Abstract: A polymer containing a structural unit including an aromatic hydroxy group bonded to a main chain, where the aromatic hydroxy group is protected by an acid-labile group represented by the following formula (ALU-1) and is deprotected by action of an acid to become alkali-soluble. This provides: a polymer that makes it possible to form a resist film with which it is possible to form a pattern having extremely high isolated space resolution, small LER, and excellent rectangularity, effects of development loading and residue defects being suppressed, and the pattern having etching resistance and suppressed pattern collapse in the produced resist pattern; a chemically amplified positive resist composition containing the polymer; a resist patterning process using the chemically amplified positive resist composition; and a mask blank including the chemically amplified positive resist composition.

Abstract: A chemically amplified positive resist composition is provided comprising a polymer comprising units containing a phenolic hydroxy group and units containing a phenolic hydroxy group protected with an acid labile group, in which a carbon atom neighboring the carbon atom to which the phenolic hydroxy group protected with an acid labile group is attached is substituted with a specific group. A resist pattern with a high resolution, reduced LER, rectangularity, minimized influence of develop loading, and few development residue defects can be formed.

Abstract: A chemically amplified positive resist composition comprising (A) a base polymer, (B) a photoacid generator, and (C) a quencher is provided. The base polymer (A) contains a polymer comprising phenolic hydroxy group-containing units, aromatic ring-containing units, and units containing a phenolic hydroxy group protected with an acid labile group. The photoacid generator (B) and the quencher (C) are present in a weight ratio (B)/(C) of less than 3/1. The resist composition exhibits a very high isolated-space resolution and forms a pattern with reduced LER, rectangularity, minimized influences of develop loading and residue defects.

Abstract: An inventory management system that can achieve both re-using of batteries and securing of the convenience of electric products for which the batteries are to be reused. The inventory management system for a plurality of batteries to be used in an electric taxi and an electric lawnmower includes: a deterioration degree range storage unit that stores, as a first deterioration degree range, the range of a necessary deterioration degree of a battery, which is set in association with the electric taxi; and a distribution unit that associates, with the electric lawnmower, a battery having a deterioration degree higher than the first deterioration degree range among batteries associated with the electric taxi.

Abstract: An electronic component-incorporating substrate includes a lower substrate, an upper substrate, an electronic component located between the upper and lower substrates, a metal post connecting a first connection pad of the electronic component to a mounting pad of the lower substrate, a bonding wire connecting a second connection pad of the electronic component to a connection pad of the upper substrate, and an underfill resin filling the space between the electronic component and the lower substrate. The underfill resin covers the metal post and a first end of the bonding wire connected to the second connection pad of the electronic component. The bonding wire further includes a loop located at a lower position than a lower end of the metal post. The lower substrate further includes an accommodation portion that accommodates the loop.

Abstract: An electronic component-incorporating substrate includes a lower substrate, an electronic component mounted on the lower substrate, and an upper substrate arranged above the electronic component and the lower substrate. The substrate further includes a substrate connecting member arranged between the lower substrate and the upper substrate and an encapsulation resin filling a gap between the lower substrate and the upper substrate to encapsulate the electronic component and the substrate connecting member. The upper substrate includes a substrate body and a solder resist layer arranged on a lower surface of the substrate body. The solder resist layer includes a groove extending in the solder resist layer from a directly-above region, located directly above at least the electronic component, to a side surface of the upper substrate.

Abstract: An imaging device includes: a container including a bottom plate and a side wall provided on an outer circumferential portion of the bottom plate; a step portion which is formed in a top outer circumferential portion of the side wall and includes: a horizontal surface that is located at a lower position than a top surface of the side wall; and a side surface that connects the top surface of the side wall to the horizontal surface; an imaging element mounted on the bottom plate; a glass lid which is bonded to the top surface of the side wall with a first adhesive layer; and a cover frame which is disposed on the step portion and bonded to the side surface of the step portion and an outer circumferential surface of the glass lid with a second adhesive layer.

Abstract: An electronic component-incorporating substrate includes a lower substrate, an upper substrate, an electronic component located between the upper and lower substrates, a metal post connecting a first connection pad of the electronic component to a mounting pad of the lower substrate, a bonding wire connecting a second connection pad of the electronic component to a connection pad of the upper substrate, and an underfill resin filling the space between the electronic component and the lower substrate. The underfill resin covers the metal post and a first end of the bonding wire connected to the second connection pad of the electronic component. The bonding wire further includes a loop located at a lower position than a lower end of the metal post. The lower substrate further includes an accommodation portion that accommodates the loop.

Abstract: An electronic component-incorporating substrate includes a lower substrate, an electronic component mounted on the lower substrate, and an upper substrate arranged above the electronic component and the lower substrate. The substrate further includes a substrate connecting member arranged between the lower substrate and the upper substrate and an encapsulation resin filling a gap between the lower substrate and the upper substrate to encapsulate the electronic component and the substrate connecting member. The upper substrate includes a substrate body and a solder resist layer arranged on a lower surface of the substrate body. The solder resist layer includes a groove extending in the solder resist layer from a directly-above region, located directly above at least the electronic component, to a side surface of the upper substrate.

Abstract: An imaging device includes: a container including a bottom plate and a side wall provided on an outer circumferential portion of the bottom plate; a step portion which is formed in a top outer circumferential portion of the side wall and includes: a horizontal surface that is located at a lower position than a top surface of the side wall; and a side surface that connects the top surface of the side wall to the horizontal surface; an imaging element mounted on the bottom plate; a glass lid which is bonded to the top surface of the side wall with a first adhesive layer; and a cover frame which is disposed on the step portion and bonded to the side surface of the step portion and an outer circumferential surface of the glass lid with a second adhesive layer.

Abstract: A semiconductor package includes a wiring board, an electronic component mounted on the wiring board, and an enclosing frame arranged on an upper surface of the electronic component. The enclosing frame includes a basal portion, which has the form of a closed frame and extends along the upper surface of the electronic component, and an adhesion portion, which is wider than the basal portion and is arranged on the upper surface of the basal portion. A cap is adhered to an upper surface of the adhesion portion. A molding resin contacts a lower surface of the adhesion portion and seals the electronic component and the wiring board that are exposed from the enclosing frame.

Abstract: A semiconductor package includes a wiring board, an electronic component mounted on the wiring board, and an enclosing frame arranged on an upper surface of the electronic component. The enclosing frame includes a basal portion, which has the form of a closed frame and extends along the upper surface of the electronic component, and an adhesion portion, which is wider than the basal portion and is arranged on the upper surface of the basal portion. A cap is adhered to an upper surface of the adhesion portion. A molding resin contacts a lower surface of the adhesion portion and seals the electronic component and the wiring board that are exposed from the enclosing frame.

Abstract: An excimer lamp, including a discharge vessel made of silica glass and having a discharge space; a pair of electrodes disposed on the discharge vessel, wherein the discharge space is filled with xenon gas; and an ultraviolet reflection film made from ultraviolet scattering particles, including silica particles and alumina particles, formed on a surface of the discharge vessel exposed to the discharge space. A thickness Y of the ultraviolet reflection film satisfies the expression Y>4X+5, given that a mean particle diameter of the ultraviolet scattering particles making up the ultraviolet reflection film is X (?m).

Abstract: An electronic component apparatus includes a wiring board 10, an electronic component 20 disposed thereon, a frame-like member 30 provided on the wiring board 10 to surround the electronic component 20 and to have a ring-like bonding portion 34, and a cap member 50 which is bonded to the ring-like bonding portion 34 of the frame-like member 30 to constitute a housing portion H for housing the electronic component 20 together with the wiring board 10 and the frame-like member 30. In an upper part of one region of the ring-like bonding portion 34, a groove 36 for air contained in the housing portion H is provided to extend from an inner peripheral surface of the ring-like bonding portion 34 to an outer side of the cap member 50.

Abstract: An excimer lamp which can emit UV radiation with a high degree of efficiency and high degree of uniformity, has a UV-reflecting film that does not peel. The excimer lamp is fitted with a silica glass discharge vessel that encloses a discharge gas which forms excimer molecules by dielectric barrier discharge in an internal space enclosed by a top wall panel, a bottom wall panel, side wall panels and end panels and with an electrode on both the outer surface of the top wall panel and another electrode on the outer surface of the bottom wall panel. On the inner surface of the discharge vessel, a UV-reflecting film comprised of silica and alumina particles is formed, at least, on the inner surface area of the side wall panels with the silica particles composing at least 30 weight % of the UV-reflecting film.

Abstract: An excimer lamp which can emit UV radiation with a high degree of efficiency and high degree of uniformity, has a UV-reflecting film that does not peel. The excimer lamp is fitted with a silica glass discharge vessel that encloses a discharge gas which forms excimer molecules by dielectric barrier discharge in an internal space enclosed by a top wall panel, a bottom wall panel, side wall panels and end panels and with an electrode on both the outer surface of the top wall panel and another electrode on the outer surface of the bottom wall panel. On the inner surface of the discharge vessel, a UV-reflecting film comprised of silica and alumina particles is formed, at least, on the inner surface area of the side wall panels with the silica particles composing at least 30 weight % of the UV-reflecting film.

Abstract: An excimer lamp, including a discharge vessel made of silica glass and having a discharge space; a pair of electrodes disposed on the discharge vessel, wherein the discharge space is filled with xenon gas; and an ultraviolet reflection film made from ultraviolet scattering particles, including silica particles and alumina particles, formed on a surface of the discharge vessel exposed to the discharge space. A thickness Y of the ultraviolet reflection film satisfies the expression Y>4X+5, given that a mean particle diameter of the ultraviolet scattering particles making up the ultraviolet reflection film is X (?m).

Abstract: A power transmission system in a tractor having a travelling drive sub-system for driving wheels and a PTO drive sub-system for driving working machines. A transmission case is provided with a single input shaft connected to an engine, and the travelling drive sub-system and the PTO drive sub-system are respectively led out from the input shaft separately. The travelling drive sub-system is connected to the input shaft via a main clutch, and is composed of a multi-stage speed-changer having a plurality of speed-changer clutches. The PTO drive sub-system is connected to the input shaft via a PTO clutch that is different from the main clutch, and at the rear portion of the PTO drive sub-system is provided a power transmission switching apparatus which can selectively transmit power to a plurality of PTO shafts.

Abstract: In a hydraulic system loaded on a working vehicle, an oil pump is fixedly secured to a casing block of a transmission system disposed on a vehicle body as separated from an engine, an input shaft of this oil pump is drivably coupled to an input shaft of the aforementioned transmission system, and a clutch is interposed between the input shaft and a transmission mechanism of the transmission system. Preferably, a control valve is fixedly secured to the oil pump, and a delivery port of the oil pump is directly coupled to an inlet of the control valve. Furthermore, so improved structures of a hydraulic switching valve adapted to be disposed on an outlet side of the control valve is proposed.

Abstract: An elevating apparatus for a working vehicle includes separate front lifting and rear lifting mechanisms that can be elevated by hydraulic cylinders, a feedback rod arranged between a link arm of one of the lifting mechanisms and a hydraulic pressure control apparatus for controlling the hydraulic cylinders. A change-over lever selects the front lifting mechanism or the rear lifting mechanism, and an elevating lever controls elevation of the lifting mechanisms. When one of the lifting mechanisms is selected and elevated by operation of the change-over lever, the elevating lever is operated normally without causing abutment between an adjuster member attached to the feedback rod that is interactive with the elevating lever, and an interactive member of the elevating lever. A return mechanism between the change-over lever and the elevating lever enables the elevating lever to be returned to the neutral position when selecting one of the front and rear lifting mechanisms.