Abstract: An image recording device including a cutter cover, the image recording device including: a transport unit configured to transport a medium along a transport path; a recording unit configured to record an image on the transported medium; and a cutting unit provided downstream of the recording unit in a transport direction of the medium, the cutting unit being configured to cut the transported medium. The cutting unit includes: a first cutter configured to cut the medium while moving in a scanning direction intersecting the transport direction; a second cutter opposed to the first cutter; a cutter carriage at which the first cutter is mounted, the cutter carriage being configured to move the first cutter in the scanning direction; and a protruding portion provided in an upper portion of the cutter carriage and protruding upward. A first slit extending internally along the scanning direction is formed in the upper portion of the cutter cover.

Abstract: A recording device includes: a recording unit configured to perform recording on a medium transported from upstream in a transport direction toward downstream; a cutting unit configured to cut the medium on which recording is performed by the recording unit; a discharging unit configured to transport, to the downstream in the transport direction, the medium on which recording is performed by the recording unit and the medium cut by the cutting unit; and a removing unit configured to remove paper dust generated when the medium is cut by the cutting unit.

Abstract: In the step of manufacturing a photomask, an opaque pattern is formed by using a photosensitive resin composition containing a specified light absorbent, which then used to manufacture a photomask for KrF excimer laser lithography in a short manufacturing time and at a reduced cost. Accordingly, the manufacturing time and the cost for semiconductor integrated circuit devices is reduced.

Abstract: The reliability of a photomask is improved. The planar shape of a mask substrate 1 of a resist shading mask having a shading pattern composed of a resist film is made circular.

Abstract: In the step of manufacturing a photomask, an opaque pattern is formed by using a photosensitive resin composition containing a specified light absorbent, which then used to manufacture a photomask for KrF excimer laser lithography in a short manufacturing time and at a reduced cost. Accordingly, the manufacturing time and the cost for semiconductor integrated circuit devices is reduced.

Abstract: The reliability of a photomask is improved. The planar shape of a mask substrate 1 of a resist shading mask having a shading pattern composed of a resist film is made circular.