Abstract: Reduction in impedance in a lead connected to a semiconductor element is achieved while achieving anchor effect. The semiconductor device includes a heatsink, a semiconductor element, a lead disposed on an upper side of the heatsink, and a molding material formed to cover the lead, the heatsink, and the semiconductor element. Formed on an edge portion of a lower surface in a position, in the heatsink, overlapping with the lead in a plan view is a first convex portion protruding more than an edge portion of an upper surface in the position, and formed on an edge portion of an upper surface in a position, in the heatsink, which does not overlap with the lead in a plan view is a second convex portion protruding more than an edge portion of a lower surface in the position.

Abstract: Reduction in impedance in a lead connected to a semiconductor element is achieved while achieving anchor effect. The semiconductor device includes a heatsink, a semiconductor element, a lead disposed on an upper side of the heatsink, and a molding material formed to cover the lead, the heatsink, and the semiconductor element. Formed on an edge portion of a lower surface in a position, in the heatsink, overlapping with the lead in a plan view is a first convex portion protruding more than an edge portion of an upper surface in the position, and formed on an edge portion of an upper surface in a position, in the heatsink, which does not overlap with the lead in a plan view is a second convex portion protruding more than an edge portion of a lower surface in the position.

Abstract: A comparator 13 that detects the difference between a high frequency signal detected by a detector 12 and a feedback signal A output from a comparator 11; a comparator 14 that detects the difference between the difference detected by the comparator 13 and a feedback signal B output from an adder 18; and a loop filter 15 that passes only a prescribed low frequency band of the output signal of the comparator 14 are provided, in which an amplitude sensitivity adjuster 16 adjusts the amplitude sensitivity of a variable gain amplifier 3 in accordance with the rate of change of the signal passing through the loop filter 15, thereby controlling the gain of the variable gain amplifier 3.

Abstract: A semiconductor device includes a power amplifier for amplifying RF signals in multiple frequency bands, an output matching circuit connected to an output of the power amplifier, a first capacitor connected at a first end to an output of the output matching circuit, multiple output paths, a switch connected to a second end of the first capacitor and directing each of the RF signals to a respective one of the output paths in accordance with frequency band of the each of the RF signals, and multiple second capacitors. Each second capacitor is connected in series to a respective one of the output paths. The switch and either the first capacitor or the second capacitors, or both the first and second capacitors, are integrated as a single monolithic microwave integrated circuit.

Abstract: A comparator 13 that detects the difference between a high frequency signal detected by a detector 12 and a feedback signal A output from a comparator 11; a comparator 14 that detects the difference between the difference detected by the comparator 13 and a feedback signal B output from an adder 18; and a loop filter 15 that passes only a prescribed low frequency band of the output signal of the comparator 14 are provided, in which an amplitude sensitivity adjuster 16 adjusts the amplitude sensitivity of a variable gain amplifier 3 in accordance with the rate of change of the signal passing through the loop filter 15, thereby controlling the gain of the variable gain amplifier 3.

Abstract: A semiconductor device includes a power amplifier for amplifying RF signals in multiple frequency bands, an output matching circuit connected to an output of the power amplifier, a first capacitor connected at a first end to an output of the output matching circuit, multiple output paths, a switch connected to a second end of the first capacitor and directing each of the RF signals to a respective one of the output paths in accordance with frequency band of the each of the RF signals, and multiple second capacitors. Each second capacitor is connected in series to a respective one of the output paths. The switch and either the first capacitor or the second capacitors, or both the first and second capacitors, are integrated as a single monolithic microwave integrated circuit.

Abstract: A high-frequency amplifier is configured in such a manner that a detecting diode 4 and an NPN bipolar transistor 11 of a bias circuit 5 are biased by a common power supply, and that when the amplitude of an envelope signal increases, the bias current supplied from the NPN bipolar transistor 11 to an amplifying element 15 is suppressed following the amplitude of the envelope signal.