Abstract: A problem to be solved is to provide a packaging method suitable for transporting a cellulosic polymer, and another problem to be solved is to provide a packaging method suitable for transportation while suppressing the viscosity reduction of the cellulosic polymer. The cellulosic polymer is packaged so as to meet the following conditions (1), (2), and (3): (1) the packaging bag having a gas barrier property is filled with a cellulosic polymer; (2) an oxygen concentration in the packaging bag is adjusted to 0.8% or less and the packaging bag was sealed; and (3) when the packaging bag filled with the cellulosic polymer is placed such that the longest long side L is horizontal, the depth D of the packaging bag from the horizontal plane and the long side L satisfy the relational expression of 6.1?L/D?10.

Abstract: High frequency electrical discharge or nonpolar discharge using microwaves is generated in a gas that is introduced into a gas duct formed by a dielectric material, such as glass or ceramic. Surface treatment is applied to the components, which are under atmospheric pressure, by exposing them to the gas flow containing the active species generated by the above mentioned electrical discharge. Components are soldered before, during, or after the application of this surface treatment. The surface of the components is exposed to the active species by either directly exposing the components to the electrical discharge, or by blasting the reactive gas flow containing the active species at them. By selecting an appropriate gas for generating the active species, it is possible to improve the wettability of the surface of the component to be soldered, or to remove the organic substances or the oxide film.

Abstract: High frequency electrical discharge or nonpolar discharge using microwaves is generated in a gas that is introduced into a gas duct formed by a dielectric material, such as glass or ceramic. Surface treatment is applied to components, which are under atmospheric pressure, by exposing them to the gas flow containing the active species generated by the above mentioned electrical discharge. The components are soldered before, during, or after the application of this surface treatment. The surface of the components is exposed to the active species by either directly exposing the components to the electrical discharge, or by directing the reactive gas flow containing the active species at the component surfaces. By selecting an appropriate gas for generating the active species, it is possible to improve the wettability of the surface of the component to be soldered, or to remove organic substances or oxide film surfaces.