device includes a piezoelectric substrate, an interdigital transducer (IDT) electrode on a first surface of the piezoelectric substrate, and a resin coating for covering the IDT electrode. After a piece of resin material of the resin coating is dipped in an amount of pure water as solvent having a mass as 10 times great as the piece of resin material at 120° C. under 2 atom pressure for twenty hours, a concentration of chlorine ion in the solvent is not higher than 50 ppm.
    Type: Grant
    Filed: January 24, 2002
    Date of Patent: February 14, 2006
    Assignee: Matsushita Electric Industrial Co., Ltd.
    Inventors: Takashi Inoue, Satoshi Matsuo, Akihiko Namba
  • Publication number: 20050049340
    Abstract: A composition for use as a self-locking agent is provided which comprises an aqueous dispersion of the following ingredients dissolved and dispersed in water: (a) a polyamide powder insoluble or slightly soluble in water, (b) an isocyanate compound, (c) a surfactant and (d) a water-soluble polyamide. The composition permits a polyamide resin layer of a smooth surface to be formed on a screw surface of a to-be-coated member. With use of the composition, it is possible to prevent slippage and sagging of the resin layer coated on the screw surface and improve the precision in resin coating processing.
    Type: Application
    Filed: October 25, 2002
    Publication date: March 3, 2005
    Inventors: Satoshi Matsuo, Hidenori Kanazawa
  • Publication number: 20050036278
    Abstract: An electronic component, in which a chip can be mounted on a certain predetermined place of the package at a high accuracy level, which package having a stepped level-difference in the inner wall of a cavity. The package is provided with a stepped level-difference in the inner wall surface, and an internal contact electrode formed on the upper surface of the stepped level-difference. At the bottom of the package is a shield electrode, on which a chip is mounted via an adhesion layer. The chip and the internal contact electrode are electrically connected by an interconnection wire. Location aligning for the chip and the interconnection wire, at least either one of these, is conducted by making use of a region, which is non-electrode portion, provided on the inner bottom surface of the package.
    Type: Application
    Filed: September 2, 2004
    Publication date: February 17, 2005
    Inventors: Kozo Murakami, Kunihiro Fujii, Satoshi Matsuo
  • Patent number: 6848153
    Abstract: A method of manufacture of a surface acoustic wave device which includes a step of applying a photosensitive film resist on a substrate and forming a photosensitive film resist layer over at least a portion of a surface of the substrate; a step of forming acoustic absorbers only at the two sides orthogonal to the direction of the surface acoustic wave transmission; a step of placing in a package a surface acoustic wave element obtained by cutting and dividing the substrate and electrically connecting a connection electrode of the surface acoustic wave element with an external terminal of the package; and a step of sealing an opening of the package with a lid, wherein the main surface of the acoustic absorbers is formed parallel to the surface of the substrate.
    Type: Grant
    Filed: December 10, 2002
    Date of Patent: February 1, 2005
    Assignee: Matsushita Electric Industrial Co., Ltd.
    Inventors: Shigeru Tsuzuki, Kunihiro Fujii, Masahiro Takada, Satoshi Matsuo, Takafumi Koga, Kozo Murakami
  • Patent number: 6831752
    Abstract: The purpose of the invention is to provide a disk driver which makes it easy for users to set the settings. In a device driver which operates in the computer and has a function where each item of the device is set, when the arrangement information stored in the memory corresponding to a user is read in, the screen shows a display in accordance with it. In the arrangement settings, the user can freely arrange each of the setting items on the screen. Then the arrangement information is maintained in the computer together with the user information.
    Type: Grant
    Filed: July 5, 2000
    Date of Patent: December 14, 2004
    Assignee: Minolta Co., Ltd.
    Inventor: Satoshi Matsuo
  • Patent number: 6804103
    Abstract: An electronic component, in which a chip can be mounted on a certain predetermined place of the package at a high accuracy level, which package having a stepped level-difference in the inner wall of a cavity. The package 13 is provided with a stepped level-difference 26 in the inner wall surface, and an internal contact electrode 14 formed on the upper surface of the stepped level-difference 26. At the bottom of the package 13 is a shield electrode 15, on which a chip 17 is mounted via an adhesion layer 16. The chip 17 and the internal contact electrode 14 are electrically connected by an interconnection wire 19. Location aligning for the chip 17 and the interconnection wire 19, at least either one of these, is conducted by making use of a region 18a, 18b, which is non-electrode portion, provided on the inner bottom surface of the package 13.
    Type: Grant
    Filed: August 27, 2001
    Date of Patent: October 12, 2004
    Assignee: Matsushita Electric Industrial Co., Ltd.
    Inventors: Kozo Murakami, Kunihiro Fujii, Satoshi Matsuo
  • Patent number: 6680528
    Abstract: An electronic component having recesses on side faces of its package for housing an electric element therein. A metal layer that does not reach the bottom end of the package is formed on the surface of the recess. The metal layer has excellent wettability to a brazing material and helps extra material flow into the recess easily. In addition, the interface between the top end face of the recess and the side face is curved to make the brazing material flow into the recess easily. When the opening of the package is sealed with a lid using the brazing material, the extra brazing material flows into the recess. This prevents the brazing material from protruding outside of the package and thus improves dimensional accuracy of the electronic component. Therefore, mounting accuracy of the electronic component can be improved and short circuit can be prevented.
    Type: Grant
    Filed: July 3, 2001
    Date of Patent: January 20, 2004
    Assignee: Matsushita Electric Industrial Co., Ltd.
    Inventors: Satoshi Matsuo, Kunihiro Fujii, Takafumi Koga, Kozo Murakami
  • Publication number: 20030164529
    Abstract: A surface acoustic wave (SAW) device having improved moisture resistance is provided. The device includes a piezoelectric substrate, an interdigital transducer (IDT) electrode on a first surface of the piezoelectric substrate, and a resin coating for covering the IDT electrode. After a piece of resin material of the resin coating is dipped in an amount of pure water as solvent having a mass as 10 times great as the piece of resin material at 120° C.
    Type: Application
    Filed: March 7, 2003
    Publication date: September 4, 2003
    Inventors: Takashi Inoue, Satoshi Matsuo, Akihiko Namba
  • Patent number: D718127
    Type: Grant
    Filed: May 2, 2013
    Date of Patent: November 25, 2014
    Assignees: Morinaga & Co., Ltd., Hosokawa Yoko Co., Ltd.
    Inventors: Yuichiro Moriyama, Yuichi Yokota, Takeshi Okajima, Koichi Kuribayashi, Koji Nagano, Satoshi Matsuo, Takahiro Yamaguchi, Toshikazu Kenmotsu